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1.发明申请FIXED ARRAY ACFs WITH MULTI-TIER PARTIALLY EMBEDDED PARTICLE MORPHOLOGY AND THEIR MANUFACTURING PROCESSES 有权具有多个部分嵌入颗粒形态的固定阵列ACF及其制造过程公开(公告)号：US20150240130A1
公开(公告)日：2015-08-27
申请号：US14712093
申请日：2015-05-14
Applicant: Trillion Science Inc.
Inventor： Rong-Chang Liang , Jane Sun , Howard Ho Man Chu , Meng-Chun Lee
CPC classification number: C09J9/02 , C08K7/04 , C08K7/16 , C08K2201/001 , C08K2201/005 , C09J7/02 , C09J7/20 , C09J2201/602 , C09J2203/326 , C09J2205/102 , H05K3/323 , Y10T428/24 , Y10T428/24893
Abstract: An ACF comprising a substrate, a layer of an adhesive on the surface of the substrate, the adhesive optionally having conductive particles dispersed therein, at least one tier of conductive particles arranged in a non-random array, the tier being formed by transfer of conductive particles from a carrier belt having a stitching line to the surface of the adhesive layer wherein the portion of the tier corresponding to the stitching line is free of conductive particles, and the adhesive layer being overcoated with a second tier of conductive particles arranged in a non-random array at least in the area of the first tier corresponding to the stitching line. The tiers may be at the same or different depths within the adhesive layer. More than two tiers of conductive particles may be present in the ACF.
Abstract translation: 一种ACF，包括基材，在基材表面上的粘合剂层，粘合剂任选地具有分散在其中的导电颗粒，至少一层导电颗粒以非随机阵列排列，该层通过传导导电 具有缝合线的载体带到粘合剂层的表面的颗粒，其中对应于缝合线的层的部分没有导电颗粒，并且粘合剂层被涂覆有布置在非粘合层中的第二层导电颗粒 至少在对应于缝合线的第一层的区域中的等级阵列。 层可以在粘合剂层内处于相同或不同的深度。 ACF中可能存在两层以上的导电颗粒。
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2.发明授权Fixed array ACFs with multi-tier partially embedded particle morphology and their manufacturing processes 有权具有多层部分嵌入式颗粒形态及其制造工艺的固定阵列ACF公开(公告)号：US09475963B2
公开(公告)日：2016-10-25
申请号：US14712093
申请日：2015-05-14
Applicant: Trillion Science Inc.
Inventor： Rong-Chang Liang , Jane Sun , Howard Ho Man Chu , Meng-Chun Lee
CPC classification number: C09J9/02 , C08K7/04 , C08K7/16 , C08K2201/001 , C08K2201/005 , C09J7/02 , C09J7/20 , C09J2201/602 , C09J2203/326 , C09J2205/102 , H05K3/323 , Y10T428/24 , Y10T428/24893
Abstract: An ACF comprising a substrate, a layer of an adhesive on the surface of the substrate, the adhesive optionally having conductive particles dispersed therein, at least one tier of conductive particles arranged in a non-random array, the tier being formed by transfer of conductive particles from a carrier belt having a stitching line to the surface of the adhesive layer wherein the portion of the tier corresponding to the stitching line is free of conductive particles, and the adhesive layer being overcoated with a second tier of conductive particles arranged in a non-random array at least in the area of the first tier corresponding to the stitching line. The tiers may be at the same or different depths within the adhesive layer. More than two tiers of conductive particles may be present in the ACF.
Abstract translation: 一种ACF，包括基材，在基材表面上的粘合剂层，粘合剂任选地具有分散在其中的导电颗粒，至少一层导电颗粒以非随机阵列排列，该层通过传导导电 具有缝合线的载体带到粘合剂层的表面的颗粒，其中对应于缝合线的层的部分没有导电颗粒，并且粘合剂层被涂覆有布置在非粘合层中的第二层导电颗粒 至少在对应于缝合线的第一层的区域中的等级阵列。 层可以在粘合剂层内处于相同或不同的深度。 ACF中可能存在两层以上的导电颗粒。
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