公开(公告)号：US20090175323A1

公开(公告)日：2009-07-09

申请号：US11970549

申请日：2008-01-08

Applicant: Woo Cheol Chung

Inventor： Woo Cheol Chung

IPC: H04B1/38

CPC classification number: H05K1/0243 ,  H01L23/48 ,  H01L25/0655 ,  H01L25/0657 ,  H01L2223/6677 ,  H01L2224/16145 ,  H01L2225/06527 ,  H01L2225/06562 ,  H01Q1/2266 ,  H01Q1/521 ,  H01Q17/00 ,  H05K1/0298 ,  H05K1/181 ,  H05K2201/086 ,  H05K2201/10098 ,  H05K2201/10515 ,  H05K2201/10674

Abstract: Wireless chip-to-chip communications are methods and devices are disclosed. In an example, a wireless chip-to-chip communication device includes a plurality of chips, each of the plurality of chips having at least one antenna and formed on a multi-layered structure. The multi-layered structure includes first and second absorption layers. The first and second absorption layers are configured to enclose a propagation medium having a given dielectric constant. The plurality of chips are configured to wirelessly communicate with each other via the respective antennas in accordance with a given wireless communication protocol via a direct propagation path within the propagation medium.

Abstract translation: 无线芯片到芯片通信是公开的方法和设备。 在一个示例中，无线芯片到芯片通信设备包括多个芯片，所述多个芯片中的每一个具有至少一个天线并且以多层结构形成。 多层结构包括第一和第二吸收层。 第一和第二吸收层被配置为包围具有给定介电常数的传播介质。 多个芯片被配置为经由相应的天线根据给定的无线通信协议通过传播介质内的直接传播路径彼此无线地进行通信。

公开(公告)号：US07873122B2

公开(公告)日：2011-01-18

申请号：US11970549

申请日：2008-01-08

Applicant: Woo Cheol Chung

Inventor： Woo Cheol Chung

IPC: H04L27/00 ,  H03K9/00

CPC classification number: H05K1/0243 ,  H01L23/48 ,  H01L25/0655 ,  H01L25/0657 ,  H01L2223/6677 ,  H01L2224/16145 ,  H01L2225/06527 ,  H01L2225/06562 ,  H01Q1/2266 ,  H01Q1/521 ,  H01Q17/00 ,  H05K1/0298 ,  H05K1/181 ,  H05K2201/086 ,  H05K2201/10098 ,  H05K2201/10515 ,  H05K2201/10674

Abstract: Wireless chip-to-chip communications are methods and devices are disclosed. In an example, a wireless chip-to-chip communication device includes a plurality of chips, each of the plurality of chips having at least one antenna and formed on a multi-layered structure. The multi-layered structure includes first and second absorption layers. The first and second absorption layers are configured to enclose a propagation medium having a given dielectric constant. The plurality of chips are configured to wirelessly communicate with each other via the respective antennas in accordance with a given wireless communication protocol via a direct propagation path within the propagation medium.

Abstract translation: 无线芯片到芯片通信是公开的方法和设备。 在一个示例中，无线芯片到芯片通信设备包括多个芯片，所述多个芯片中的每一个具有至少一个天线并且以多层结构形成。 多层结构包括第一和第二吸收层。 第一和第二吸收层被配置为包围具有给定介电常数的传播介质。 多个芯片被配置为经由相应的天线根据给定的无线通信协议经由传播介质内的直接传播路径彼此无线地进行通信。

公开(公告)号：US20140020728A1

公开(公告)日：2014-01-23

申请号：US13554990

申请日：2012-07-20

Applicant: Woo Cheol Chung

Inventor： Woo Cheol Chung

IPC: H01L35/32

CPC classification number: H01L35/30 ,  H01L24/48 ,  H01L24/49 ,  H01L25/16 ,  H01L35/32 ,  H01L2224/16225 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/49 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1425 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

Abstract: An apparatus, a method, and a computer program product are provided. The apparatus may be an electronic component. The electronic component includes at least one energy harvester coupled between at least one pair of hot and cold regions of the electronic component and configured to convert thermal energy to electrical energy in order to provide power to at least the electronic component, the at least one energy harvester including a radiative thermal channel or a conductive thermal channel. A first end of the conductive thermal channel is coupled to a first semiconductor material and a second end of the conductive thermal channel is coupled to a second semiconductor material, the first semiconductor material being coupled to the hot region and isolated from the cold region and the second semiconductor material being coupled to the cold region and isolated from the hot region.

Abstract translation: 提供了一种装置，方法和计算机程序产品。 该装置可以是电子部件。 电子部件包括耦合在电子部件的至少一对热区域和冷区域之间的至少一个能量收集器，并且被配置为将热能转换成电能，以向至少一个电子部件提供能量，至少一个能量 收割机包括辐射热通道或导电热通道。 导电热通道的第一端耦合到第一半导体材料，并且导电热通道的第二端耦合到第二半导体材料，第一半导体材料耦合到热区并与冷区分离， 第二半导体材料耦合到冷区并与热区分离。

公开(公告)号：US09190595B2

公开(公告)日：2015-11-17

申请号：US13554990

申请日：2012-07-20

Applicant: Woo Cheol Chung

Inventor： Woo Cheol Chung

IPC: H01L35/30 ,  H01L35/32 ,  H01L23/00 ,  H01L25/16

CPC classification number: H01L35/30 ,  H01L24/48 ,  H01L24/49 ,  H01L25/16 ,  H01L35/32 ,  H01L2224/16225 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/49 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1425 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

Abstract: An apparatus, a method, and a computer program product are provided. The apparatus may be an electronic component. The electronic component includes at least one energy harvester coupled between at least one pair of hot and cold regions of the electronic component and configured to convert thermal energy to electrical energy in order to provide power to at least the electronic component, the at least one energy harvester including a radiative thermal channel or a conductive thermal channel. A first end of the conductive thermal channel is coupled to a first semiconductor material and a second end of the conductive thermal channel is coupled to a second semiconductor material, the first semiconductor material being coupled to the hot region and isolated from the cold region and the second semiconductor material being coupled to the cold region and isolated from the hot region.

Abstract translation: 提供了一种装置，方法和计算机程序产品。 该装置可以是电子部件。 电子部件包括耦合在电子部件的至少一对热区域和冷区域之间的至少一个能量收集器，并且被配置为将热能转换成电能，以向至少一个电子部件提供能量，至少一个能量 收割机包括辐射热通道或导电热通道。 导电热通道的第一端耦合到第一半导体材料，并且导电热通道的第二端耦合到第二半导体材料，第一半导体材料耦合到热区并与冷区分离， 第二半导体材料耦合到冷区并与热区分离。