Abstract:
A manufacturing method of a thin film transistor includes hard-baking and etching processes for a stop layer. Two through holes are exposed and developed in a photoresistor layer, in which a distance between the two through holes is substantially equal to the channel length of the thin film transistor. Further, the etching stop layer is dry-etched to obtain the thin film transistor having an expected channel length.
Abstract:
A touch device includes a first conducting layer, a second conducting layer, and a resistance reduction layer. The first conducting layer is insulated to the second conducting layer to form a touch sensing structure. The resistance reduction layer is coupled to the first conducting layer. A combination of the resistance reduction layer and the first conducting layer has a resistance that is less than an intrinsic resistance of the first conducting layer.
Abstract:
A thin film transistor includes a gate electrode, a gate insulating layer, a channel layer, an etching stop layer, two contact holes, a source, and a drain. The gate insulating layer covers the gate electrode. The channel layer is arranged on the gate insulating layer corresponding to the gate electrode. The etching stop layer covers the channel layer and includes an organic stop layer and a hard mask layer, the hard mask layer is located on a surface of the organic stop layer opposite to the channel layer to enhance a hardness of the organic stop layer. The two contact holes pass through the etching stop layer. The source connects to the channel via one contact hole, and the drain connects to the channel via the other contact hole.