Abstract:
An ACF comprising a substrate, a layer of an adhesive on the surface of the substrate, the adhesive optionally having conductive particles dispersed therein, at least one tier of conductive particles arranged in a non-random array, the tier being formed by transfer of conductive particles from a carrier belt having a stitching line to the surface of the adhesive layer wherein the portion of the tier corresponding to the stitching line is free of conductive particles, and the adhesive layer being overcoated with a second tier of conductive particles arranged in a non-random array at least in the area of the first tier corresponding to the stitching line. The tiers may be at the same or different depths within the adhesive layer. More than two tiers of conductive particles may be present in the ACF.
Abstract:
An anisotropic conductive film (ACF) is disclosed. In one approach, the ACF includes a non-reflective adhesive layer including a top surface, a plurality of conductive particles included with the non-reflective adhesive layer, and a reflective adhesive layer disposed along the top surface of the non-reflective adhesive layer. The reflective layer includes at least five percent reflective particles by percentage weight.
Abstract:
An anisotropic conductive film (ACF) is disclosed. In one approach, the ACF includes a non-reflective adhesive layer including a top surface, a plurality of conductive particles included with the non-reflective adhesive layer, and a reflective adhesive layer disposed along the top surface of the non-reflective adhesive layer. The reflective layer includes at least five percent reflective particles by percentage weight.
Abstract:
An ACF comprising a substrate, a layer of an adhesive on the surface of the substrate, the adhesive optionally having conductive particles dispersed therein, at least one tier of conductive particles arranged in a non-random array, the tier being formed by transfer of conductive particles from a carrier belt having a stitching line to the surface of the adhesive layer wherein the portion of the tier corresponding to the stitching line is free of conductive particles, and the adhesive layer being overcoated with a second tier of conductive particles arranged in a non-random array at least in the area of the first tier corresponding to the stitching line. The tiers may be at the same or different depths within the adhesive layer. More than two tiers of conductive particles may be present in the ACF.