公开(公告)号：US20210043816A1

公开(公告)日：2021-02-11

申请号：US16532591

申请日：2019-08-06

Applicant: X-Celeprint Limited

Inventor： Christopher Andrew Bower ,  Matthew Alexander Meitl ,  Ronald S. Cok ,  Salvatore Bonafede ,  Brook Raymond ,  Andrew Tyler Pearson

IPC: H01L33/62

Abstract: A printed structure includes a destination substrate comprising two or more contact pads disposed on or in a surface of the destination substrate, a component disposed on the surface, and two or more electrically conductive connection posts. Each of the connection posts extends from a common side of the component. Each of the connection posts is in electrical and physical contact with one of the contact pads. The component is tilted with respect to the surface of the destination substrate. Each of the connection posts has a flat distal surface.

公开(公告)号：US10748793B1

公开(公告)日：2020-08-18

申请号：US16274969

申请日：2019-02-13

Applicant: X-Celeprint Limited

Inventor： Andrew Tyler Pearson ,  Erich Radauscher ,  Christopher Michael Verreen ,  Matthew Alexander Meitl ,  Christopher Andrew Bower ,  Ronald S. Cok

IPC: H01L21/67 ,  H01L25/075 ,  B65G47/90 ,  B41F16/00 ,  H01L33/62

Abstract: A method of micro-transfer printing comprises providing a component source wafer and components disposed in, on, or over the component source wafer. A destination substrate and a stamp for transferring the components from the component source wafer to the destination substrate is provided. The component source wafer has an attribute or structure that varies across the component source wafer that affects the structure, operation, appearance, or performance of the components. A first array of components is transferred from the component source wafer to the destination substrate with a first orientation. A second array of components is transferred from the component source wafer to the destination substrate with a second orientation different from the first orientation. Components can be transferred by micro-transfer printing and different orientations can be a different rotation, overlap, interlacing, or offset.

公开(公告)号：US20200258761A1

公开(公告)日：2020-08-13

申请号：US16274969

申请日：2019-02-13

Applicant: X-Celeprint Limited

Inventor： Andrew Tyler Pearson ,  Erich Radauscher ,  Christopher Michael Verreen ,  Matthew Alexander Meitl ,  Christopher Andrew Bower ,  Ronald S. Cok

IPC: H01L21/67 ,  H01L25/075 ,  H01L33/62 ,  B65G47/90 ,  B41F16/00

Abstract: A method of micro-transfer printing comprises providing a component source wafer and components disposed in, on, or over the component source wafer. A destination substrate and a stamp for transferring the components from the component source wafer to the destination substrate is provided. The component source wafer has an attribute or structure that varies across the component source wafer that affects the structure, operation, appearance, or performance of the components. A first array of components is transferred from the component source wafer to the destination substrate with a first orientation. A second array of components is transferred from the component source wafer to the destination substrate with a second orientation different from the first orientation. Components can be transferred by micro-transfer printing and different orientations can be a different rotation, overlap, interlacing, or offset.

公开(公告)号：US20200051482A1

公开(公告)日：2020-02-13

申请号：US16101717

申请日：2018-08-13

Applicant: X-Celeprint Limited

Inventor： Ronald S. Cok ,  Erich Radauscher ,  Erik Paul Vick ,  Andrew Tyler Pearson ,  Christopher Andrew Bower ,  Matthew Alexander Meitl

IPC: G09G3/20 ,  G09G3/32

Abstract: A redundant pixel layout for a display comprises a display substrate and an array of pixels disposed on or over the display substrate. Each pixel comprises a first subpixel and a redundant second subpixel. The first subpixel includes a first subpixel controller electrically connected to controller wires and a first light emitter electrically connected to a first-light-emitter wire. The first light emitter is controlled by the first subpixel controller through the first-light-emitter wire. The second subpixel includes a second-subpixel-controller location connected to the controller wires and a second-light-emitter location comprising a second-light-emitter wire. The first light emitter is adjacent to the second-light-emitter location and the first light emitter and the second-light-emitter location are closer together than are any two pixels in the array of pixels.