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公开(公告)号:US10163609B2
公开(公告)日:2018-12-25
申请号:US15475196
申请日:2017-03-31
Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Inventor: Tsung-Min Lin , Ming-Hsing Li , Fang-Chi Chien , Chao-Li Shih , Hong-Hsing Chou
IPC: H01J37/00 , H01J37/32 , H01L21/265
Abstract: An ion implanter comprises a dissociation chamber in the ion implanter. The dissociation chamber has an input port for receiving a gas and an output port for outputting ions. A vacuum chamber surrounds the dissociation chamber. A plurality of rods or plates of magnetic material are located adjacent to the dissociation chamber on at least two sides of the dissociation chamber. A magnet is magnetically coupled to the plurality of rods or plates of magnetic material. A microwave source is provided for supplying microwaves to the dissociation chamber, so as to cause electron cyclotron resonance in the dissociation chamber to ionize the gas.
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公开(公告)号:US11295926B2
公开(公告)日:2022-04-05
申请号:US16698072
申请日:2019-11-27
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Ching-Heng Yen , Jen-Chung Chiu , Tai-Kun Kao , Lu-Hsun Lin , Tsung-Min Lin
IPC: H01J37/08 , H01J37/32 , H01J37/317
Abstract: The current disclosure is directed to a repellent electrode used in a source arc chamber of an ion implanter. The repellent electrode includes a shaft and a repellent body having a repellent surface. The repellent surface has a surface shape that substantially fits the shape of the inner chamber space of the source arc chamber where the repellent body is positioned. A gap between the edge of the repellent body and the inner sidewall of the source arc chamber is minimized to a threshold level that is maintained to avoid a short between the conductive repellent body and the conductive inner sidewall of the source arc chamber.
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公开(公告)号:US11764042B2
公开(公告)日:2023-09-19
申请号:US17701538
申请日:2022-03-22
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Tsung-Min Lin , Fang-Chi Chien , Cheng-Yi Huang , Chao-Po Lu
IPC: H01J37/32 , H01J37/18 , H01J37/31 , H01J37/317
CPC classification number: H01J37/32743 , H01J37/18 , H01J37/32412 , H01J37/3171
Abstract: A method and apparatus for dosage measurement and monitoring in an ion implantation system is disclosed. In one embodiment, a transferring system, includes: a vacuum chamber, wherein the vacuum chamber is coupled to a processing chamber; a shaft coupled to a ball screw, wherein the ball screw and the shaft are configured in the vacuum chamber; and a vacuum rotary feedthrough, wherein the vacuum rotary feedthrough comprises a magnetic fluid seal so as to provide a high vacuum sealing, and wherein the vacuum rotary feedthrough is configured through a first end of the vacuum chamber and coupled to the ball screw so as to provide a rotary motion on the ball screw.
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公开(公告)号:US11830700B2
公开(公告)日:2023-11-28
申请号:US17693103
申请日:2022-03-11
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Ching-Heng Yen , Jen-Chung Chiu , Tai-Kun Kao , Lu-Hsun Lin , Tsung-Min Lin
IPC: H01J37/08 , H01J37/317 , H01J37/32
CPC classification number: H01J37/08 , H01J37/3171 , H01J37/32541
Abstract: The current disclosure is directed to a repellent electrode used in a source arc chamber of an ion implanter. The repellent electrode includes a shaft and a repellent body having a repellent surface. The repellent surface has a surface shape that substantially fits the shape of the inner chamber space of the source arc chamber where the repellent body is positioned. A gap between the edge of the repellent body and the inner sidewall of the source arc chamber is minimized to a threshold level that is maintained to avoid a short between the conductive repellent body and the conductive inner sidewall of the source arc chamber.
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公开(公告)号:US11289311B2
公开(公告)日:2022-03-29
申请号:US16588152
申请日:2019-09-30
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Tsung-Min Lin , Fang-Chi Chien , Cheng-Yi Huang , Chao-Po Lu
IPC: H01J37/18 , H01J37/32 , H01J37/317
Abstract: A method and apparatus for dosage measurement and monitoring in an ion implantation system is disclosed. In one embodiment, a transferring system, includes: a vacuum chamber, wherein the vacuum chamber is coupled to a processing chamber; a shaft coupled to a ball screw, wherein the ball screw and the shaft are configured in the vacuum chamber; and a vacuum rotary feedthrough, wherein the vacuum rotary feedthrough comprises a magnetic fluid seal so as to provide a high vacuum sealing, and wherein the vacuum rotary feedthrough is configured through a first end of the vacuum chamber and coupled to the ball screw so as to provide a rotary motion on the ball screw.
