公开(公告)号：US09337060B1

公开(公告)日：2016-05-10

申请号：US14568879

申请日：2014-12-12

Applicant: Triton Microtechnologies

Inventor： Tim Mobley ,  Roupen Leon Keusseyan

IPC: H01L21/48 ,  H05K3/40 ,  H01L23/08 ,  H01L23/15 ,  H05K1/03

CPC classification number: H01L21/486 ,  H01L21/4803 ,  H01L23/08 ,  H01L23/15 ,  H01L23/49827 ,  H01L2924/0002 ,  H01L2924/14 ,  H05K1/0306 ,  H05K3/4038 ,  H01L2924/00

Abstract: A glass substrate and method of processing the glass substrate for use in semi-conductor packaging applications. The glass substrate has top surface and a bottom surface. At least one through-hole extends from the top surface to the bottom surface of the glass substrate. At least one interior layer is disposed inside the through-hole. At least one external layer is disposed on the top surface and at least one external layer is disposed on the bottom surface. The through holes of the glass substrate are filled with a metallized paste material using thick film technology. The glass substrate is planarized after metallization to clean and flatten a surface of the glass substrate. The surface of the glass substrate is coated with at least one redistribution layer of a metal, a metal oxide, an alloy, a polymer, or a combination thereof. The paste material has improved adhesion to the through-holes. The filled through-holes are hermetic and have a low resistivity.

Abstract translation: 玻璃基板和用于半导体封装应用的玻璃基板的加工方法。 玻璃基板具有顶表面和底表面。 至少一个通孔从玻璃基板的顶表面延伸到底表面。 至少一个内层设置在通孔的内部。 至少一个外层设置在顶表面上，并且至少一个外层设置在底表面上。 使用厚膜技术，用金属化的糊料填充玻璃基板的通孔。 在金属化之后，玻璃基板被平坦化，以清洁和平坦化玻璃基板的表面。 玻璃基板的表面涂覆有金属，金属氧化物，合金，聚合物或其组合的至少一个再分配层。 糊料材料具有改善的对通孔的粘附性。 填充的通孔是密封的并且具有低电阻率。

公开(公告)号：US09184064B1

公开(公告)日：2015-11-10

申请号：US14568977

申请日：2014-12-12

Applicant: Triton Microtechnologies

Inventor： Tim Mobley ,  Roupen Leon Keusseyan ,  Charles Tucker

IPC: H01L21/48 ,  C23C18/16 ,  C23C18/32 ,  C23C28/02 ,  C23C2/04 ,  H01L23/538 ,  H01L23/15

CPC classification number: H01L21/486 ,  C23C2/04 ,  C23C18/165 ,  C23C18/32 ,  C23C28/023 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/4867 ,  H01L21/6835 ,  H01L23/15 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/5384 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/48 ,  H01L2221/68331 ,  H01L2221/68345 ,  H01L2221/68381 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/13118 ,  H01L2224/13124 ,  H01L2224/13138 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/29144 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2224/0401 ,  H01L2224/11009 ,  H01L2224/45099 ,  H01L2924/01014

Abstract: A method for backside metallization and reinforcement of glass substrates to provide support and protection during handling and processing of the glass substrates. Through-holes are created in a glass substrate and filled with a conductive type material. Backside metallized pads are applied to the glass substrate and enclosed with an under-bump metallization (UBM) pad. A sacrificial substrate is removeably attached to the glass substrate. The sacrificial substrate comprises a sacrificial layer, an opaque film, and an adhesive. The sacrificial substrate protects the backside metallized pads and under-bump metallization (UBM) pads, and reinforces the glass substrate.

Abstract translation: 一种用于玻璃基板的背面金属化和增强的方法，以在玻璃基板的处理和加工期间提供支撑和保护。 在玻璃基板中形成通孔，并填充导电型材料。 将背面金属化焊盘施加到玻璃基板并用凸块下金属化（UBM）焊盘封闭。 牺牲基板可移除地附接到玻璃基板。 牺牲衬底包括牺牲层，不透明膜和粘合剂。 牺牲衬底保护背面金属化焊盘和凸块下金属化（UBM）焊盘，并加强玻璃衬底。

公开(公告)号：US09374892B1

公开(公告)日：2016-06-21

申请号：US14568917

申请日：2014-12-12

Applicant: Triton Microtechnologies

Inventor： Tim Mobley ,  Roupen Leon Keusseyan

IPC: H05K1/03 ,  H01L21/48 ,  B22F1/00 ,  C09D5/24 ,  H01L23/15 ,  H01L23/498

CPC classification number: H05K1/0306 ,  B22F1/0003 ,  B22F2301/10 ,  B22F2304/10 ,  C09D5/24 ,  H01L21/486 ,  H01L23/15 ,  H01L23/49827 ,  H01L23/49883 ,  H01L2924/0002 ,  H05K1/092 ,  H05K3/4061 ,  H01L2924/00

Abstract: A paste material for filling a through-hole for improved adhesion and hermeticity in glass substrates. In some embodiments, the paste material comprises a metal, a glass frit composition, a solvent, a resin, a conductive or non-conductive inert additive, or mixtures thereof. The paste material has improved adhesion to the through-holes. The filled through-holes are hermetic and have a low resistivity.

