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公开(公告)号:US20150343755A1
公开(公告)日:2015-12-03
申请号:US14723778
申请日:2015-05-28
Applicant: TOKYO ELECTRON LIMITED
Inventor: Masaru HONDA , Ryoichi SAKAMOTO , Katsuhiro IKEDA
IPC: B32B43/00
CPC classification number: B32B43/006 , B32B2309/16 , B32B2457/14 , Y10T156/1132 , Y10T156/1168 , Y10T156/19 , Y10T156/1944 , Y10T156/1967 , Y10T156/1978 , Y10T156/1989
Abstract: A peeling device which peels a superposed substrate obtained by bonding a first substrate and a second substrate together, from one end portion of the superposed substrate toward the other end portion thereof, includes a first holding unit configured to hold the first substrate of the superposed substrate, a second holding unit configured to hold the second substrate of the superposed substrate, and a moving unit configured to move the first holding unit away from the second holding unit. The moving unit is configured to move in at least a peeling direction of the superposed substrate.
Abstract translation: 一种剥离装置,其将从叠置基板的一个端部朝向其另一个端部粘接第一基板和第二基板而获得的叠置基板剥离,包括:第一保持单元,其被配置为保持叠置基板的第一基板 配置为保持所述叠置基板的所述第二基板的第二保持单元,以及移动单元,其被配置为使所述第一保持单元远离所述第二保持单元移动。 移动单元构造成在叠置基板的至少剥离方向上移动。
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公开(公告)号:US20240402609A1
公开(公告)日:2024-12-05
申请号:US18673751
申请日:2024-05-24
Applicant: Tokyo Electron Limited
Inventor: Kenji IIZUKA , Koji USHIMARU , Kazuhiko OOSHIMA , Kei MIYAZAKI , Yuichi TERASHITA , Yukinobu OTSUKA , Katsuhiro IKEDA , Ryohei FUJISE
Abstract: A developing apparatus for developing a substrate having a coating film of a metal-containing resist formed thereon, includes: a heating part configured to support and heat the substrate; a chamber configured to cover the heating part and form a treatment space above the heating part; a gas supplier to which a developing gas containing acid is supplied; and a dispersion mechanism configured to disperse the developing gas supplied to the gas supplier and discharge the developing gas to the treatment space from a plurality of discharge ports formed at positions above the heating part.
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