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公开(公告)号:US20240096774A1
公开(公告)日:2024-03-21
申请号:US18262986
申请日:2021-11-11
Applicant: TOYOBO CO., LTD.
Inventor: Tetsuo OKUYAMA , Keisuke MATSUO
IPC: H01L23/498 , H01L21/48 , H05K1/02 , H05K1/11 , H05K3/46
CPC classification number: H01L23/49822 , H01L21/4857 , H05K1/0298 , H05K1/115 , H05K3/4644 , H05K2201/0154 , H05K2201/09563
Abstract: This method for producing a layered body includes: a step A for preparing a first layered body by layering a first resin film and a patterned metal layer; a step B for preparing a second resin film having indentations corresponding to the metal layer pattern; and a step C for mating the metal layer pattern and the indentations in the second resin film and bonding together the first layered body and second resin film.
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公开(公告)号:US20240278537A1
公开(公告)日:2024-08-22
申请号:US18569909
申请日:2022-07-14
Applicant: TOYOBO CO., LTD.
Inventor: Tetsuo OKUYAMA , Keisuke MATSUO
CPC classification number: B32B15/08 , B32B7/12 , B32B15/18 , B32B15/20 , B32B27/281 , C09J11/06 , C09J185/00 , B32B2250/02 , B32B2255/06 , B32B2255/10 , B32B2255/26 , B32B2307/306 , B32B2307/538 , B32B2307/748
Abstract: The invention provides a laminate roll having excellent long-term heat resistance even when a metal substrate having a high surface roughness is used. In particular the invention provides a laminate roll in which a heat-resistant polymer film, an adhesive layer, and a metal substrate are laminated in this order, said laminate roll being characterized in that: the adhesive layer is derived from a silane coupling agent and/or derived from silicone; the adhesive strength FO of the laminate roll as measured by a 90-degree peel method before a long-term heat resistance test is 0.05-20 N/cm inclusive; and the adhesive strength Ft of the laminate roll as measured by the 90-degree peel method after the long-term heat resistance test is higher than the adhesive strength FO, wherein, for the long-term heat resistance test, the laminate roll is left to stand and stored in a nitrogen atmosphere at 350° C. for 500 hours.
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公开(公告)号:US20240336033A1
公开(公告)日:2024-10-10
申请号:US18571852
申请日:2022-07-22
Applicant: TOYOBO CO., LTD.
Inventor: Kaya TOKUDA , Tetsuo OKUYAMA , Keisuke MATSUO
CPC classification number: B32B15/08 , B32B7/12 , B32B37/10 , B32B2307/306 , B32B2379/08 , B32B2457/12
Abstract: Provided is a laminate that has excellent long-term heat resistance even when an inorganic substrate having a high surface roughness is used. This laminate is characterized by having an inorganic substrate, a silane coupling agent layer, and a heat-resistant polymer film in this order, and satisfying the following (A)-(C). (A) The peel strength F0 of the laminate, as measured by a 90° peeling method, is 1.0-20 N/cm. (B) In the surface of the inorganic substrate after peeling the heat-resistant polymer film from the laminate at 90°, the area of a peeled portion on the boundary surface between the inorganic substrate and the silane coupling agent layer is at most 20% of the entire peeled surface. (C) The peel strength F1 of the laminate, as measured by the 90° peeling method after heating in a nitrogen atmosphere at 350° C. for 500 hours, is greater than F0.
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公开(公告)号:US20240246319A1
公开(公告)日:2024-07-25
申请号:US18566488
申请日:2022-07-14
Applicant: TOYOBO CO., LTD.
Inventor: Keisuke MATSUO , Tetsuo OKUYAMA
CPC classification number: B32B15/08 , B32B7/12 , B32B2307/7376 , B32B2457/12
Abstract: Provided is a laminate that has excellent long-term heat resistance even when a metal substrate having a high surface roughness is used. A heat-resistant polymer film, an adhesive layer, and a metal substrate are layered in this order in the laminate. The laminate is characterized in that the adhesive layer is a silane coupling agent-derived adhesive layer and/or a silicone-derived adhesive layer, the adhesive strength F0 of the laminate prior to long-term heat resistance testing according to the 90 degree peel method is 0.05 N/cm to 20 N/cm inclusive, and the adhesive strength Ft of the laminate after long-term heat resistance testing according to the 90 degree peel method is larger than F0.
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