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    Package structure
    3.
    发明授权
    Package structure 有权

    公开(公告)号：US11631626B2

    公开(公告)日：2023-04-18

    申请号：US17206108

    申请日：2021-03-18

    Applicant: Unimicron Technology Corp.

    Inventor： Ra-Min Tain ,  Po-Hsiang Wang ,  Chi-Chun Po

    IPC: H01L23/06 ,  H01L23/367 ,  H01L23/31 ,  H01L23/373 ,  H01L23/00 ,  H01L25/065

    Abstract: A package structure includes a first circuit board, a second circuit board, at least one electronic component, at least one conductive lead, and a molding compound. The first circuit board includes a first circuit layer and a second circuit layer. The second circuit board includes a third circuit layer and a fourth circuit layer. The electronic component is disposed between the first circuit board and the second circuit board. The conductive lead contacts at least one of the second circuit layer and the third circuit layer. The conductive lead has a vertical height, and the vertical height is greater than a vertical distance between the second circuit layer and the third circuit layer. The molding compound covers the first circuit board, the second circuit board, the electronic component, and the conductive lead. The molding compound exposes the first circuit layer and the fourth circuit layer, and the conductive lead extends outside the molding compound.

    CIRCUIT BOARD STRUCTURE
    4.
    发明申请
    CIRCUIT BOARD STRUCTURE 有权

    公开(公告)号：US20210014963A1

    公开(公告)日：2021-01-14

    申请号：US16533808

    申请日：2019-08-07

    Applicant: Unimicron Technology Corp.

    Inventor： Ra-Min Tain ,  Chi-Chun Po ,  Po-Hsiang Wang

    IPC: H05K1/02 ,  H05K1/05 ,  H05K7/20

    Abstract: A circuit board structure includes a carrier and a patterned circuit layer. The patterned circuit layer is disposed on the carrier, and the patterned circuit layer has at least one fluid channel therein. The fluid channel has a heat absorption section and a heat dissipation section relative to the heat absorption section. A heat source is electrically connected to the patterned circuit layer, and the heat absorption section is adjacent to the heat source. The heat generated by the heat source is transferred from the patterned circuit layer to the heat absorption section of the fluid channel, and is transferred from the heat absorption section to the heat dissipation section for heat dissipation.

    Circuit board and manufacturing method thereof
    5.
    发明授权
    Circuit board and manufacturing method thereof 有权

    公开(公告)号：US11641720B2

    公开(公告)日：2023-05-02

    申请号：US17224078

    申请日：2021-04-06

    Applicant: Unimicron Technology Corp.

    Inventor： Pei-Wei Wang ,  Shao-Chien Lee ,  Ra-Min Tain ,  Chi-Chun Po ,  Po-Hsiang Wang ,  Pei-Chang Huang ,  Chin-Min Hu

    IPC: H05K3/46 ,  H05K1/02 ,  H05K3/34

    Abstract: A circuit board includes a composite structure layer, at least one conductive structure, a thermally conductive substrate, and a thermal interface material layer. The composite structure layer has a cavity and includes a first structure layer, a second structure layer, and a connecting structure layer. The first structure layer includes at least one first conductive member, and the second structure layer includes at least one second conductive member. The cavity penetrates the first structure layer and the connecting structure layer to expose the second conductive member. The conductive structure at least penetrates the connecting structure layer and is electrically connected to the first conductive member and the second conductive member. The thermal interface material layer is disposed between the composite structure layer and the thermally conductive substrate, and the second structure layer is connected to the thermally conductive substrate through the thermal interface material layer.

    Circuit board structure
    6.
    发明授权
    Circuit board structure 有权

    公开(公告)号：US11337303B2

    公开(公告)日：2022-05-17

    申请号：US16533808

    申请日：2019-08-07

    Applicant: Unimicron Technology Corp.

    Inventor： Ra-Min Tain ,  Chi-Chun Po ,  Po-Hsiang Wang

    IPC: H05K1/02 ,  H05K7/20 ,  H05K1/05

    Abstract: A circuit board structure includes a carrier and a patterned circuit layer. The patterned circuit layer is disposed on the carrier, and the patterned circuit layer has at least one fluid channel therein. The fluid channel has a heat absorption section and a heat dissipation section relative to the heat absorption section. A heat source is electrically connected to the patterned circuit layer, and the heat absorption section is adjacent to the heat source. The heat generated by the heat source is transferred from the patterned circuit layer to the heat absorption section of the fluid channel, and is transferred from the heat absorption section to the heat dissipation section for heat dissipation.

    PACKAGE CARRIER AND PACKAGE STRUCTURE
    7.
    发明申请
    PACKAGE CARRIER AND PACKAGE STRUCTURE 审中-公开

    公开(公告)号：US20200329565A1

    公开(公告)日：2020-10-15

    申请号：US16739133

    申请日：2020-01-10

    Applicant: Unimicron Technology Corp.

