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    METHOD OF FABRICATING FILM CIRCUIT SUBSTRATE AND METHOD OF FABRICATING CHIP PACKAGE INCLUDING THE SAME
    1.
    发明申请
    METHOD OF FABRICATING FILM CIRCUIT SUBSTRATE AND METHOD OF FABRICATING CHIP PACKAGE INCLUDING THE SAME 审中-公开
    制造薄膜电路基板的方法及其制造方法

    公开(公告)号：US20120021600A1

    公开(公告)日：2012-01-26

    申请号：US13184810

    申请日：2011-07-18

    Applicant: Sang-Uk Han ,  Dae-Woo Son ,  Kwan-Jai Lee ,  Ye-Chung Chung ,  Jeong-Kyu Ha ,  Yun-Young Kim

    Inventor： Sang-Uk Han ,  Dae-Woo Son ,  Kwan-Jai Lee ,  Ye-Chung Chung ,  Jeong-Kyu Ha ,  Yun-Young Kim

    IPC: H01L21/283

    CPC classification number: H01L23/4985 ,  H01L23/49811 ,  H01L23/49838 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A method of fabricating a film circuit substrate and a method of fabricating a chip package. The method of fabricating a film circuit substrate can include providing a base film including a chip packaging area to package a chip and a separation area to separate the two chip packaging areas from each other, the separation area including a cut area and an uncut area; forming a reserve interconnection pattern having a first height on the base film; and forming an interconnection pattern having a second height that is lower than the first height on the out area by selectively etching the reserve interconnection pattern of the cut area.

    Abstract translation: 薄膜电路基板的制造方法以及芯片封装的制造方法。 制造薄膜电路基板的方法可以包括提供包括芯片封装区域以包装芯片的基膜和分离区域，以将两个芯片封装区域彼此分离，分离区域包括切割区域和未切割区域; 在基膜上形成具有第一高度的保留互连图案; 以及通过选择性地蚀刻所述切割区域的预留互连图案，形成具有低于所述外部区域上的所述第一高度的第二高度的互连图案。

    Low-cost flexible film package module and method of manufacturing the same
    3.
    发明授权
    Low-cost flexible film package module and method of manufacturing the same 有权
    低成本的柔性薄膜封装模块及其制造方法

    公开(公告)号：US07109575B2

    公开(公告)日：2006-09-19

    申请号：US10862337

    申请日：2004-06-08

    Applicant: Sa-Yoon Kang ,  Dong-Han Kim ,  Ye-Chung Chung

    Inventor： Sa-Yoon Kang ,  Dong-Han Kim ,  Ye-Chung Chung

    IPC: H01L23/02 ,  H01L23/48 ,  H01L23/12 ,  H01L23/52 ,  H01L29/40

    CPC classification number: G02F1/13452 ,  H01L23/5387 ,  H01L2224/16 ,  H01L2924/07811 ,  H05K1/118 ,  H05K1/147 ,  H05K2201/068 ,  H05K2201/10681 ,  H01L2924/00

    Abstract: Provided are a flexible film package module and a method of manufacturing the same that can be adapted for manufacture at lower cost and/or to adapt the characteristics of the flexible film package module for specific applications. The lower-cost flexible film package module includes a tape film that combines both a first insulating substrate, typically formed from a higher-cost polyimide material, and a second insulating substrate, typically formed from an insulating material or materials that are less expensive and/or provide modified performance when compared with the first insulating material. Both the first and second substrates will include complementary circuit patterns that will be electrically and physically connected to allow the composite substrate to function as a unitary substrate. The first and second substrates will also include connection regions that may be adapted for connection to printed circuit boards and/or electronic devices such as liquid crystal displays.

