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公开(公告)号：US20200180888A1
公开(公告)日：2020-06-11
申请号：US16631957
申请日：2018-07-13
Applicant: TOYOBO CO., LTD.
Inventor： Kaya TOKUDA , Masahiro YAMASHITA , Tetsuo OKUYAMA , Toshiyuki TSUCHIYA , Naoki WATANABE , Shunsuke ICHIMURA
Abstract: The purpose of the present invention is to provide a storage state in which a reactive compound layer can be stably maintained in a polymer film having a reactive compound layer on the surface. The film roll is obtained by winding together: a first polymer film having a reactive compound layer on the surface, and a second polymer film having a surface roughness (Ra) of 0.1 μm or more and a modulus of elasticity of 300 MPa or more and 10 GPa or less. The film bundle is obtained by laminating the first and second polymer films. Preferably, storing the film roll and the film bundle at a low temperature enables a thin layer of a reactive compound to be stably maintained.
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Patent Agency Ranking
公开(公告)号：US20210308987A1
公开(公告)日：2021-10-07
申请号：US17268947
申请日：2019-08-07
Applicant: TOYOBO CO., LTD.
Inventor： Tetsuo OKUYAMA , Miyuki HAYASHI , Shunsuke ICHIMURA , Kaya TOKUDA , Masahiro YAMASHITA
Abstract: A laminate comprising a heat-resistant polymer film, an inorganic substrate, and a polyamine compound layer formed using a polyamine compound, wherein the polyamine compound layer is formed between the heat-resistant polymer film and the inorganic substrate.
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3.发明申请公开(公告)号：US20220143964A1
公开(公告)日：2022-05-12
申请号：US17434405
申请日：2020-03-30
Applicant: TOYOBO CO., LTD.
Inventor： Masahiro YAMASHITA , Kaya TOKUDA , Tetsuo OKUYAMA
IPC: B32B37/00 , B32B37/12 , B32B37/20 , B32B37/06 , B65H23/195
Abstract: The present invention enables the achievement of a laminate of heat-resistant polymer films, which does not use a bonding material having inferior heat resistance. According to the present invention, a polyvalent amine compound serving as a reactive compound is applied to heat-resistant polymer films such as PET, PEN or PI films, and the resulting polymer films are superposed upon each other and subsequently subjected to a heat treatment under predetermined conditions, thereby obtaining a laminate of heat-resistant polymer films. Since the thus-obtained laminate does not use a bonding material, the heat resistance is not decreased and the film properties before lamination are not deteriorated. Since the process for obtaining this laminate has excellent productivity, this laminate is useful as a low-cost thick heat-resistant polymer film or sheet of high performance.
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公开(公告)号：US20190134963A1
公开(公告)日：2019-05-09
申请号：US16096490
申请日：2017-04-24
Applicant: TOYOBO CO., LTD.
Inventor： Shota HARA , Toshiyuki TSUCHIYA , Masahiro YAMASHITA , Tetsuo OKUYAMA , Naoki WATANABE
IPC: B32B27/28 , B32B7/12 , C08L79/08 , C08K5/5419
Abstract: A laminate mainly made of polyimide with low thermal expansion, high mechanical strength, and high heat resistance, and a method for manufacturing the same are provided. A surface of a polyimide film is activated and then treated by a silane coupling agent. Subsequently, the obtained silane coupling agent-treated polyimide films are superimposed, and pressure and heat are applied to the superimposed polyimide films so as to manufacture a polyimide film laminate. The obtained polyimide film laminate has a cross-sectional structure of superimposing polyimide film layers and silane coupling agent condensate layer(s) alternately to each other. Adhesive strength between the polyimide films of the polyimide film laminate of the present invention does not change largely from initial adhesive strength even after heat treatment at 400° C. for 15 minutes. Further, the polyimide film laminate exhibits a high bending elastic modulus and impact resistance.
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公开(公告)号：US20210122143A1
公开(公告)日：2021-04-29
申请号：US16617444
申请日：2018-05-24
Applicant: TOYOBO CO., LTD.
Inventor： Masahiro YAMASHITA , Tetsuo OKUYAMA , Toshiyuki TSUCHIYA , Naoki WATANABE , Kaya TOKUDA , Shota HARA
Abstract: The invention provides a laminate including a polyimide film and an inorganic substrate, which has a number density of blisters including carbide particles therein of 50/m2 or less, an average height of blisters of 2 μm or less, a product of the number density of the blisters (blisters/m2) and the average height of the blisters (μm) of 20 or less. The inventive laminate can be obtained by laminating the polyimide film and the inorganic substrate after sufficiently purifying and cleaning to remove foreign bodies made of inorganic substance therefrom, followed by heat treating the laminate at a temperature of 350-600° C. and then rapidly cooling it to carbonize and reduce the organic foreign bodies, and also to rapidly cool the gas contained in the blisters, which leads to reduced height of blisters.
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公开(公告)号：US20200180259A1
公开(公告)日：2020-06-11
申请号：US16479825
申请日：2018-01-23
Applicant: TOYOBO CO., LTD.
Inventor： Tetsuo OKUYAMA , Naoki WATANABE , Toshiyuki TSUCHIYA , Masahiro YAMASHITA , Kaya TOKUDA
Abstract: [Problem] To provide a polyimide film laminated substrate in which stable peeling with a constant low force from an inorganic substrate is enabled when a polyimide film is to be peeled from an inorganic substrate even after heat treatment at a temperature exceeding 500° C. is performed.[Solution] Silane coupling agent treatment is performed on an inorganic substrate on which a thin film of an aluminum oxide, a thin film of a composite oxide of aluminum and silicon, a thin film of molybdenum or tungsten, or an alloy thin film of molybdenum and tungsten is formed continuously or discontinuously on a part of at least one surface thereof, and a polyimide film layer is further laminated on the silane coupling agent layer. In the obtained laminate, the part where the aluminum oxide thin film layer is present functions as an easily-peelable layer, the part where no aluminum oxide thin film layer functions as an easily-bondable part. The bonding strength of the easily-peelable part does not change even after heat treatment at 500° C. or more, and the low value is stably maintained.
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