公开(公告)号：US20240413067A1

公开(公告)日：2024-12-12

申请号：US18360826

申请日：2023-07-28

Applicant: Unimicron Technology Corp.

Inventor： Chia-Yu PENG ,  Kai-Ming YANG ,  Pu-Ju LIN ,  Cheng-Ta KO

IPC: H01L23/498 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00 ,  H01L23/13 ,  H01L23/31

Abstract: An electronic package module including a circuit substrate, an electronic component disposed on the circuit substrate and a molding compound is provided. The molding compound encapsulates the circuit substrate and the electronic component. The circuit substrate includes a first circuit layer and a first insulation layer covering on the first circuit layer. The first insulation layer has a boundary surface where a second circuit layer is disposed. A second insulation layer covers a part of the second circuit layer while the insulation layer bares a region surrounding the perimeter of the boundary surface. The molding compound directly contacts the region and the second insulation layer.