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公开(公告)号：US20110241233A1
公开(公告)日：2011-10-06
申请号：US13073489
申请日：2011-03-28
Applicant: Yoshihiro MORITA , Takahiro OOI , Tetsuro YAMADA , Akiko MATSUI , Mitsuhiko SUGANE , Takahide MUKOUYAMA
Inventor： Yoshihiro MORITA , Takahiro OOI , Tetsuro YAMADA , Akiko MATSUI , Mitsuhiko SUGANE , Takahide MUKOUYAMA
IPC: G02B6/04
CPC classification number: G02B6/138 , B29D11/00663 , G02B6/43
Abstract: A method for manufacturing an optical waveguide in which multiple cores are embedded in a parallel-arranged fashion within a single cladding, the cores having a refractive index of light different from that of the cladding, the method includes forming the multiple cores in a state where the adjacent cores are connected by a rib, forming the cladding around the rib and the multiple cores by curing a cladding material there around, and a cutting to the rib.
Abstract translation: 一种制造光波导的方法，其中多个芯以平行布置的方式嵌入在单个包层内，所述芯具有与包层的折射率不同的光的折射率，所述方法包括在以下状态下形成多个芯： 相邻的芯通过肋连接，通过在其周围固化包层材料并切割到肋来在肋和多个芯周围形成包层。
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公开(公告)号：US20090173525A1
公开(公告)日：2009-07-09
申请号：US12338433
申请日：2008-12-18
Applicant: Yoshihiro MORITA
Inventor： Yoshihiro MORITA
IPC: H05K1/00
CPC classification number: H05K1/0366 , H01L2924/0002 , H05K1/0237 , H05K2201/029 , H05K2201/09236 , H01L2924/00
Abstract: A printed wiring board includes a main body, a plurality of glass fiber yarns disposed in parallel with each other with a predetermined width, a pair of first wirings disposed in parallel with the glass fiber yarns, a pair of second wirings disposed in parallel with the glass fiber yarns, and a pair of connection wirings for connecting the first and the second wiring while being orthogonal to the glass fiber yarns, wherein the glass fiber yarns are separated at the same space as the width of the glass fiber yarns, and the center line of the first wiring and the second wiring are separated at a space of (space between the center lines of the adjacent glass fiber yarns×½+space between the center lines of the adjacent glass fiber yarns×N (N is an integer of at least 0 (zero)).
Abstract translation: 印刷电路板包括主体，以预定宽度彼此平行布置的多个玻璃纤维纱线，与玻璃纤维纱线平行布置的一对第一布线，与第一布线平行布置的一对第二布线 玻璃纤维纱线和一对连接布线，用于在与玻璃纤维纱线正交的同时连接第一和第二布线，其中玻璃纤维纱线在与玻璃纤维纱线的宽度相同的空间处分开，并且中心 第一布线和第二布线的线在相邻的玻璃纤维纱线的中心线之间的间隔x 1/2 +相邻的玻璃纤维纱线xN的中心线之间的间隔（N为至少0的整数（零） ））。
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公开(公告)号：US20070278647A1
公开(公告)日：2007-12-06
申请号：US11838431
申请日：2007-08-14
Applicant: Yoshihiro MORITA
Inventor： Yoshihiro MORITA
IPC: H01L23/02
CPC classification number: H05K1/0271 , H01L23/16 , H01L24/81 , H01L2224/16 , H01L2224/16225 , H01L2224/8121 , H01L2224/81815 , H01L2924/01004 , H01L2924/01019 , H01L2924/01322 , H01L2924/15311 , H01L2924/3511 , H05K3/0061 , H05K2201/0338 , H05K2201/068 , H05K2201/10598 , H05K2201/10734 , H05K2201/2009
Abstract: A package board module wherein a semiconductor chip such as an LSI is mounted on the topside surface of a package board, and a package mounted module wherein the package board is mounted on the motherboard of a large-sized computer or the like. A stiffener for supporting the package board and/or a stiffener for supporting the motherboard each has a bimetal structure wherein a first member and a second member having mutually different thermal expansion coefficients are respectively adhered to each other, so as to cause the stiffeners to warp in harmony with the warpage of the package board and the motherboard caused by a temperature change, thereby preventing stress from arising in the solder-bonded portions.
