公开(公告)号：US12184005B2

公开(公告)日：2024-12-31

申请号：US17661282

申请日：2022-04-28

Applicant: Unimicron Technology Corp.

Inventor： Ching-Ho Hsieh ,  Ming-Hsing Wu ,  Keui-Sheng Wu

IPC: H01R13/17 ,  H01R12/70

Abstract: A connector includes a substrate, a coverlay and a spring contact. The substrate has a first surface, a second surface opposite to the first surface and a conductive through hole extending between the first and second surfaces. The coverlay is disposed on the first surface and includes a first opening. The spring contact includes an anchor member, a rising member and a pin. The anchor member is disposed between the substrate and the coverlay. The rising member extends from the anchor member and through the first opening in a direction away from the substrate. A first portion of the rising member is in the first opening, and a second portion of the rising member is out of the first opening. The pin extends from the anchor member to an inside of the conductive through hole, and is electrically connected to the conductive through hole.