公开(公告)号：US20240075718A1

公开(公告)日：2024-03-07

申请号：US18263100

申请日：2022-06-09

Applicant: TOYOBO CO., LTD.

Inventor： Kaya TOKUDA ,  Satoshi MAEDA ,  Tetsuo OKUYAMA ,  Harumi YONEMUSHI ,  Denichirou MIZUGUCHI

IPC: B32B27/08 ,  B32B3/30 ,  B32B7/06 ,  B32B17/10 ,  B32B27/16 ,  B32B27/28 ,  B32B27/36

CPC classification number: B32B27/08 ,  B32B3/30 ,  B32B7/06 ,  B32B17/10 ,  B32B27/16 ,  B32B27/281 ,  B32B27/36 ,  B32B2255/10 ,  B32B2255/26 ,  B32B2307/306 ,  B32B2307/748

Abstract: The invention provides a laminate having a protective film release auxiliary tape and comprising a rigid temporary support body (inorganic substrate) and a polymer film provided with a protective film. The laminate is configured such that the protective film can be peeled from the polymer film without separating the polymer film from the temporary support body. The laminate comprises an inorganic substrate, a heat-resistant polymer film, a protective film, and a protective film release auxiliary tape in this order. The adhesion strength F1 according to a 90 degree peeling method between the inorganic substrate and the heat-resistant polymer film, the adhesion strength F2 according to a 90 degree peeling method between the heat-resistant polymer film and the protective film, and the adhesion strength F3 according to a 90 degree peeling method between the protective film and the protective film release auxiliary tape satisfy the relationship F3>F1>F2.

公开(公告)号：US20250019508A1

公开(公告)日：2025-01-16

申请号：US18894138

申请日：2024-09-24

Applicant: TOYOBO CO., LTD.

Inventor： Kaya TOKUDA ,  Tetsuo OKUYAMA ,  Naoki WATANABE ,  Hiroyuki WAKUI ,  Harumi YONEMUSHI ,  Denichirou MIZUGUCHI

IPC: B29C71/02

Abstract: Provided is a layered body including glass and a polyamic acid heat-cured product that is readily releasable from an inorganic substrate after being heated at 250° C. A layered body including an inorganic substrate and a polyamic acid heat-cured product, the layered body being characterized by a weight average molecular weight of 30,000 or greater for the polyamic acid, and a peel strength of 0.3 N/cm or weaker between the polyamic acid heat-cured product layer and the inorganic substrate, after the layered body has been heated at 250° C.

公开(公告)号：US20240116274A1

公开(公告)日：2024-04-11

申请号：US18263953

申请日：2022-02-22

Applicant: TOYOBO CO., LTD.

Inventor： Kaya TOKUDA ,  Satoshi MAEDA ,  Tetsuo OKUYAMA ,  Naoki WATANABE

IPC: B32B17/10 ,  B32B7/12 ,  B32B27/08 ,  B32B27/28 ,  B32B27/32 ,  B32B27/36

CPC classification number: B32B17/10 ,  B32B7/12 ,  B32B27/08 ,  B32B27/281 ,  B32B27/32 ,  B32B27/36 ,  B32B2307/538 ,  B32B2457/00

Abstract: An inorganic substrate/polymer film laminate with an attached protective film that allows for easy individual removal even when stored in a stacked state for a long period of time is provided. A first laminate is characterized by including an inorganic substrate, a polymer film layer and a first protective film, in that order, wherein the surface roughness Ra of the surface of the inorganic substrate opposite of the polymer film layer is 0.02-1.2 μm.

公开(公告)号：US20220274314A1

公开(公告)日：2022-09-01

申请号：US17632159

申请日：2020-06-18

Applicant: TOYOBO CO., LTD.

Inventor： Tetsuo OKUYAMA ,  Kaya TOKUDA ,  Kazuyuki OUYA ,  Naoki WATANABE

IPC: B29C63/02 ,  B29C65/48 ,  B29C71/00

Abstract: This apparatus for manufacturing a laminate comprises: a first sheet transporting device for transporting a first sheet; a water supply device for supplying an aqueous medium to the surface of the first sheet coated with a silane coupling agent and/or the surface of a second sheet coated with a silane coupling agent; and a laminating device for attaching the first sheet and the second sheet which have been supplied with the aqueous medium.

公开(公告)号：US20220143964A1

公开(公告)日：2022-05-12

申请号：US17434405

申请日：2020-03-30

Applicant: TOYOBO CO., LTD.

Inventor： Masahiro YAMASHITA ,  Kaya TOKUDA ,  Tetsuo OKUYAMA

IPC: B32B37/00 ,  B32B37/12 ,  B32B37/20 ,  B32B37/06 ,  B65H23/195

Abstract: The present invention enables the achievement of a laminate of heat-resistant polymer films, which does not use a bonding material having inferior heat resistance. According to the present invention, a polyvalent amine compound serving as a reactive compound is applied to heat-resistant polymer films such as PET, PEN or PI films, and the resulting polymer films are superposed upon each other and subsequently subjected to a heat treatment under predetermined conditions, thereby obtaining a laminate of heat-resistant polymer films. Since the thus-obtained laminate does not use a bonding material, the heat resistance is not decreased and the film properties before lamination are not deteriorated. Since the process for obtaining this laminate has excellent productivity, this laminate is useful as a low-cost thick heat-resistant polymer film or sheet of high performance.

公开(公告)号：US20240227363A1

公开(公告)日：2024-07-11

申请号：US18558962

申请日：2022-07-07

Applicant: TOYOBO CO., LTD.

