公开(公告)号：US20240429122A1

公开(公告)日：2024-12-26

申请号：US18340607

申请日：2023-06-23

Applicant: WOLFSPEED, INC.

Inventor： Kyle BOTHE ,  James TWEEDIE ,  Fabian RADULESCU ,  Michael SCHUETTE ,  Jeremy FISHER ,  Basim NOORI ,  Scott SHEPPARD

IPC: H01L23/373 ,  H01L21/48 ,  H01L23/00 ,  H01L23/498

Abstract: A thermally conductive interposer includes an interposer substrate having a first substrate surface and a second substrate surface. The first substrate surface being configured to be attached to a first device component. The second substrate surface being configured to be attached to a second device component. The interposer substrate being configured to support the second device component on the first device component and integrate the first device component and the second device component within a microelectronic device. Further, the interposer substrate is configured to transfer heat between the first device component and the second device component; and the interposer substrate is configured to be electrically nonconductive.