公开(公告)号：US20120160551A1

公开(公告)日：2012-06-28

申请号：US13413666

申请日：2012-03-07

Applicant: Yi-Chun Liu ,  Wei-Ming Cheng ,  Tsung-Yuan Chen ,  Shu-Sheng Chiang

Inventor： Yi-Chun Liu ,  Wei-Ming Cheng ,  Tsung-Yuan Chen ,  Shu-Sheng Chiang

IPC: H05K1/09 ,  H05K1/02 ,  H05K1/11

CPC classification number: H05K3/107 ,  H05K3/0032 ,  H05K3/0055 ,  H05K3/184 ,  H05K3/426 ,  H05K2201/0236 ,  H05K2203/0571 ,  H05K2203/1388 ,  Y10T29/49117 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: An embedded structure of circuit board is provided. The embedded structure of the present invention includes a dielectric layer, a pad opening disposed in the dielectric layer, and a via disposed in the pad opening and in the dielectric layer, wherein the outer surface of the dielectric layer has a substantially even surface.

Abstract translation: 提供电路板的嵌入式结构。 本发明的嵌入式结构包括电介质层，设置在电介质层中的焊盘开口以及布置在焊盘开口和电介质层中的通孔，其中电介质层的外表面具有基本均匀的表面。

公开(公告)号：US20110067909A1

公开(公告)日：2011-03-24

申请号：US12787422

申请日：2010-05-26

Applicant: Wei-Ming Cheng

Inventor： Wei-Ming Cheng

IPC: H05K1/09 ,  H05K1/00

CPC classification number: H05K3/381 ,  H05K1/0265 ,  H05K3/0032 ,  H05K3/38 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/09727 ,  H05K2201/09736 ,  H05K2201/2072 ,  H05K2203/0723

Abstract: An embedded circuit board structure and a fabricating process thereof are disclosed. The embedded circuit board structure comprises a dielectric layer and a metal layer. The dielectric layer comprises an indentation; the indentation is formed by a plurality of pits, and the pits are substantially perpendicular to the surface of the dielectric layer. The metal layer is formed within the indentation.

Abstract translation: 公开了一种嵌入式电路板结构及其制造方法。 嵌入式电路板结构包括电介质层和金属层。 介电层包括凹陷; 凹陷由多个凹坑形成，凹坑基本上垂直于介电层的表面。 金属层形成在压痕内。

公开(公告)号：US20100031502A1

公开(公告)日：2010-02-11

申请号：US12259815

申请日：2008-10-28

Applicant: Wei-Ming Cheng ,  Shao-Wei Lin ,  Pao-Chin Chen

Inventor： Wei-Ming Cheng ,  Shao-Wei Lin ,  Pao-Chin Chen

IPC: H05K3/02

CPC classification number: H05K3/0038 ,  H05K1/116 ,  H05K3/0035 ,  H05K3/064 ,  H05K3/421 ,  H05K2203/0571 ,  H05K2203/1383 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/5383

Abstract: A method for fabricating a blind via structure of a substrate is provided. First, a substrate is provided, which includes a conductive layer, a metal layer, and a dielectric layer disposed between the conductive layer and the metal layer. Next, a cover layer is formed on the conductive layer. Finally, the substrate formed with the cover layer is irradiated by a laser beam to form at least one blind via structure extending from the cover layer to the metal layer. The blind via structure includes a first opening, a second opening, and a third opening linking to one another. The first opening passes through the cover layer. The second opening passes through the conductive layer. The third opening passes through the dielectric layer. For example, a size of the first opening is greater than a size of the second opening and a size of the third opening.

