公开(公告)号：US20160174419A1

公开(公告)日：2016-06-16

申请号：US14956751

申请日：2015-12-02

Applicant: University of Windsor

Inventor： Sazzadur CHOWDHURY

IPC: H05K9/00 ,  H05K3/46 ,  H05K3/00 ,  H05K1/03 ,  H05K1/11

CPC classification number: H05K3/4605 ,  H01L21/4857 ,  H01L23/15 ,  H01L23/552 ,  H01L23/66 ,  H01L2924/0002 ,  H05K1/0218 ,  H05K1/0306 ,  H05K1/115 ,  H05K2201/09609 ,  H01L2924/00

Abstract: An integrated circuit assembly which includes stacked printed ceramic substrate layers, and incorporates a shielding enclosure extending about the electrical conductor traces and interconnects which form the assembly circuitry. The shielding enclosure is configured to reduce electric and/or magnetic field leakage or interference with the traces and interconnects. The enclosure is provided as a cage about the assembly circuitry, and which is formed as arrays of ground conductors in electrical communication with ground plates.

Abstract translation: 一种集成电路组件，其包括堆叠的印刷陶瓷衬底层，并且包括围绕形成组装电路的电导体迹线和互连件延伸的屏蔽外壳。 屏蔽外壳被配置为减少电场和/或磁场泄漏或与迹线和互连的干扰。 外壳围绕组装电路提供为笼，并且其形成为与接地板电连通的接地导体的阵列。

公开(公告)号：US20170018456A1

公开(公告)日：2017-01-19

申请号：US15207797

申请日：2016-07-12

Applicant: UNIVERSITY OF WINDSOR

Inventor： Sazzadur CHOWDHURY ,  HORST SCHMIDT

IPC: H01L21/768 ,  H01L23/532 ,  H01L23/522

CPC classification number: H01L23/31 ,  H01L21/4857 ,  H01L23/145 ,  H01L23/3121 ,  H01L23/49822 ,  H01L23/5389

Abstract: An integrated circuit includes stacked benzocyclobutene layers and a circuit geometry comprising conductive electric traces and interconnects on and/or extending through the BCB layers. A first said BCB layer formed and partially cured state. A top surface masked with photoresist, and after exposure, etched selectively form through vias at locations corresponding to conductive interconnects of the circuit geometry associated with said first BCB layer. A further mask coating is applied and after exposure, conductive metal is deposited to infill vias and form the electric traces of the circuit geometry. Subsequent BCB layers are then likewise formed, etched masked and coated in the same manner.

Abstract translation: 集成电路包括堆叠的苯并环丁烯层和电路几何形状，其包括在BCB层上和/或延伸通过BCB层的导电电迹线和互连。 第一个说BCB层形成并部分固化的状态。 用光致抗蚀剂掩蔽的顶表面，并且在曝光之后，通过与对应于与所述第一BCB层相关联的电路几何形状的导电互连的位置处的通孔选择性地形成蚀刻。 施加另外的掩模涂层，并且在曝光之后，沉积导电金属以填充通孔并形成电路几何形状的电迹线。 随后的BCB层同样地形成，蚀刻掩模和以相同的方式涂覆。

公开(公告)号：US20160041259A1

公开(公告)日：2016-02-11

申请号：US14768634

申请日：2014-03-12

Applicant: UNIVERSITY OF WINDSOR

Inventor： Sazzadur CHOWDHURY

IPC: G01S7/52 ,  B81C1/00

CPC classification number: G01S7/52 ,  B06B1/0292 ,  B81C1/00269

Abstract: A sensor assembly including one or more capacitive micromachined ultrasonic transducer (CMUT) microarray modules which are provided with a number of individual transducers. The microarray modules are arranged to simulate or orient individual transducers in a hyperbolic paraboloid geometry. The transducers/sensor are arranged in a rectangular or square matrix and are activatable individually, selectively or collectively to emit and received reflected beam signals at a frequency of between about 100 to 170 kHz.

Abstract translation: 一种传感器组件，包括一个或多个电容式微加工超声波换能器（CMUT）微阵列模块，其设置有多个单独的换能器。 微阵列模块被布置成在双曲抛物面几何中模拟或定向各个换能器。 传感器/传感器被布置成矩形或矩形矩阵，并且可以单独地，选择性地或集体地激活以以大约100到170kHz之间的频率发射和接收反射光束信号。

公开(公告)号：US20150044807A1

公开(公告)日：2015-02-12

申请号：US14331295

申请日：2014-07-15

Applicant: UNIVERSITY OF WINDSOR

Inventor： Sazzadur CHOWDHURY ,  Aref Bakhtazad

IPC: B81C1/00

CPC classification number: B81C1/00269 ,  B06B1/0292 ,  H01L2924/1461

Abstract: A sensor assembly including one or more capacitive micromachined ultrasonic transducer (CMUT) microarray modules which are provided with a number of individual transducers. The transducers include silicon device and backing layers joined by a fused benzocyclobutene (BCB) layer which defines the transducer air gap, and which are arranged to simulate or orient individual transducers in a hyperbolic paraboloid geometry. The transducers/sensor are arranged in a matrix and are activatable to emit and receive reflected beam signals at a frequency of between about 100 to 170 kHz.

Abstract translation: 一种传感器组件，包括一个或多个电容式微加工超声波换能器（CMUT）微阵列模块，其设置有多个单独的换能器。 换能器包括通过限定换能器空气间隙的稠合苯并环丁烯（BCB）层连接的硅装置和背衬层，它们被布置成在双曲抛物面几何中模拟或定向各个换能器。 传感器/传感器被布置成矩阵并且可激活以以大约100至170kHz的频率发射和接收反射的光束信号。

公开(公告)号：US20140125193A1

公开(公告)日：2014-05-08

申请号：US13804279

申请日：2013-03-14

Applicant: UNIVERSITY OF WINDSOR

Inventor： Sazzadur CHOWDHURY

IPC: H02N1/00

CPC classification number: B06B1/0292

Abstract: A sensor assembly including one or more capacitive micromachined ultrasonic transducer (CMUT) microarray modules which are provided with a number of individual transducers. The microarray modules are arranged to simulate or orient individual transducers in a hyperbolic paraboloid geometry. The transducers/sensor are arranged in a rectangular or square matrix and are activatable individually, selectively or collectively to emit and received reflected beam signals at a frequency of between about 100 to 170 kHz.

Abstract translation: 一种传感器组件，包括一个或多个电容式微加工超声波换能器（CMUT）微阵列模块，其设置有多个单独的换能器。 微阵列模块被布置成在双曲抛物面几何中模拟或定向各个换能器。 传感器/传感器被布置成矩形或矩形矩阵，并且可以单独地，选择性地或集体地激活以以大约100到170kHz之间的频率发射和接收反射光束信号。