公开(公告)号：US20240357769A1

公开(公告)日：2024-10-24

申请号：US18683408

申请日：2022-08-16

Applicant: Tesla, Inc.

Inventor： Shishuang Sun ,  Ganesh Venkataramanan ,  Yang Sun ,  Jin Zhao ,  Shaowei Deng ,  William Chang ,  Mengzhi Pang ,  Steven Butler ,  William Arthur McGee ,  Aydin Nabovati

IPC: H05K7/20

CPC classification number: H05K7/205

Abstract: The systems, methods, and devices disclosed herein relate to a multi-layer structures arranged in a vertically orientation. In some embodiments, a computing assembly can include a first cooling system, a first electronics layer, a second cooling system, and a second electronics layer. The first cooling system can be disposed on top of and can be in thermal communication with the first electronics layer. The first electronics layer array includes an array of integrated circuit dies that are in electronic communication with each other in a plane that is orthogonal to power delivery. The first electronics layer can be disposed on top of and can be in thermal communication with the second cooling system, and the second cooling system can be disposed on top of and can be in thermal communication with the second electronics layer. The second electronics layer includes an array of power delivery modules. In some embodiments, at least one layer can use system on wafer packaging.