公开(公告)号：US12184005B2

公开(公告)日：2024-12-31

申请号：US17661282

申请日：2022-04-28

Applicant: Unimicron Technology Corp.

Inventor： Ching-Ho Hsieh ,  Ming-Hsing Wu ,  Keui-Sheng Wu

IPC: H01R13/17 ,  H01R12/70

Abstract: A connector includes a substrate, a coverlay and a spring contact. The substrate has a first surface, a second surface opposite to the first surface and a conductive through hole extending between the first and second surfaces. The coverlay is disposed on the first surface and includes a first opening. The spring contact includes an anchor member, a rising member and a pin. The anchor member is disposed between the substrate and the coverlay. The rising member extends from the anchor member and through the first opening in a direction away from the substrate. A first portion of the rising member is in the first opening, and a second portion of the rising member is out of the first opening. The pin extends from the anchor member to an inside of the conductive through hole, and is electrically connected to the conductive through hole.

公开(公告)号：US10952325B2

公开(公告)日：2021-03-16

申请号：US16451031

申请日：2019-06-25

Applicant: Unimicron Technology Corp.

Inventor： Ching-Ho Hsieh ,  Ming-Hsing Wu ,  Shang-Wei Chen

IPC: H05K7/20 ,  H05K1/14 ,  H05K1/11 ,  H05K3/36

Abstract: A printed circuit board (PCB) stack structure and method of forming the same are provided. The printed circuit board stack structure includes a first PCB, a second PCB and a connector. The first PCB includes a first pad. The second PCB includes a second pad. The connector has an annular structure, located between the first PCB and the second PCB and electrically connecting the first PCB to the second PCB. The connector includes a substrate, a first conductive elastic piece and a second conductive elastic piece. The substrate has a first surface and a second surface opposite to each other. The first conductive elastic piece is located on the first surface and in electrical contact with the first pad. The second conductive elastic piece is located on the second surface and in electrical contact with the second pad.

公开(公告)号：US20200329562A1

公开(公告)日：2020-10-15

申请号：US16451031

申请日：2019-06-25

Applicant: Unimicron Technology Corp.

Inventor： Ching-Ho Hsieh ,  Ming-Hsing Wu ,  Shang-Wei Chen

IPC: H05K1/14 ,  H05K1/11 ,  H05K3/36

Abstract: A printed circuit board (PCB) stack structure and method of forming the same are provided. The printed circuit board stack structure includes a first PCB, a second PCB and a connector. The first PCB includes a first pad. The second PCB includes a second pad. The connector has an annular structure, located between the first PCB and the second PCB and electrically connecting the first PCB to the second PCB. The connector includes a substrate, a first conductive elastic piece and a second conductive elastic piece. The substrate has a first surface and a second surface opposite to each other. The first conductive elastic piece is located on the first surface and in electrical contact with the first pad. The second conductive elastic piece is located on the second surface and in electrical contact with the second pad.

公开(公告)号：USD969745S1

公开(公告)日：2022-11-15

申请号：US29696004

申请日：2019-06-25

Applicant: Unimicron Technology Corp.

Designer： Ching-Ho Hsieh ,  Ming-Hsing Wu ,  Shang-Wei Chen ,  Kuei-Sheng Wu