HEAT-RESISTANT POLYMER FILM LAMINATE AND METHOD FOR PRODUCING HEAT-RESISTANT POLYMER FILM LAMINATE

    公开(公告)号:US20220143964A1

    公开(公告)日:2022-05-12

    申请号:US17434405

    申请日:2020-03-30

    Abstract: The present invention enables the achievement of a laminate of heat-resistant polymer films, which does not use a bonding material having inferior heat resistance. According to the present invention, a polyvalent amine compound serving as a reactive compound is applied to heat-resistant polymer films such as PET, PEN or PI films, and the resulting polymer films are superposed upon each other and subsequently subjected to a heat treatment under predetermined conditions, thereby obtaining a laminate of heat-resistant polymer films. Since the thus-obtained laminate does not use a bonding material, the heat resistance is not decreased and the film properties before lamination are not deteriorated. Since the process for obtaining this laminate has excellent productivity, this laminate is useful as a low-cost thick heat-resistant polymer film or sheet of high performance.

    POLYIMIDE FILM LAYERED BODY
    7.
    发明申请

    公开(公告)号:US20190134963A1

    公开(公告)日:2019-05-09

    申请号:US16096490

    申请日:2017-04-24

    Abstract: A laminate mainly made of polyimide with low thermal expansion, high mechanical strength, and high heat resistance, and a method for manufacturing the same are provided. A surface of a polyimide film is activated and then treated by a silane coupling agent. Subsequently, the obtained silane coupling agent-treated polyimide films are superimposed, and pressure and heat are applied to the superimposed polyimide films so as to manufacture a polyimide film laminate. The obtained polyimide film laminate has a cross-sectional structure of superimposing polyimide film layers and silane coupling agent condensate layer(s) alternately to each other. Adhesive strength between the polyimide films of the polyimide film laminate of the present invention does not change largely from initial adhesive strength even after heat treatment at 400° C. for 15 minutes. Further, the polyimide film laminate exhibits a high bending elastic modulus and impact resistance.

    LAMINATE
    9.
    发明公开
    LAMINATE 审中-公开

    公开(公告)号:US20240336033A1

    公开(公告)日:2024-10-10

    申请号:US18571852

    申请日:2022-07-22

    Abstract: Provided is a laminate that has excellent long-term heat resistance even when an inorganic substrate having a high surface roughness is used. This laminate is characterized by having an inorganic substrate, a silane coupling agent layer, and a heat-resistant polymer film in this order, and satisfying the following (A)-(C). (A) The peel strength F0 of the laminate, as measured by a 90° peeling method, is 1.0-20 N/cm. (B) In the surface of the inorganic substrate after peeling the heat-resistant polymer film from the laminate at 90°, the area of a peeled portion on the boundary surface between the inorganic substrate and the silane coupling agent layer is at most 20% of the entire peeled surface. (C) The peel strength F1 of the laminate, as measured by the 90° peeling method after heating in a nitrogen atmosphere at 350° C. for 500 hours, is greater than F0.

    LAMINATE
    10.
    发明公开
    LAMINATE 审中-公开

    公开(公告)号:US20240246319A1

    公开(公告)日:2024-07-25

    申请号:US18566488

    申请日:2022-07-14

    CPC classification number: B32B15/08 B32B7/12 B32B2307/7376 B32B2457/12

    Abstract: Provided is a laminate that has excellent long-term heat resistance even when a metal substrate having a high surface roughness is used. A heat-resistant polymer film, an adhesive layer, and a metal substrate are layered in this order in the laminate. The laminate is characterized in that the adhesive layer is a silane coupling agent-derived adhesive layer and/or a silicone-derived adhesive layer, the adhesive strength F0 of the laminate prior to long-term heat resistance testing according to the 90 degree peel method is 0.05 N/cm to 20 N/cm inclusive, and the adhesive strength Ft of the laminate after long-term heat resistance testing according to the 90 degree peel method is larger than F0.

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