公开(公告)号：US11145610B2

公开(公告)日：2021-10-12

申请号：US16729488

申请日：2019-12-30

Applicant: Unimicron Technology Corp.

Inventor： John Hon-Shing Lau ,  Yu-Chi Shen ,  Tzyy-Jang Tseng ,  Chen-Hua Cheng ,  Pei-Wei Wang

IPC: H01L23/66 ,  H01L23/31 ,  H01L21/56 ,  H01L23/00 ,  H01Q1/22

Abstract: A chip package structure includes at least one chip, at least one thermally conductive element, a molding compound, and a redistribution layer. The respective chip has an active surface and a back surface opposite to each other and a plurality of electrodes disposed on the active surface. The thermally conductive element is disposed on the back surface of the respective chip. The molding compound encapsulates the chip and the thermally conductive element and has an upper surface and a lower surface opposite to each other. A bottom surface of each of the electrodes of the respective chip is aligned with the lower surface of the molding compound. The molding compound exposes a top surface of the respective thermally conductive element. The redistribution layer is disposed on the lower surface of the molding compound and electrically connected to the electrodes of the respective chip.

公开(公告)号：US11562972B2

公开(公告)日：2023-01-24

申请号：US17463559

申请日：2021-09-01

Applicant: Unimicron Technology Corp.

Inventor： John Hon-Shing Lau ,  Yu-Chi Shen ,  Tzyy-Jang Tseng ,  Chen-Hua Cheng ,  Pei-Wei Wang

IPC: H01L21/56 ,  H01L23/66 ,  H01L23/31 ,  H01L23/00 ,  H01Q1/22

Abstract: A chip package structure includes at least one chip, at least one thermally conductive element, a molding compound, and a redistribution layer. The respective chip has an active surface and a back surface opposite to each other and a plurality of electrodes disposed on the active surface. The thermally conductive element is disposed on the back surface of the respective chip. The molding compound encapsulates the chip and the thermally conductive element and has an upper surface and a lower surface opposite to each other. A bottom surface of each of the electrodes of the respective chip is aligned with the lower surface of the molding compound. The molding compound exposes a top surface of the respective thermally conductive element. The redistribution layer is disposed on the lower surface of the molding compound and electrically connected to the electrodes of the respective chip.

公开(公告)号：US20210398925A1

公开(公告)日：2021-12-23

申请号：US17463559

申请日：2021-09-01

Applicant: Unimicron Technology Corp.

Inventor： John Hon-Shing Lau ,  Yu-Chi Shen ,  Tzyy-Jang Tseng ,  Chen-Hua Cheng ,  Pei-Wei Wang

IPC: H01L23/66 ,  H01L23/31 ,  H01L21/56 ,  H01L23/00 ,  H01Q1/22

Abstract: A chip package structure includes at least one chip, at least one thermally conductive element, a molding compound, and a redistribution layer. The respective chip has an active surface and a back surface opposite to each other and a plurality of electrodes disposed on the active surface. The thermally conductive element is disposed on the back surface of the respective chip. The molding compound encapsulates the chip and the thermally conductive element and has an upper surface and a lower surface opposite to each other. A bottom surface of each of the electrodes of the respective chip is aligned with the lower surface of the molding compound. The molding compound exposes a top surface of the respective thermally conductive element. The redistribution layer is disposed on the lower surface of the molding compound and electrically connected to the electrodes of the respective chip.

公开(公告)号：US20210202407A1

公开(公告)日：2021-07-01

申请号：US16729488

申请日：2019-12-30

Applicant: Unimicron Technology Corp.

Inventor： John Hon-Shing Lau ,  Yu-Chi Shen ,  Tzyy-Jang Tseng ,  Chen-Hua Cheng ,  Pei-Wei Wang

IPC: H01L23/66 ,  H01L23/31 ,  H01L21/56 ,  H01L23/00 ,  H01Q1/22

Abstract: A chip package structure includes at least one chip, at least one thermally conductive element, a molding compound, and a redistribution layer. The respective chip has an active surface and a back surface opposite to each other and a plurality of electrodes disposed on the active surface. The thermally conductive element is disposed on the back surface of the respective chip. The molding compound encapsulates the chip and the thermally conductive element and has an upper surface and a lower surface opposite to each other. A bottom surface of each of the electrodes of the respective chip is aligned with the lower surface of the molding compound. The molding compound exposes a top surface of the respective thermally conductive element. The redistribution layer is disposed on the lower surface of the molding compound and electrically connected to the electrodes of the respective chip.