MULTI-SENSOR
    1.
    发明申请
    MULTI-SENSOR 审中-公开

    公开(公告)号:US20170122802A1

    公开(公告)日:2017-05-04

    申请号:US15287646

    申请日:2016-10-06

    Applicant: View, Inc.

    Abstract: Various implementations relate generally to multi-sensor devices. Some implementations more particularly relate to a multi-sensor device including a ring of radially-oriented photosensors. Some implementations more particularly relate to a multi-sensor device that is orientation-independent with respect to a central axis of the ring. Some implementations of the multi-sensor devices described herein further include one or more additional sensors. For example, some implementations include an axially-directed photosensor. Some implementations also can include one or more temperature sensors configured to sense an exterior temperature, for example, an ambient temperature of an outdoors environment around the multi-sensor. Additionally or alternatively, some implementations include one or more of an infrared sensor or infrared sensors, a cellular communication circuit, and a GPS module.

    MULTI-SENSOR
    2.
    发明申请
    MULTI-SENSOR 审中-公开

    公开(公告)号:US20170097259A1

    公开(公告)日:2017-04-06

    申请号:US14998019

    申请日:2015-10-06

    Applicant: View, Inc.

    Abstract: Various implementations relate generally to a multi-sensor device. Some implementations more particularly relate to a multi-sensor device including a ring of radially-oriented photosensors. Some implementations more particularly relate to a multi-sensor device that is orientation-independent with respect to a central axis of the ring. Some implementations of the multi-sensor devices described herein also include one or more additional sensors. For example, some implementations include an axially-directed photosensor. Some implementations also can include one or more temperature sensors configured to sense an exterior temperature, for example, an ambient temperature of an outdoors environment around the multi-sensor. Additionally or alternatively, some implementations can include a temperature sensor configured to sense an interior temperature within the multi-sensor device. Particular implementations provide, characterize, or enable a compact form factor. Particular implementations provide, characterize, or enable a multi-sensor device requiring little or no wiring, and in some such instances, little or no invasion, perforation or reconstruction of a building or other structure on which the multi-sensor device is mounted.

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