Self-aligned metal oxide thin film transistor and method of making same
    2.
    发明授权
    Self-aligned metal oxide thin film transistor and method of making same 有权
    自对准金属氧化物薄膜晶体管及其制造方法

    公开(公告)号:US09379251B1

    公开(公告)日:2016-06-28

    申请号:US14591189

    申请日:2015-01-07

    Abstract: A method for forming a TFT includes providing a substrate, a gate electrode on the substrate, an electrically insulating layer on the substrate to totally cover the gate electrode, a channel layer on the electrically insulating layer, a first photoresist pattern on the channel layer, a metal layer on the electrically insulating layer, the channel layer and the first photoresist layer, and a second photoresist pattern on the metal layer. A middle portion of the metal layer is then removed to form a source electrode and a drain electrode and to expose the first photoresist pattern and a portion of the channel layer between the first and second photoresist patterns. The exposed portion of the channel layer is then processed to have its electrical conductivity be lowered to thereby reduce a hot-carrier effect of the channel layer.

    Abstract translation: 一种用于形成TFT的方法,包括:在基板上设置基板,栅电极,在基板上形成电绝缘层,以完全覆盖栅电极,电绝缘层上的沟道层,沟道层上的第一光刻胶图案, 电绝缘层上的金属层,沟道层和第一光致抗蚀剂层,以及金属层上的第二光致抗蚀剂图案。 然后去除金属层的中间部分以形成源电极和漏电极,并且在第一和第二光致抗蚀剂图案之间露出第一光致抗蚀剂图案和沟道层的一部分。 然后处理通道层的暴露部分以使其导电性降低,从而降低沟道层的热载流子效应。

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