Inventor： Kaya TOKUDA ,  Tetsuo OKUYAMA ,  Satoshi MAEDA ,  Harumi YONEMUSHI ,  Denichirou MIZUGUCHI

IPC: B32B17/10 ,  B32B27/28 ,  B32B27/34

CPC classification number: B32B17/10 ,  B32B27/281 ,  B32B27/34 ,  B32B2250/02 ,  B32B2255/26 ,  B32B2307/306 ,  B32B2307/308 ,  B32B2307/4026 ,  B32B2307/412 ,  B32B2307/54 ,  B32B2307/542 ,  B32B2377/00 ,  B32B2379/08

Abstract: Provided is an inorganic substrate/heat-resistant polymer film laminate in which vibration during handling is suppressed. A laminate of a heat-resistant polymer film and an inorganic substrate that uses substantially no adhesive is characterized by that a shear peel strength between the heat-resistant polymer film and the inorganic substrate is 0.8 MPa or more and a tensile modulus of the heat-resistant polymer film is 4-9 GPa.

公开(公告)号：US20230271367A1

公开(公告)日：2023-08-31

申请号：US18005934

申请日：2021-07-30

Applicant: TOYOBO CO., LTD.

Inventor： Tetsuo OKUYAMA ,  Kazuyuki OUYA ,  Kaya TOKUDA

IPC: B29C48/21 ,  B29C48/00

CPC classification number: B29C48/21 ,  B29C48/022 ,  B29K2079/08

Abstract: Provided is a laminate that is useful as a temporary support for producing a large-area, high-definition, flexible electronic device, the laminate having stably low adhesive strength between a heat-resistant polymer film and an inorganic substrate even in the case of a large surface area, and having few blister defects. This laminate has an inorganic substrate, a silane coupling agent layer that includes amino groups, and a heat-resistant polymer film in the stated order, the laminate being characterized in that the elemental nitrogen component ratio in an inorganic-substrate-side peel surface after the heat-resistant polymer film has been peeled from the inorganic substrate at 90° is greater than 3.5 at % and no greater than 11 at %.

公开(公告)号：US20230150252A1

公开(公告)日：2023-05-18

申请号：US17996745

申请日：2021-06-09

Applicant: TOYOBO CO., LTD.

Inventor： Kaya TOKUDA ,  Tetsuo OKUYAMA ,  Satoshi MAEDA ,  Naoki WATANABE ,  Harumi YONEMUSHI ,  Denichirou MIZUGUCHI

IPC: B32B37/02 ,  B32B7/022 ,  B32B9/04 ,  B32B27/28 ,  B32B38/10

CPC classification number: B32B37/02 ,  B32B7/022 ,  B32B9/045 ,  B32B27/281 ,  B32B38/10 ,  B32B2307/306 ,  B32B2307/538 ,  B32B2037/0092

Abstract: The invention provides a multilayer body of an inorganic substrate and a highly heat-resistant film, wherein the surface of the inorganic substrate is sufficiently smooth after removal of the highly heat-resistant film from the multilayer body, and the inorganic substrate is re-usable. The multilayer body uses substantially no adhesive and is characterized by (1) a tensile elastic modulus of the highly heat-resistant film of 4 GPa or more, (2) a bonding strength between the highly heat-resistant film and the inorganic substrate of 0.3 N/cm or less, (3) a surface roughness Ra of a surface of the highly heat-resistant film, said surface being in contact with the inorganic substrate, of 5 nm or less, and (4) a surface roughness Ra of the surface of the inorganic substrate after removal of the highly heat-resistant film from the multilayer body of 3 nm or less.

公开(公告)号：US20210308987A1

公开(公告)日：2021-10-07

申请号：US17268947

申请日：2019-08-07

Applicant: TOYOBO CO., LTD.

Inventor： Tetsuo OKUYAMA ,  Miyuki HAYASHI ,  Shunsuke ICHIMURA ,  Kaya TOKUDA ,  Masahiro YAMASHITA

IPC: B32B7/12 ,  B32B7/06 ,  B32B7/027 ,  B32B17/10

Abstract: A laminate comprising a heat-resistant polymer film, an inorganic substrate, and a polyamine compound layer formed using a polyamine compound, wherein the polyamine compound layer is formed between the heat-resistant polymer film and the inorganic substrate.

公开(公告)号：US20240336033A1

公开(公告)日：2024-10-10

申请号：US18571852

申请日：2022-07-22

Applicant: TOYOBO CO., LTD.

Inventor： Kaya TOKUDA ,  Tetsuo OKUYAMA ,  Keisuke MATSUO

IPC: B32B15/08 ,  B32B7/12 ,  B32B37/10

CPC classification number: B32B15/08 ,  B32B7/12 ,  B32B37/10 ,  B32B2307/306 ,  B32B2379/08 ,  B32B2457/12

Abstract: Provided is a laminate that has excellent long-term heat resistance even when an inorganic substrate having a high surface roughness is used. This laminate is characterized by having an inorganic substrate, a silane coupling agent layer, and a heat-resistant polymer film in this order, and satisfying the following (A)-(C). (A) The peel strength F0 of the laminate, as measured by a 90° peeling method, is 1.0-20 N/cm. (B) In the surface of the inorganic substrate after peeling the heat-resistant polymer film from the laminate at 90°, the area of a peeled portion on the boundary surface between the inorganic substrate and the silane coupling agent layer is at most 20% of the entire peeled surface. (C) The peel strength F1 of the laminate, as measured by the 90° peeling method after heating in a nitrogen atmosphere at 350° C. for 500 hours, is greater than F0.