Abstract translation: 提供一种用于制造基板的盲孔结构的方法。 首先，提供基板，其包括导电层，金属层和设置在导电层和金属层之间的电介质层。 接下来，在导电层上形成覆盖层。 最后，用激光束照射形成有覆盖层的基板，以形成从覆盖层向金属层延伸的至少一个盲通孔结构。 盲通孔结构包括彼此连接的第一开口，第二开口和第三开口。 第一个开口穿过覆盖层。 第二开口穿过导电层。 第三个开口穿过介电层。 例如，第一开口的尺寸大于第二开口的尺寸和第三开口的尺寸。

公开(公告)号：US5580494A

公开(公告)日：1996-12-03

申请号：US186245

申请日：1994-01-25

Applicant: Sukhvinder S. Sandhu ,  Clarence R. Robbins ,  Wei-Ming Cheng ,  Amrit Patel

Inventor： Sukhvinder S. Sandhu ,  Clarence R. Robbins ,  Wei-Ming Cheng ,  Amrit Patel

IPC: A61K8/31 ,  A61K8/34 ,  A61K8/39 ,  A61K8/41 ,  A61K8/44 ,  A61K8/46 ,  A61K8/72 ,  A61K8/73 ,  A61K8/81 ,  A61K8/891 ,  A61K8/895 ,  A61K8/898 ,  A61Q5/02 ,  A61Q5/06 ,  A61Q5/12 ,  A61Q19/10 ,  C11D1/04 ,  C11D1/40 ,  C11D1/52 ,  C11D1/62 ,  C11D1/66 ,  C11D1/83 ,  C11D3/00 ,  C11D3/18 ,  C11D3/20 ,  C11D3/30 ,  C11D3/37 ,  C11D11/00

CPC classification number: A61K8/8182 ,  A61K8/31 ,  A61K8/342 ,  A61K8/39 ,  A61K8/416 ,  A61K8/44 ,  A61K8/463 ,  A61K8/466 ,  A61K8/73 ,  A61K8/731 ,  A61K8/817 ,  A61K8/8194 ,  A61K8/891 ,  A61K8/898 ,  A61Q19/10 ,  A61Q5/02 ,  A61Q5/06 ,  A61Q5/12 ,  C11D3/0089 ,  A61K2800/5426

Abstract: An aqueous hair conditioning shampoo comprising a hair-cleansing effective amount of an anionic surfactant comprising an alpha-olefin sulfonate, a hair-conditioning effective amount of a cationic polymer having a hair conditioning effect and a charge density greater than about 200, a water-insoluble hair conditioning agent and a dispersing agent which functions to stabilize the emulsion or suspension, and the remainder water.

Abstract translation: 一种含水毛发调理洗发剂，其包含毛发清洁有效量的包含α-烯烃磺酸盐的阴离子表面活性剂，调理有效量的具有毛发调理作用的阳离子聚合物和大于约200的电荷密度， 不溶性头发调理剂和用于稳定乳液或悬浮液的分散剂，剩余的水分。

公开(公告)号：US08729397B2

公开(公告)日：2014-05-20

申请号：US13323831

申请日：2011-12-13

Applicant: Yi-Chun Liu ,  Wei-Ming Cheng ,  Tsung-Yuan Chen ,  Shu-Sheng Chiang

Inventor： Yi-Chun Liu ,  Wei-Ming Cheng ,  Tsung-Yuan Chen ,  Shu-Sheng Chiang

IPC: H05K1/00

CPC classification number: H05K3/465 ,  H05K3/0032 ,  H05K3/0035 ,  H05K3/0055 ,  H05K3/383 ,  H05K3/421 ,  H05K3/4661 ,  H05K2203/0796 ,  H05K2203/1383

Abstract: An embedded structure of circuit board is provided. The embedded structure includes a substrate, a first patterned conductive layer disposed on the substrate and selectively exposing the substrate, a first dielectric layer covering the first patterned conductive layer and the substrate, a pad opening disposed in the first dielectric layer, and a via disposed in the pad opening and exposing the first patterned conductive layer, wherein the outer surface of the first dielectric layer has a substantially even surface.