    Abstract translation: 提供了一种柔性膜封装模块及其制造方法，其可以适于以更低成本制造和/或适应特定应用的柔性膜封装模块的特性。 较低成本的柔性膜封装模块包括一个胶带，其将通常由较高成本的聚酰亚胺材料形成的第一绝缘基板和通常由绝缘材料形成的第二绝缘基板或较便宜的材料和/ 或者与第一绝缘材料相比提供改进的性能。 第一和第二基板都将包括互补的电路图案，其将被电和物理连接，以允许复合基板作为整体基板。 第一和第二基板还将包括可适于连接到印刷电路板和/或诸如液晶显示器的电子设备的连接区域。

    Low-cost flexible film package module and method of manufacturing the same
    6.
    发明申请
    Low-cost flexible film package module and method of manufacturing the same 有权
    低成本的柔性薄膜封装模块及其制造方法

    公开(公告)号：US20050040504A1

    公开(公告)日：2005-02-24

    申请号：US10862337

    申请日：2004-06-08

    Applicant: Sa-Yoon Kang ,  Dong-Han Kim ,  Ye-Chung Chung

    Inventor： Sa-Yoon Kang ,  Dong-Han Kim ,  Ye-Chung Chung

    IPC: H01L21/60 ,  G02F1/13 ,  G02F1/1345 ,  H01L23/538 ,  H05K1/11 ,  H05K1/14 ,  H01L23/02

    CPC classification number: G02F1/13452 ,  H01L23/5387 ,  H01L2224/16 ,  H01L2924/07811 ,  H05K1/118 ,  H05K1/147 ,  H05K2201/068 ,  H05K2201/10681 ,  H01L2924/00

    Abstract: Provided are a flexible film package module and a method of manufacturing the same that can be adapted for manufacture at lower cost and/or to adapt the characteristics of the flexible film package module for specific applications. The lower-cost flexible film package module includes a tape film that combines both a first insulating substrate, typically formed from a higher-cost polyimide material, and a second insulating substrate, typically formed from an insulating material or materials that are less expensive and/or provide modified performance when compared with the first insulating material. Both the first and second substrates will include complementary circuit patterns that will be electrically and physically connected to allow the composite substrate to function as a unitary substrate. The first and second substrates will also include connection regions that may be adapted for connection to printed circuit boards and/or electronic devices such as liquid crystal displays.

    Abstract translation: 提供了一种柔性膜封装模块及其制造方法，其可以适于以更低成本制造和/或适应特定应用的柔性膜封装模块的特性。 较低成本的柔性膜封装模块包括一个胶带，其将通常由较高成本的聚酰亚胺材料形成的第一绝缘基板和通常由绝缘材料形成的第二绝缘基板或较便宜的材料和/ 或者与第一绝缘材料相比提供改进的性能。 第一和第二基板都将包括互补的电路图案，其将被电和物理连接，以允许复合基板作为整体基板。 第一和第二基板还将包括可适于连接到印刷电路板和/或诸如液晶显示器的电子设备的连接区域。

    Tape package having test pad on reverse surface and method for testing the same
    8.
    发明授权
    Tape package having test pad on reverse surface and method for testing the same 有权
    带背面测试垫的磁带包装及其测试方法

    公开(公告)号：US07217990B2

    公开(公告)日：2007-05-15

    申请号：US10753828

    申请日：2004-01-05

    Applicant: Ye-Chung Chung

    Inventor： Ye-Chung Chung

    IPC: H01L23/495

    CPC classification number: H01L22/32 ,  H01L23/49572 ,  H01L2224/16 ,  H01L2224/73204 ,  H01L2924/01078 ,  H01L2924/01079 ,  H05K1/0268 ,  H05K1/0393 ,  H05K2201/0949 ,  H05K2203/1545

    Abstract: A tape package in which a test pad is formed on a reverse surface is provided. The test pad is disposed on a reverse surface of a base film through a through hole of the base film. Accordingly, shapes of the test pads are standardized so that a universal probe card can be used. A pitch between the test pads is wide so that the accuracy in an electric test of the tape package is increased. A total length of the tape package is reduced.

