公开(公告)号：US11570889B2

公开(公告)日：2023-01-31

申请号：US17247989

申请日：2021-01-04

Applicant: Tesla, Inc.

Inventor： Mohamed Nasr ,  Aydin Nabovati ,  Jin Zhao

IPC: H05K1/02 ,  H02J1/12 ,  G05F1/10 ,  H05K7/20

Abstract: A high-power Voltage Regulator Module (VRM) includes a housing having side walls, an upper opening, and a lower opening, a VRM circuit board oriented within the housing, a plane of the VRM circuit board oriented in a parallel to at least one of the side walls of the housing, an upper Printed Circuit Board (PCB) coupled to the upper opening of the housing, a lower panel coupled to the lower opening of the housing, a coolant inlet port formed in the lower panel, and a coolant outlet port formed in the lower panel. The high power VRM may include a coolant inlet adapter coupled to the coolant inlet port and a coolant outlet adapter coupled to the coolant outlet port. The coolant inlet adapted and the coolant outlet adapter may provide support for the VRM.

公开(公告)号：US20210127483A1

公开(公告)日：2021-04-29

申请号：US17247989

申请日：2021-01-04

Applicant: Tesla, Inc.

Inventor： Mohamed Nasr ,  Aydin Nabovati ,  Jin Zhao

IPC: H05K1/02 ,  H02J1/12 ,  G05F1/10

Abstract: A high-power Voltage Regulator Module (VRM) includes a housing having side walls, an upper opening, and a lower opening, a VRM circuit board oriented within the housing, a plane of the VRM circuit board oriented in parallel to at least one of the side walls of the housing, an upper Printed Circuit Board (PCB) coupled to the upper opening of the housing, a lower panel coupled to the lower opening of the housing, a coolant inlet port formed in the lower panel, and a coolant outlet port formed in the lower panel. The high power VRM may include a coolant inlet adapter coupled to the coolant inlet port and a coolant outlet adapter coupled to the coolant outlet port. The coolant inlet adapter and the coolant outlet adapter may provide support for the VRM.

公开(公告)号：US20250079358A1

公开(公告)日：2025-03-06

申请号：US18727867

申请日：2023-01-10

Applicant: Tesla, Inc.

Inventor： Abel Misrak ,  Mohamed Nasr ,  Aydin Nabovati ,  Rishabh Bhandari

IPC: H01L23/00 ,  H01L23/473 ,  H01L23/498 ,  H01L25/065

Abstract: Aspects of this disclosure relate to a method of assembly that includes thermally coupling two components. The method includes providing a thermal interface pad between the two components, such as an integrated circuit and a cooling solution. The thermal interface pad can have a star shape, and a pressure is applied to at least one of the two components. The pressure can cause the star shape thermal interface to expand into a rectangular shape. The expanded rectangular shape does not expand into keep out area positioned around an electronic component of the two components.

公开(公告)号：US10887982B2

公开(公告)日：2021-01-05

申请号：US16356037

申请日：2019-03-18

Applicant: Tesla, Inc.

Inventor： Mohamed Nasr ,  Aydin Nabovati ,  Jin Zhao

IPC: H05K7/20 ,  H05K1/02 ,  H02J1/12 ,  G05F1/10

Abstract: A high-power Voltage Regulator Module (VRM) includes a housing having side walls, an upper opening, and a lower opening, a VRM circuit board oriented within the housing, a plane of the VRM circuit board oriented in parallel to at least one of the side walls of the housing, an upper Printed Circuit Board (PCB) coupled to the upper opening of the housing, a lower panel coupled to the lower opening of the housing, a coolant inlet port formed in the lower panel, and a coolant outlet port formed in the lower panel. The high power VRM may include a coolant inlet adapter coupled to the coolant inlet port and a coolant outlet adapter coupled to the coolant outlet port. The coolant inlet adapter and the coolant outlet adapter may provide support for the VRM.

公开(公告)号：US20240234243A1

公开(公告)日：2024-07-11

申请号：US18560325

申请日：2022-05-16

Applicant: Tesla, Inc.

Inventor： Aydin Nabovati ,  Mengzhi Pang ,  Mohamed Nasr

IPC: H01L23/373 ,  H01L21/48 ,  H01L23/00

CPC classification number: H01L23/3735 ,  H01L21/4882 ,  H01L23/3736 ,  H01L23/3737 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/29193 ,  H01L2224/32245 ,  H01L2224/83091 ,  H01L2924/1427 ,  H01L2924/3512

Abstract: Electronic assemblies such as system on a wafer assemblies are disclosed. The assembly can include an electronic component that has a first side, a heat removing structure that is coupled to the first side of the electronic component, and a thermal interface structure that includes a thermal interface layer and an adhesion layer. The electronic component can be a system on a wafer (SoW). The thermal interface layer is positioned between the first side of the electronic component and the heat dissipation structure. The adhesion layer is positioned between the heat removing structure and the thermal interface layer. With the thermal interface structure, the electronic component and the heat removing structure can be attached together with relatively lower pressure.

公开(公告)号：US20190297723A1

公开(公告)日：2019-09-26

申请号：US16356037

申请日：2019-03-18

Applicant: Tesla, Inc.

Inventor： Mohamed Nasr ,  Aydin Nabovati ,  Jin Zhao

IPC: H05K1/02 ,  G05F1/10 ,  H02J1/12

Abstract: A high-power Voltage Regulator Module (VRM) includes a housing having side walls, an upper opening, and a lower opening, a VRM circuit board oriented within the housing, a plane of the VRM circuit board oriented in parallel to at least one of the side walls of the housing, an upper Printed Circuit Board (PCB) coupled to the upper opening of the housing, a lower panel coupled to the lower opening of the housing, a coolant inlet port formed in the lower panel, and a coolant outlet port formed in the lower panel. The high power VRM may include a coolant inlet adapter coupled to the coolant inlet port and a coolant outlet adapter coupled to the coolant outlet port. The coolant inlet adapter and the coolant outlet adapter may provide support for the VRM.