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    METHODS OF MAKING PRINTED STRUCTURES
    1.
    发明申请
    METHODS OF MAKING PRINTED STRUCTURES 审中-公开

    公开(公告)号：US20200214141A1

    公开(公告)日：2020-07-02

    申请号：US16722935

    申请日：2019-12-20

    Applicant: X-Celeprint Limited

    Inventor： Christopher Andrew Bower ,  Matthew Alexander Meitl ,  Brook Raymond ,  Salvatore Bonafede

    IPC: H05K3/32 ,  H05K1/11 ,  H05K1/18 ,  B32B7/14 ,  B32B37/10 ,  B32B37/12 ,  B32B37/16 ,  B32B37/26

    Abstract: An example of a method of making a printed structure comprises providing a destination substrate, contact pads disposed on the destination substrate, and a layer of adhesive disposed on the destination substrate. A stamp with a component adhered to the stamp is provided. The component comprises a stamp side in contact with the stamp and a post side opposite the stamp side, a circuit, and connection posts extending from the post side. Each of the connection posts is electrically connected to the circuit. The component is pressed into contact with the adhesive layer to adhere the component to the destination substrate and to form a printed structure having a volume defined between the component and the destination substrate. The stamp is removed and the printed structure is processed to fill or reduce the volume.

    Printing component arrays with different orientations
    7.
    发明授权
    Printing component arrays with different orientations 有权

    公开(公告)号：US10748793B1

    公开(公告)日：2020-08-18

    申请号：US16274969

    申请日：2019-02-13

    Applicant: X-Celeprint Limited

    Inventor： Andrew Tyler Pearson ,  Erich Radauscher ,  Christopher Michael Verreen ,  Matthew Alexander Meitl ,  Christopher Andrew Bower ,  Ronald S. Cok

    IPC: H01L21/67 ,  H01L25/075 ,  B65G47/90 ,  B41F16/00 ,  H01L33/62

    Abstract: A method of micro-transfer printing comprises providing a component source wafer and components disposed in, on, or over the component source wafer. A destination substrate and a stamp for transferring the components from the component source wafer to the destination substrate is provided. The component source wafer has an attribute or structure that varies across the component source wafer that affects the structure, operation, appearance, or performance of the components. A first array of components is transferred from the component source wafer to the destination substrate with a first orientation. A second array of components is transferred from the component source wafer to the destination substrate with a second orientation different from the first orientation. Components can be transferred by micro-transfer printing and different orientations can be a different rotation, overlap, interlacing, or offset.

    PRINTING COMPONENT ARRAYS WITH DIFFERENT ORIENTATIONS
    8.
    发明申请
    PRINTING COMPONENT ARRAYS WITH DIFFERENT ORIENTATIONS 审中-公开

    公开(公告)号：US20200258761A1

    公开(公告)日：2020-08-13

    申请号：US16274969

    申请日：2019-02-13

    Applicant: X-Celeprint Limited

    Inventor： Andrew Tyler Pearson ,  Erich Radauscher ,  Christopher Michael Verreen ,  Matthew Alexander Meitl ,  Christopher Andrew Bower ,  Ronald S. Cok

    IPC: H01L21/67 ,  H01L25/075 ,  H01L33/62 ,  B65G47/90 ,  B41F16/00

    Abstract: A method of micro-transfer printing comprises providing a component source wafer and components disposed in, on, or over the component source wafer. A destination substrate and a stamp for transferring the components from the component source wafer to the destination substrate is provided. The component source wafer has an attribute or structure that varies across the component source wafer that affects the structure, operation, appearance, or performance of the components. A first array of components is transferred from the component source wafer to the destination substrate with a first orientation. A second array of components is transferred from the component source wafer to the destination substrate with a second orientation different from the first orientation. Components can be transferred by micro-transfer printing and different orientations can be a different rotation, overlap, interlacing, or offset.

    Micro-transfer printing with selective component removal
    9.
    发明授权
    Micro-transfer printing with selective component removal 有权

    公开(公告)号：US10573544B1

    公开(公告)日：2020-02-25

    申请号：US16163559

    申请日：2018-10-17

    Applicant: X-Celeprint Limited

    Inventor： Erich Radauscher ,  Ronald S. Cok ,  Christopher Andrew Bower ,  Matthew Alexander Meitl

    IPC: H01L21/67 ,  H01L21/68 ,  H01L21/66 ,  H01L21/683 ,  H01L25/075

    Abstract: An example of a method of micro-transfer printing comprises providing a micro-transfer printable component source wafer, providing a stamp comprising a body and spaced-apart posts, and providing a light source for controllably irradiating each of the posts with light through the body. Each of the posts is contacted to a component to adhere the component thereto. The stamp with the adhered components is removed from the component source wafer. The selected posts are irradiated through the body with the light to detach selected components adhered to selected posts from the selected posts, leaving non-selected components adhered to non-selected posts. In some embodiments, using the stamp, the selected components are adhered to a provided destination substrate. In some embodiments, the selected components are discarded. An example micro-transfer printing system comprises a stamp comprising a body and spaced-apart posts and a light source for selectively irradiating each of the posts with light.

    MICRO-LIGHT-EMITTING-DIODE DISPLAYS
    10.
    发明申请
    MICRO-LIGHT-EMITTING-DIODE DISPLAYS 审中-公开

    公开(公告)号：US20200020676A1

    公开(公告)日：2020-01-16

    申请号：US16033159

    申请日：2018-07-11

    Applicant: X-Celeprint Limited

    Inventor： Ronald S. Cok ,  Matthew Alexander Meitl ,  Christopher Andrew Bower

    IPC: H01L25/16 ,  G09G3/3225

    Abstract: An exemplary active-matrix display comprises pixels disposed in a pixel array and pixel micro-controllers disposed in a controller array on a display substrate. Each of the pixels comprises micro-light-emitting elements that emit different color light. Each of the pixel micro-controllers is electrically connected to control the micro-light-emitting elements in each of two or more adjacent pixels in the pixel array. A spatial separation between pixels is greater than a spatial separation between the micro-light-emitting elements and is greater than a size of each of the micro-light-emitting elements. The micro-light-emitting elements in each of the pixels are disposed in a common pixel direction orthogonal to a pixel micro-controller center line an element distance substantially equal to or greater than one quarter of the extent of the pixel micro-controller in the common pixel direction from the center line. The pixel direction for each pixel controlled by a common pixel micro-controller is different.

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