公开(公告)号：US20180166314A1

公开(公告)日：2018-06-14

申请号：US15834718

申请日：2017-12-07

Applicant: Ultratech, Inc.

Inventor： Raymond Ellis ,  A.J. Crespin ,  Konrad Heinle ,  Charles Hu

IPC: H01L21/683 ,  H01L21/687

CPC classification number: H01L21/6838 ,  H01L21/67126 ,  H01L21/68735 ,  H01L21/68742 ,  H01L21/6875

Abstract: A wafer chuck apparatus includes a chuck with a body and a vacuum line system formed within the body. The wafer chuck apparatus has sealing devices each operably disposed in respective recesses formed in the body at an upper surface of the chuck. Each sealing device is contractible between an expanded operating position and a contracted operating position. The top end of each sealing device is configured to form a vacuum seal with a corresponding portion of a backside of a wafer. The sealing devices extend above the upper surface of the chuck higher than typical seals and guide the wafer down to the upper surface of the chuck where it can be engaged by vacuum features that chuck the wafer to the upper surface of the chuck. The sealing devices are particularly useful for chucking warped wafers.