公开(公告)号：US20240105390A1

公开(公告)日：2024-03-28

申请号：US17951523

申请日：2022-09-23

Applicant: WOLFSPEED, INC.

Inventor： Kok Meng KAM ,  Eng Wah WOO ,  Samantha CHEANG ,  Marvin MARBELL ,  Haedong JANG ,  Jeremy FISHER ,  Basim NOORI

IPC: H01G4/228 ,  H01L23/00 ,  H01L23/48 ,  H01L25/04 ,  H01L49/02

CPC classification number: H01G4/228 ,  H01L23/481 ,  H01L24/05 ,  H01L24/32 ,  H01L24/83 ,  H01L25/04 ,  H01L28/60 ,  H01L2224/05541 ,  H01L2224/05611 ,  H01L2224/05639 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/32227 ,  H01L2224/83815 ,  H01L2924/10272 ,  H01L2924/1205

Abstract: In some aspects, a device includes a substrate. A first metallization arranged on the substrate. A second metallization arranged on the substrate. A circuit arranged on the substrate and electrically connected to the first metallization and the second metallization. The first metallization and the second metallization being configured, structured, and arranged to make a solder connection to a device, where the substrate may include silicon carbide (SiC).