Abstract translation: 提供电路板的嵌入式结构。 所述嵌入式结构包括基板，设置在所述基板上并选择性地暴露所述基板的第一图案化导电层，覆盖所述第一图案化导电层和所述基板的第一介电层，设置在所述第一介电层中的焊盘开口， 在所述焊盘开口中并暴露所述第一图案化导电层，其中所述第一介电层的外表面具有基本上均匀的表面。

公开(公告)号：US20100065324A1

公开(公告)日：2010-03-18

申请号：US12211816

申请日：2008-09-17

Applicant: Yi-Chun Liu ,  Wei-Ming Cheng ,  Tsung-Yuan Chen ,  Shu-Sheng Chiang

Inventor： Yi-Chun Liu ,  Wei-Ming Cheng ,  Tsung-Yuan Chen ,  Shu-Sheng Chiang

IPC: H05K3/00 ,  H05K1/11

CPC classification number: H05K3/107 ,  H05K3/0032 ,  H05K3/0055 ,  H05K3/184 ,  H05K3/426 ,  H05K2201/0236 ,  H05K2203/0571 ,  H05K2203/1388 ,  Y10T29/49117 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: An embedded structure of circuit board is provided. The embedded structure of the present invention includes a dielectric layer, a pad opening disposed in the dielectric layer, and a via disposed in the pad opening and in the dielectric layer, wherein the outer surface of the dielectric layer has a substantially even surface.

Abstract translation: 提供电路板的嵌入式结构。 本发明的嵌入式结构包括电介质层，设置在电介质层中的焊盘开口以及布置在焊盘开口和电介质层中的通孔，其中电介质层的外表面具有基本均匀的表面。

公开(公告)号：US08273256B2

公开(公告)日：2012-09-25

申请号：US12793560

申请日：2010-06-03

Applicant: Shu-Sheng Chiang ,  Tsung-Yuan Chen ,  Wei-Ming Cheng

Inventor： Shu-Sheng Chiang ,  Tsung-Yuan Chen ,  Wei-Ming Cheng

IPC: H01L13/00

CPC classification number: B32B38/04 ,  B32B2311/00 ,  B32B2457/08 ,  C23C18/1608 ,  C23C18/1653 ,  C23C18/1831 ,  C23C18/31 ,  H05K3/107

Abstract: A method for manufacturing a wiring structure of a wiring board is provided. In the method, a substrate including an insulation layer and a film disposed on the insulation layer is provided. Next, a barrier layer completely covering the film is formed. Next, an intaglio pattern partially exposing the insulation layer is formed on an outer surface of the barrier layer. Next, an activated layer is formed on the outer surface and in the intaglio pattern. Then, the activated layer on the outer surface is removed, and the activated layer in the intaglio pattern is remained. After the activated layer on the outer surface is removed, a conductive material is formed in the intaglio pattern by using a chemical deposition method. After forming the conductive material, the barrier layer and the film are removed.

Abstract translation: 提供一种用于制造布线板的布线结构的方法。 在该方法中，提供了包括绝缘层和设置在绝缘层上的膜的衬底。 接下来，形成完全覆盖该膜的阻挡层。 接下来，在阻挡层的外表面上形成部分地露出绝缘层的凹版图案。 接下来，在外表面和凹版图案中形成活化层。 然后，去除外表面上的活化层，并保留凹版图案中的活化层。 在去除外表面上的活化层之后，通过使用化学沉积方法在凹版图案中形成导电材料。 在形成导电材料之后，去除阻挡层和膜。

公开(公告)号：US08273651B2

公开(公告)日：2012-09-25

申请号：US12815155

申请日：2010-06-14

Applicant: Shu-Sheng Chiang ,  Tsung-Yuan Chen ,  Wei-Ming Cheng

Inventor： Shu-Sheng Chiang ,  Tsung-Yuan Chen ,  Wei-Ming Cheng

IPC: H01L21/4763

CPC classification number: H05K1/05 ,  H05K3/18

Abstract: A method for fabricating a wiring structure of a wiring board is provided. First, a substrate including an insulation layer and a film disposed on the insulation layer is provided. Next, an intaglio pattern exposing the insulation layer is formed on an outer surface of the film. The intaglio pattern is formed by removing a portion of the insulation layer and a portion of the film. Next, an activated layer is formed on the outer surface and in the intaglio pattern. The activated layer completely covers the outer surface and all surfaces of the intaglio pattern. Then, the film and the activated layer on the outer surface are removed, and the activated layer in the intaglio pattern is remained. After the film and the activated layer on the outer surface are removed, a conductive material is formed in the intaglio pattern by chemical deposition method.