    Abstract translation: 提供其中在反面上形成测试垫的带包装。 测试垫通过基膜的通孔设置在基膜的反面上。 因此，测试垫的形状被标准化，使得可以使用通用探针卡。 测试垫之间的间距是宽的，使得磁带封装的电测试的精度提高。 磁带封装的总长度减小。

    Tape circuit substrate and semiconductor chip package using the same
    9.
    发明申请
    Tape circuit substrate and semiconductor chip package using the same 有权
    磁带电路基板和半导体芯片封装使用相同

    公开(公告)号：US20050046033A1

    公开(公告)日：2005-03-03

    申请号：US10892360

    申请日：2004-07-16

    Applicant: Ye-Chung Chung ,  Chung-Sun Lee

    Inventor： Ye-Chung Chung ,  Chung-Sun Lee

    IPC: H01L21/60 ,  H01L23/498 ,  H05K1/11 ,  H05K3/36 ,  H01L23/48

    CPC classification number: H01L23/4985 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H05K1/112 ,  H05K3/361 ,  H01L2224/05599

    Abstract: A tape circuit substrate and semiconductor chip package using the same. The tape circuit substrate may comprise a base film which may be made of an insulating material and may be formed with via-holes at portions thereof, a first wiring pattern layer which may be formed on a first surface of the base film, and at least one second wiring pattern layer which may be formed on a second surface of the base film and electrically connected to a terminal which may be formed on the first surface through conductive materials, or plugs, filled in the via-holes. The semiconductor chip package may comprise a semiconductor chip which may be electrically bonded to the tape circuit substrate through chip bumps.

    Abstract translation: 带状电路基板和使用其的半导体芯片封装。 磁带电路基板可以包括可以由绝缘材料制成并且可以在其部分处形成有通孔的基膜，可以形成在基膜的第一表面上的第一布线图案层，并且至少 一个第二布线图案层可以形成在基膜的第二表面上并且电连接到可以通过填充在通孔中的导电材料或插塞形成在第一表面上的端子。 半导体芯片封装可以包括半导体芯片，其可以通过芯片凸块电连接到磁带电路基板。

    Source driver, an image display assembly and an image display apparatus
    10.
    发明授权
    Source driver, an image display assembly and an image display apparatus 有权
    源驱动器，图像显示组件和图像显示装置

    公开(公告)号：US09557616B2

    公开(公告)日：2017-01-31

    申请号：US13242394

    申请日：2011-09-23

    Applicant: Ye-Chung Chung ,  Hee-seok Lee ,  Yun-Seok Choi ,  Keung-Beum Kim

    Inventor： Ye-Chung Chung ,  Hee-seok Lee ,  Yun-Seok Choi ,  Keung-Beum Kim

    IPC: G06F3/038 ,  H03K3/00 ,  G02F1/1345

    CPC classification number: H01L27/1244 ,  G02F1/13452 ,  G09G3/20 ,  G09G2300/0426 ,  G09G2310/08 ,  G09G2330/021 ,  H01L24/13 ,  H01L24/16 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/13124 ,  H01L2224/13639 ,  H01L2224/16225 ,  H01L2224/73204 ,  H01L2924/1426 ,  H05K1/148

    Abstract: An image display panel assembly includes a flexible printed circuit (FPC), an image display panel, a gate driver integrated circuit (IC) package, and a source driver IC package. The FPC is configured to receive gate and source driving signals. The image display panel is electrically connected to the FPC, and includes a gate driving signal transfer pattern along a first edge of the image display panel, a source driving signal transfer pattern along a second edge adjacent to the first end, and a plurality of pixels. The gate driver integrated circuit (IC) package is configured to receive the gate driving signal through the gate driving signal transfer pattern and provide the gate driving signal to the plurality of pixels. The source driver IC package is configured to receive the source driving signal through the source driving signal transfer pattern and provide the source driving signal to the plurality of pixels.

    Abstract translation: 图像显示面板组件包括柔性印刷电路（FPC），图像显示面板，栅极驱动器集成电路（IC）封装以及源极驱动器IC封装。 FPC被配置为接收门和源驱动信号。 图像显示面板电连接到FPC，并且包括沿着图像显示面板的第一边缘的栅极驱动信号传递图案，沿着与第一端相邻的第二边缘的源极驱动信号传递图案，以及多个像素 。 栅极驱动器集成电路（IC）封装被配置为通过栅极驱动信号传输图案接收栅极驱动信号，并将栅极驱动信号提供给多个像素。 源极驱动器IC封装被配置为通过源极驱动信号传输图案接收源极驱动信号，并将源极驱动信号提供给多个像素。

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