公开(公告)号：US09184064B1

公开(公告)日：2015-11-10

申请号：US14568977

申请日：2014-12-12

Applicant: Triton Microtechnologies

Inventor： Tim Mobley ,  Roupen Leon Keusseyan ,  Charles Tucker

IPC: H01L21/48 ,  C23C18/16 ,  C23C18/32 ,  C23C28/02 ,  C23C2/04 ,  H01L23/538 ,  H01L23/15

CPC classification number: H01L21/486 ,  C23C2/04 ,  C23C18/165 ,  C23C18/32 ,  C23C28/023 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/4867 ,  H01L21/6835 ,  H01L23/15 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/5384 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/48 ,  H01L2221/68331 ,  H01L2221/68345 ,  H01L2221/68381 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/13118 ,  H01L2224/13124 ,  H01L2224/13138 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/29144 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2224/0401 ,  H01L2224/11009 ,  H01L2224/45099 ,  H01L2924/01014

Abstract: A method for backside metallization and reinforcement of glass substrates to provide support and protection during handling and processing of the glass substrates. Through-holes are created in a glass substrate and filled with a conductive type material. Backside metallized pads are applied to the glass substrate and enclosed with an under-bump metallization (UBM) pad. A sacrificial substrate is removeably attached to the glass substrate. The sacrificial substrate comprises a sacrificial layer, an opaque film, and an adhesive. The sacrificial substrate protects the backside metallized pads and under-bump metallization (UBM) pads, and reinforces the glass substrate.

Abstract translation: 一种用于玻璃基板的背面金属化和增强的方法，以在玻璃基板的处理和加工期间提供支撑和保护。 在玻璃基板中形成通孔，并填充导电型材料。 将背面金属化焊盘施加到玻璃基板并用凸块下金属化（UBM）焊盘封闭。 牺牲基板可移除地附接到玻璃基板。 牺牲衬底包括牺牲层，不透明膜和粘合剂。 牺牲衬底保护背面金属化焊盘和凸块下金属化（UBM）焊盘，并加强玻璃衬底。

公开(公告)号：US09184135B1

公开(公告)日：2015-11-10

申请号：US14569010

申请日：2014-12-12

Applicant: Triton Microtechnologies

Inventor： Tim Mobley ,  Roupen Leon Keusseyan ,  Charles Tucker

IPC: H01L23/538 ,  H05K3/00 ,  H05K1/03 ,  H05K1/09 ,  H01L21/48 ,  H01L23/15

CPC classification number: H01L23/5384 ,  H01L21/486 ,  H01L21/6835 ,  H01L23/15 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/48 ,  H01L2221/68331 ,  H01L2221/68345 ,  H01L2221/68381 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/13118 ,  H01L2224/13124 ,  H01L2224/13138 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/29144 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/16152 ,  H05K1/0306 ,  H05K1/09 ,  H05K3/007 ,  H05K2201/0344 ,  H05K2201/09481 ,  H05K2201/09563 ,  H01L2924/00 ,  H01L2224/0401 ,  H01L2224/11009 ,  H01L2924/014 ,  H01L2924/01014 ,  H01L2224/45099

Abstract: A system for backside metallization and reinforcement of glass substrates to provide support and protection during handling and processing of the glass substrates. A sacrificial substrate is removeably attached to a glass substrate comprising through-holes, backside metallized pads, and under-bump metallization (UBM) pads enclosing the backside metallized pads. The sacrificial substrate comprises a sacrificial layer, an opaque film, and an adhesive. The sacrificial substrate protects the backside metallized pads and UBM pads, and reinforces the glass substrate.

Abstract translation: 用于玻璃基板的背面金属化和增强的系统，以在玻璃基板的处理和加工期间提供支撑和保护。 牺牲衬底可移除地附接到包括通孔，背面金属化焊盘和包围背面金属化焊盘的凸起下金属化（UBM）焊盘的玻璃衬底。 牺牲衬底包括牺牲层，不透明膜和粘合剂。 牺牲基板保护背面金属化焊盘和UBM焊盘，并加强玻璃基板。