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公开(公告)号:US20210366690A1
公开(公告)日:2021-11-25
申请号:US16882053
申请日:2020-05-22
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Hom-Chung LIN , Jih-Churng TWU , Yi-Ting CHANG , Chao-Po LU , Tsung-Min Lin
IPC: H01J37/317 , H01J37/08 , H01J37/32
Abstract: An ion implantation system includes an ion implanter containing an ion source unit and a dopant source gas supply system. The system includes a dopant source gas storage tank inside a gas box container located remotely to the ion implanter and a dopant source gas supply pipe configured to supply a dopant source gas from the dopant source gas storage tank to the ion source unit. The dopant source gas supply pipe includes an inner pipe, an outer pipe enclosing the inner pipe, a first pipe adaptor coupled to first end of respective inner and outer pipes, and a second pipe adaptor coupled to seconds end of respective inner and outer pipes opposite the first end. The first pipe adaptor connects the inner pipe to the dopant source gas storage tank and the second pipe adaptor connects the inner pipe to the ion source unit.
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公开(公告)号:US09741537B1
公开(公告)日:2017-08-22
申请号:US15342582
申请日:2016-11-03
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Tai-Kun Kao , Tsung-Min Lin , Jen-Chung Chiu
IPC: H01J37/08 , H01J37/30 , H01J37/317 , H01L21/265
CPC classification number: H01J37/3171 , H01J37/08 , H01J2237/006 , H01L21/26513
Abstract: A method for generating an ion beam in an ion implantation process is provided. The method includes supplying a working gas into a first portion of an arc chamber which is separated from a second portion of the arc chamber by an intermediate plate. The method further includes guiding the working gas into the second portion of the arc chamber via a plurality of gas outlets formed at two opposite edges of the intermediate plate. The method also includes generating an ion beam from the working gas in the second portion of the arc chamber.
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公开(公告)号:US12243707B2
公开(公告)日:2025-03-04
申请号:US18448026
申请日:2023-08-10
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Ching-Heng Yen , Jen-Chung Chiu , Tai-Kun Kao , Lu-Hsun Lin , Tsung-Min Lin
IPC: H01J37/08 , H01J37/317 , H01J37/32
Abstract: The current disclosure is directed to a repellent electrode used in a source arc chamber of an ion implanter. The repellent electrode includes a shaft and a repellent body having a repellent surface. The repellent surface has a surface shape that substantially fits the shape of the inner chamber space of the source arc chamber where the repellent body is positioned. A gap between the edge of the repellent body and the inner sidewall of the source arc chamber is minimized to a threshold level that is maintained to avoid a short between the conductive repellent body and the conductive inner sidewall of the source arc chamber.
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公开(公告)号:US11569062B2
公开(公告)日:2023-01-31
申请号:US16882053
申请日:2020-05-22
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Hom-Chung Lin , Jih-Churng Twu , Yi-Ting Chang , Chao-Po Lu , Tsung-Min Lin
IPC: H01J37/31 , H01J37/317 , H01J37/08 , H01J37/32
Abstract: An ion implantation system includes an ion implanter containing an ion source unit and a dopant source gas supply system. The system includes a dopant source gas storage tank inside a gas box container located remotely to the ion implanter and a dopant source gas supply pipe configured to supply a dopant source gas from the dopant source gas storage tank to the ion source unit. The dopant source gas supply pipe includes an inner pipe, an outer pipe enclosing the inner pipe, a first pipe adaptor coupled to first end of respective inner and outer pipes, and a second pipe adaptor coupled to seconds end of respective inner and outer pipes opposite the first end. The first pipe adaptor connects the inner pipe to the dopant source gas storage tank and the second pipe adaptor connects the inner pipe to the ion source unit.
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公开(公告)号:US10319557B2
公开(公告)日:2019-06-11
申请号:US15692745
申请日:2017-08-31
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Tai-Kun Kao , Tsung-Min Lin , Jen-Chung Chiu , Ren-Dou Lee
IPC: H01J37/08 , H01J37/317 , C01F17/00
Abstract: Ion generators for ion implanters are provided. The ion generator for an ion implanter includes an ion source arc chamber including an arc chamber housing and a thermal electron emitter coupled to the arc chamber housing. In addition, the thermal electron emitter includes a filament and a cathode, and the cathode has a solid top portion made of a work function modified conductive material including tungsten (W) and a work function modification metal.
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