公开(公告)号：US20220028907A1

公开(公告)日：2022-01-27

申请号：US17443380

申请日：2021-07-26

Applicant: UNIVERSITY OF SOUTHERN CALIFORNIA

Inventor： Rehan Rashid KAPADIA ,  Khaled AHMED ,  Frank GREER

IPC: H01L27/146 ,  H01L31/0304 ,  H01L31/18

Abstract: A method for forming a composite substrate containing layers of dissimilar materials is provided. The method includes a step of disposing a release layer over a base substrate where the base substrate is composed of a first material. A template layer is attached to the release layer. Characteristically, the template layer is composed of a second material and adapted to form a compound semiconductor device thereon.