公开(公告)号：US3992686A

公开(公告)日：1976-11-16

申请号：US598592

申请日：1975-07-24

Applicant: Tim W. Canning

Inventor： Tim W. Canning

IPC: H01P3/08 ,  H04B3/52 ,  H05K1/02 ,  H02B1/04

CPC classification number: H01P3/081 ,  H04B3/52 ,  H05K1/0246 ,  H05K1/0231 ,  H05K2201/044 ,  H05K2201/10022

Abstract: A backplane motherboard which mounts a plurality of printed circuit boards and which provides microstrip transmission lines to interconnect the components of an inserted PC board with any of the other inserted PC boards. All transmission lines are terminated at both ends with the characteristic impedance, and the plane of the motherboard is made of a sandwich construction having a ground plane, a Mylar insulating plane, a voltage plane, and outer epoxy surface insulators. The plane sandwich also carries terminal pins for holding additional printed circuit boards.

Abstract translation: 背板母板，其安装多个印刷电路板，并且提供微带传输线以将插入的PC板的组件与任何其它插入的PC板相互连接。 所有传输线在两端以特征阻抗端接，母板的平面由具有接地平面的三明治结构，聚酯薄膜绝缘平面，电压平面和外环氧树脂表面绝缘体制成。 平面三明治还带有用于保持附加印刷电路板的端子引脚。