公开(公告)号：US20190232333A1

公开(公告)日：2019-08-01

申请号：US16311432

申请日：2017-07-14

Applicant: UBE INDUSTRIES, LTD.

Inventor： Kazutaka NARITA ,  Takeshige NAKAYAMA ,  Naoki KITAYAMA ,  Shohei INOUE

IPC: B05D3/02 ,  B32B27/34 ,  C08J5/18 ,  H05K1/03

CPC classification number: B05D3/0227 ,  B05D3/02 ,  B29C41/28 ,  B32B27/34 ,  C08J5/18 ,  H05K1/03 ,  H05K1/0306 ,  H05K1/0393

Abstract: Disclosed is a method for producing a polyimide laminate, the method including the steps of applying a polyimide precursor solution onto a substrate and heating the polyimide precursor solution, to thereby form a polyimide film layer on the substrate. The substrate is any plate selected from a glass plate, a metal plate, and a ceramic plate. The heating step includes irradiation with far infrared rays using an infrared heater that generates a maximum radiant energy at an infrared wavelength of 3.5 to 6 μm. The highest heating temperature is preferably 350 to 550° C. The time required to increase the temperature from 180 to 280° C. during a temperature-increasing process is preferably 2 minutes or longer.

公开(公告)号：US20200172731A1

公开(公告)日：2020-06-04

申请号：US16640196

申请日：2018-08-06

Applicant: UBE INDUSTRIES, LTD.

Inventor： Takeshige NAKAYAMA ,  Kazutaka NARITA ,  Shohei INOUE

IPC: C08L79/08 ,  H01M4/62 ,  H01M4/04 ,  H01M4/36 ,  H01M4/139 ,  H01M10/0525 ,  C08G73/10 ,  H01G11/38 ,  H01G11/56 ,  H01G11/86 ,  H01G11/28 ,  H01G11/68

Abstract: A binder resin for electrodes consisting of a polyimide-based resin having a melting point of 300° C. or lower, an electrode mixture paste including the binder resin for electrodes, an electrode active material, and a solvent; and an electrode including an electrode mixture layer including the binder resin for electrodes and an electrode active material; and a method for producing the electrode.

公开(公告)号：US20170137571A1

公开(公告)日：2017-05-18

申请号：US15316485

申请日：2015-06-04

Applicant: UBE INDUSTRIES, LTD.

Inventor： Tomonori NAKAYAMA ,  Shohei INOUE ,  Takeshige NAKAYAMA ,  Hiroo YAMASHITA ,  Naoki KITAYAMA

IPC: C08G73/10 ,  B05D3/00 ,  C08J5/18

CPC classification number: C08G73/1032 ,  B05D3/007 ,  C08G73/10 ,  C08G73/1039 ,  C08G73/1078 ,  C08J5/18 ,  C08J2379/08

Abstract: A method for producing a polyimide film includes: (i) applying a polyamic acid solution composition, which includes at least one of the following solvents: N-methylformamide, N,N-dimethylpropionamide, N,N-dimethylisobutylamide and tetramethylurea, and a polyamic acid, to a substrate; and then (ii) imidizing the polyamic acid by subjecting the composition to heat treatment, to obtain the polyimide film.