    Inventor： Ra-Min Tain ,  Pei-Chang Huang ,  Chi-Chun Po ,  Chun-Lin Liao ,  Po-Hsiang Wang ,  Hsuan-Wei Chen

    IPC: H05K3/10

    Abstract: A package carrier includes a plurality of first circuit patterns, a plurality of second circuit patterns and an insulating material layer. The second circuit patterns are disposed between any two the first circuit patterns and are directly connected to the first circuit patterns. In a cross-sectional view, a first thickness of each of the first circuit patterns is greater than a second thickness of each of the second circuit patterns. A first surface of each of the first circuit patterns is aligned with a second surface of each of the second circuit patterns. The insulating material layer at least contacts the first circuit patterns.

    MANUFACTURING METHOD OF PACKAGE CARRIER
    8.
    发明申请
    MANUFACTURING METHOD OF PACKAGE CARRIER 有权

    公开(公告)号：US20250040026A1

    公开(公告)日：2025-01-30

    申请号：US18918080

    申请日：2024-10-17

    Applicant: Unimicron Technology Corp.

    Inventor： Ming-Hao Wu ,  Hsuan-Wei Chen ,  Chi-Chun Po

    IPC: H05K1/02 ,  H01L21/48 ,  H01L23/498 ,  H05K1/11 ,  H05K3/00 ,  H05K3/42 ,  H05K3/46

    Abstract: A manufacturing method of the package carrier includes the following steps. A circuit substrate having a through via is provided. A heat-conducting material layer coving the inner wall of the through via is electroplated on the circuit substrate. A first build-up structure and a second build-up structure are respectively formed on two opposite sides of the circuit substrate. Parts of the first build-up structure, the circuit substrate, the heat-conducting material layer and the second build-up structure are removed to expose the remaining heat-conducting material layer, so as to define a heat-conducting element and form a circuit structure layer including a notch portion. The heat-conducting element includes a first heat-conducting portion and a second heat-conducting portion vertically connected to the first heat-conducting portion. The notch portion exposes the first heat-conducting portion, and an outer surface of the second heat-conducting portion is aligned with a side surface of the circuit structure layer.

    PACKAGE STRUCTURE
    9.
    发明申请
    PACKAGE STRUCTURE 有权

    公开(公告)号：US20220108934A1

    公开(公告)日：2022-04-07

    申请号：US17206108

    申请日：2021-03-18

    Applicant: Unimicron Technology Corp.

    Inventor： Ra-Min Tain ,  Po-Hsiang Wang ,  Chi-Chun Po

    IPC: H01L23/367 ,  H01L23/31 ,  H01L23/373 ,  H01L23/00 ,  H01L25/065

    Abstract: A package structure includes a first circuit board, a second circuit board, at least one electronic component, at least one conductive lead, and a molding compound. The first circuit board includes a first circuit layer and a second circuit layer. The second circuit board includes a third circuit layer and a fourth circuit layer. The electronic component is disposed between the first circuit board and the second circuit board. The conductive lead contacts at least one of the second circuit layer and the third circuit layer. The conductive lead has a vertical height, and the vertical height is greater than a vertical distance between the second circuit layer and the third circuit layer. The molding compound covers the first circuit board, the second circuit board, the electronic component, and the conductive lead. The molding compound exposes the first circuit layer and the fourth circuit layer, and the conductive lead extends outside the molding compound.

    CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
    10.
    发明申请
    CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF 有权

    公开(公告)号：US20220095464A1

    公开(公告)日：2022-03-24

    申请号：US17224078

    申请日：2021-04-06

    Applicant: Unimicron Technology Corp.

    Inventor： Pei-Wei Wang ,  Shao-Chien Lee ,  Ra-Min Tain ,  Chi-Chun Po ,  Po-Hsiang Wang ,  Pei-Chang Huang ,  Chin-Min Hu

    IPC: H05K3/46 ,  H05K3/34 ,  H05K1/02

    Abstract: A circuit board includes a composite structure layer, at least one conductive structure, a thermally conductive substrate, and a thermal interface material layer. The composite structure layer has a cavity and includes a first structure layer, a second structure layer, and a connecting structure layer. The first structure layer includes at least one first conductive member, and the second structure layer includes at least one second conductive member. The cavity penetrates the first structure layer and the connecting structure layer to expose the second conductive member. The conductive structure at least penetrates the connecting structure layer and is electrically connected to the first conductive member and the second conductive member. The thermal interface material layer is disposed between the composite structure layer and the thermally conductive substrate, and the second structure layer is connected to the thermally conductive substrate through the thermal interface material layer.

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