Abstract translation: 用于填充通孔的糊状材料，用于提高玻璃基板的粘合性和气密性。 在一些实施方案中，糊状材料包括金属，玻璃料组合物，溶剂，树脂，导电或非导电惰性添加剂或其混合物。 糊料材料具有改善的对通孔的粘附性。 填充的通孔是密封的并且具有低电阻率。

公开(公告)号：US09184135B1

公开(公告)日：2015-11-10

申请号：US14569010

申请日：2014-12-12

Applicant: Triton Microtechnologies

Inventor： Tim Mobley ,  Roupen Leon Keusseyan ,  Charles Tucker

IPC: H01L23/538 ,  H05K3/00 ,  H05K1/03 ,  H05K1/09 ,  H01L21/48 ,  H01L23/15

CPC classification number: H01L23/5384 ,  H01L21/486 ,  H01L21/6835 ,  H01L23/15 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/48 ,  H01L2221/68331 ,  H01L2221/68345 ,  H01L2221/68381 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/13118 ,  H01L2224/13124 ,  H01L2224/13138 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/29144 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/16152 ,  H05K1/0306 ,  H05K1/09 ,  H05K3/007 ,  H05K2201/0344 ,  H05K2201/09481 ,  H05K2201/09563 ,  H01L2924/00 ,  H01L2224/0401 ,  H01L2224/11009 ,  H01L2924/014 ,  H01L2924/01014 ,  H01L2224/45099

Abstract: A system for backside metallization and reinforcement of glass substrates to provide support and protection during handling and processing of the glass substrates. A sacrificial substrate is removeably attached to a glass substrate comprising through-holes, backside metallized pads, and under-bump metallization (UBM) pads enclosing the backside metallized pads. The sacrificial substrate comprises a sacrificial layer, an opaque film, and an adhesive. The sacrificial substrate protects the backside metallized pads and UBM pads, and reinforces the glass substrate.

Abstract translation: 用于玻璃基板的背面金属化和增强的系统，以在玻璃基板的处理和加工期间提供支撑和保护。 牺牲衬底可移除地附接到包括通孔，背面金属化焊盘和包围背面金属化焊盘的凸起下金属化（UBM）焊盘的玻璃衬底。 牺牲衬底包括牺牲层，不透明膜和粘合剂。 牺牲基板保护背面金属化焊盘和UBM焊盘，并加强玻璃基板。

公开(公告)号：US09236274B1

公开(公告)日：2016-01-12

申请号：US14568842

申请日：2014-12-12

Applicant: Triton Microtechnologies

Inventor： Tim Mobley ,  Roupen Leon Keusseyan

IPC: H01L21/48 ,  H05K3/40 ,  C03B25/02 ,  C03C15/00 ,  C03C17/32 ,  C03C17/30 ,  C03C17/06 ,  C03C23/00 ,  C03C17/38 ,  H01L23/15 ,  H05K1/03

CPC classification number: H01L21/486 ,  C03B25/025 ,  C03C15/00 ,  C03C17/06 ,  C03C17/30 ,  C03C17/32 ,  C03C17/38 ,  C03C23/0025 ,  C03C2217/25 ,  C03C2217/70 ,  C03C2218/31 ,  C03C2218/32 ,  H01L23/15 ,  H01L23/49827 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K1/095 ,  H05K3/4038 ,  H05K3/4061 ,  H01L2924/00

Abstract: A method of processing a glass substrate for use in semi-conductor packaging applications. Through holes are created in a glass substrate and subsequently filled with a metallized paste material. The glass substrate is planarized after metallization to clean and flatten a surface of the glass substrate. The surface of the glass substrate is coated with at least one redistribution layer of a metal, a metal oxide, an alloy, a polymer, or a combination thereof. The paste material has improved adhesion to the through-holes. The filled through-holes are hermetic and have a low resistivity.

Abstract translation: 一种处理用于半导体封装应用的玻璃基板的方法。 在玻璃基板中形成通孔，随后填充有金属化的糊料。 在金属化之后，玻璃基板被平坦化，以清洁和平坦化玻璃基板的表面。 玻璃基板的表面涂覆有金属，金属氧化物，合金，聚合物或其组合的至少一个再分配层。 糊料材料具有改善的对通孔的粘附性。 填充的通孔是密封的并且具有低电阻率。