公开(公告)号：US10748793B1

公开(公告)日：2020-08-18

申请号：US16274969

申请日：2019-02-13

Applicant: X-Celeprint Limited

Inventor： Andrew Tyler Pearson ,  Erich Radauscher ,  Christopher Michael Verreen ,  Matthew Alexander Meitl ,  Christopher Andrew Bower ,  Ronald S. Cok

IPC: H01L21/67 ,  H01L25/075 ,  B65G47/90 ,  B41F16/00 ,  H01L33/62

Abstract: A method of micro-transfer printing comprises providing a component source wafer and components disposed in, on, or over the component source wafer. A destination substrate and a stamp for transferring the components from the component source wafer to the destination substrate is provided. The component source wafer has an attribute or structure that varies across the component source wafer that affects the structure, operation, appearance, or performance of the components. A first array of components is transferred from the component source wafer to the destination substrate with a first orientation. A second array of components is transferred from the component source wafer to the destination substrate with a second orientation different from the first orientation. Components can be transferred by micro-transfer printing and different orientations can be a different rotation, overlap, interlacing, or offset.

公开(公告)号：US20200258761A1

公开(公告)日：2020-08-13

申请号：US16274969

申请日：2019-02-13

Applicant: X-Celeprint Limited

Inventor： Andrew Tyler Pearson ,  Erich Radauscher ,  Christopher Michael Verreen ,  Matthew Alexander Meitl ,  Christopher Andrew Bower ,  Ronald S. Cok

IPC: H01L21/67 ,  H01L25/075 ,  H01L33/62 ,  B65G47/90 ,  B41F16/00

Abstract: A method of micro-transfer printing comprises providing a component source wafer and components disposed in, on, or over the component source wafer. A destination substrate and a stamp for transferring the components from the component source wafer to the destination substrate is provided. The component source wafer has an attribute or structure that varies across the component source wafer that affects the structure, operation, appearance, or performance of the components. A first array of components is transferred from the component source wafer to the destination substrate with a first orientation. A second array of components is transferred from the component source wafer to the destination substrate with a second orientation different from the first orientation. Components can be transferred by micro-transfer printing and different orientations can be a different rotation, overlap, interlacing, or offset.