Abstract translation: 提供一种制造布线板的布线结构的方法。 首先，提供包括绝缘层和设置在绝缘层上的膜的衬底。 接下来，在膜的外表面上形成露出绝缘层的凹版图案。 通过去除绝缘层的一部分和膜的一部分来形成凹版图案。 接下来，在外表面和凹版图案中形成活化层。 活化层完全覆盖凹版图案的外表面和所有表面。 然后，去除外表面上的膜和活化层，并保留凹版图案中的活化层。 在去除外表面上的膜和活化层之后，通过化学沉积法在凹版图案中形成导电材料。

公开(公告)号：US20120085569A1

公开(公告)日：2012-04-12

申请号：US13323831

申请日：2011-12-13

Applicant: Yi-Chun Liu ,  Wei-Ming Cheng ,  Tsung-Yuan Chen ,  Shu-Sheng Chiang

Inventor： Yi-Chun Liu ,  Wei-Ming Cheng ,  Tsung-Yuan Chen ,  Shu-Sheng Chiang

IPC: H05K1/09

CPC classification number: H05K3/465 ,  H05K3/0032 ,  H05K3/0035 ,  H05K3/0055 ,  H05K3/383 ,  H05K3/421 ,  H05K3/4661 ,  H05K2203/0796 ,  H05K2203/1383

Abstract: An embedded structure of circuit board is provided. The embedded structure includes a substrate, a first patterned conductive layer disposed on the substrate and selectively exposing the substrate, a first dielectric layer covering the first patterned conductive layer and the substrate, a pad opening disposed in the first dielectric layer, and a via disposed in the pad opening and exposing the first patterned conductive layer, wherein the outer surface of the first dielectric layer has a substantially even surface.

Abstract translation: 提供电路板的嵌入式结构。 所述嵌入式结构包括基板，设置在所述基板上并选择性地暴露所述基板的第一图案化导电层，覆盖所述第一图案化导电层和所述基板的第一介电层，设置在所述第一介电层中的焊盘开口， 在所述焊盘开口中并暴露所述第一图案化导电层，其中所述第一介电层的外表面具有基本上均匀的表面。

公开(公告)号：US08037586B2

公开(公告)日：2011-10-18

申请号：US12259815

申请日：2008-10-28

Applicant: Wei-Ming Cheng ,  Shao-Wei Lin ,  Pao-Chin Chen

Inventor： Wei-Ming Cheng ,  Shao-Wei Lin ,  Pao-Chin Chen

IPC: H01K3/10

CPC classification number: H05K3/0038 ,  H05K1/116 ,  H05K3/0035 ,  H05K3/064 ,  H05K3/421 ,  H05K2203/0571 ,  H05K2203/1383 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/5383

Abstract: A method for fabricating a blind via structure of a substrate is provided. First, a substrate is provided, which includes a conductive layer, a metal layer, and a dielectric layer disposed between the conductive layer and the metal layer. Next, a cover layer is formed on the conductive layer. Finally, the substrate formed with the cover layer is irradiated by a laser beam to form at least one blind via structure extending from the cover layer to the metal layer. The blind via structure includes a first opening, a second opening, and a third opening linking to one another. The first opening passes through the cover layer. The second opening passes through the conductive layer. The third opening passes through the dielectric layer. For example, a size of the first opening is greater than a size of the second opening and a size of the third opening.

Abstract translation: 提供一种用于制造基板的盲孔结构的方法。 首先，提供基板，其包括导电层，金属层和设置在导电层和金属层之间的电介质层。 接下来，在导电层上形成覆盖层。 最后，用激光束照射形成有覆盖层的基板，以形成从覆盖层向金属层延伸的至少一个盲通孔结构。 盲通孔结构包括彼此连接的第一开口，第二开口和第三开口。 第一个开口穿过覆盖层。 第二开口穿过导电层。 第三个开口穿过介电层。 例如，第一开口的尺寸大于第二开口的尺寸和第三开口的尺寸。