公开(公告)号：US20250151255A1

公开(公告)日：2025-05-08

申请号：US19016032

申请日：2025-01-10

Applicant: Winbond Electronics Corp.

Inventor： Yu-Ping HSIAO ,  Cheol-Soo PARK ,  Chun-Hung CHENG ,  Wei-Chieh CHUANG ,  Wei-Chao CHOU ,  Yen-Min JUAN

IPC: H10B12/00 ,  H01G4/008 ,  H01G4/01

Abstract: A capacitor includes cup-shaped lower electrodes disposed on a substrate, a capacitor dielectric layer conformally covering inner surfaces and outer surfaces of the cup-shaped lower electrodes, and a support layer disposed between outer surfaces of the cup-shaped lower electrodes to connect the cup-shaped lower electrodes. The capacitor further includes an annealed oxide layer, which is interposed between the inner surfaces of the cup-shaped lower electrodes and the capacitor dielectric layer, and is also interposed between a portion of the outer surfaces of the cup-shaped lower electrodes and the capacitor dielectric layer. A method for forming the capacitor is also provided.

公开(公告)号：US20220415891A1

公开(公告)日：2022-12-29

申请号：US17592751

申请日：2022-02-04

Applicant: Winbond Electronics Corp.

Inventor： Yu-Ping HSIAO ,  Cheol-Soo PARK ,  Chun-Hung CHENG ,  Wei-Chieh CHUANG ,  Wei-Chao CHOU ,  Yen-Min JUAN

IPC: H01L27/108 ,  H01G4/01 ,  H01G4/008

Abstract: A capacitor includes cup-shaped lower electrodes disposed on a substrate, a capacitor dielectric layer conformally covering inner surfaces and outer surfaces of the cup-shaped lower electrodes, and a support layer disposed between outer surfaces of the cup-shaped lower electrodes to connect the cup-shaped lower electrodes. The capacitor further includes an annealed oxide layer, which is interposed between the inner surfaces of the cup-shaped lower electrodes and the capacitor dielectric layer, and is also interposed between a portion of the outer surfaces of the cup-shaped lower electrodes and the capacitor dielectric layer. A method for forming the capacitor is also provided.