Abstract translation: 一种封装板模块，其中诸如LSI的半导体芯片安装在封装板的顶侧表面上，以及封装安装模块，其中封装板安装在大型计算机等的主板上。 用于支撑包装板的加强件和/或用于支撑母板的加强件各自具有双金属结构，其中具有相互不同的热膨胀系数的第一构件和第二构件分别彼此粘合，以便使加强件翘曲 与由温度变化引起的封装板和母板的翘曲一致，从而防止在焊接部分中产生应力。
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Patent Agency Ranking
公开(公告)号：US20110073354A1
公开(公告)日：2011-03-31
申请号：US12859829
申请日：2010-08-20
Applicant: Takahiro OOI , Tetsuro YAMADA , Yoshihiro MORITA , Akiko MATSUI , Mitsuhiko SUGANE , Takahide MUKOUYAMA
Inventor： Takahiro OOI , Tetsuro YAMADA , Yoshihiro MORITA , Akiko MATSUI , Mitsuhiko SUGANE , Takahide MUKOUYAMA
CPC classification number: H05K1/025 , H05K1/024 , H05K1/0248 , H05K1/0366 , H05K3/0052 , H05K2201/029
Abstract: A printed board includes an insulating body that has a flat surface and includes insulating cloth including first fibers and second fibers that cross the first fibers at right angles on the flat surface, and printed wiring including a plurality of signal lines that run parallel to each other and are laid out on the flat surface of the insulating body so that a direction of the signal lines is tilted to a direction of the first or second fibers at an angle which is determined based on board-cutting efficiency of the insulating body and a predetermined delay-time difference between the signal lines.
Abstract translation: 印刷电路板包括具有平坦表面的绝缘体，并且包括绝缘布，其包括第一纤维和第二纤维，所述第一纤维和第二纤维在平坦表面上与第一纤维成直角交叉;以及印刷布线，包括彼此平行延伸的多条信号线 并且布置在绝缘体的平坦表面上，使得信号线的方向以基于绝缘体的板切割效率确定的角度和预定的绝缘体的角度倾斜到第一或第二纤维的方向 信号线之间的延迟时间差。
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公开(公告)号：US20110308842A1
公开(公告)日：2011-12-22
申请号：US13075865
申请日：2011-03-30
Applicant: Yoshihiro MORITA , Takahiro OOI , Tetsuro YAMADA , Akiko MATSUI , Mitsuhiko SUGANE , Takahide MUKOYAMA
Inventor： Yoshihiro MORITA , Takahiro OOI , Tetsuro YAMADA , Akiko MATSUI , Mitsuhiko SUGANE , Takahide MUKOYAMA
CPC classification number: H05K1/0366 , D03D1/0088 , D03D15/0011 , D03D15/0088 , D10B2401/18 , D10B2505/02 , H05K1/024 , H05K1/0245 , H05K1/0248 , H05K2201/029 , H05K2201/091 , H05K2203/0195 , Y10T29/49124
Abstract: A wiring substrate includes an insulation layer including a thermosetting resin and a reinforcement member having plural first fiber bundles and plural second fiber bundles woven together, the second fiber bundles being intersected with the first fiber bundles, and a pair of differential wirings arranged alongside each other on the insulation layer. The first fiber bundles and the second fiber bundles have a curved portion relative to a plan direction of the insulation layer in a region on which the pair of differential wirings is arranged.
Abstract translation: 布线基板包括：绝缘层，包括热固性树脂和具有多个第一纤维束的加强件和编织在一起的多个第二纤维束，第二纤维束与第一纤维束相交，以及一对彼此并排设置的差动布线 在绝缘层上。 第一纤维束和第二纤维束在布置有一对差动布线的区域中相对于绝缘层的平面方向具有弯曲部分。
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公开(公告)号：US20110308840A1
公开(公告)日：2011-12-22
申请号：US13075838
申请日：2011-03-30
Applicant: Takahiro OOI , Yoshihiro MORITA , Akiko MATSUI , Tetsuro YAMADA , Mitsuhiko SUGANE , Takahide MUKOYAMA
Inventor： Takahiro OOI , Yoshihiro MORITA , Akiko MATSUI , Tetsuro YAMADA , Mitsuhiko SUGANE , Takahide MUKOYAMA
CPC classification number: H05K1/0248 , H05K1/024 , H05K1/0245 , H05K1/0269 , H05K1/0366 , H05K2201/029 , H05K2201/09272 , H05K2203/166 , H05K2203/167
Abstract: A wiring substrate includes differential wirings; a first insulating layer adjacent to one side of the differential wirings, including first fiber bundles parallel to the differential wirings; a second insulating layer adjacent to another side of the differential wirings, including second fiber bundles parallel to the differential wirings and disposed by the same pitch as the first fiber bundles; a third insulating layer on the first insulating layer on a side opposite to the differential wirings, including third fiber bundles in parallel to the differential wirings; and a fourth insulating layer on the second insulating layer on a side opposite to the differential wirings, including fourth fiber bundles in parallel to the differential wirings. Intervals of the third and fourth fiber bundles are respectively narrower than intervals of the first and second fiber bundles. The differential wirings are disposed between adjacent first fiber bundles, and between adjacent second fiber bundles.
Abstract translation: 布线基板包括差分布线; 与所述差分布线的一侧相邻的第一绝缘层，包括平行于所述差分布线的第一光纤束; 与所述差分布线的另一侧相邻的第二绝缘层，包括与所述差分布线平行并且以与所述第一纤维束相同的间距设置的第二纤维束; 在所述第一绝缘层上的与所述差分布线相反的一侧的第三绝缘层，包括与所述差分布线平行的第三纤维束; 以及在所述第二绝缘层上的与所述差分布线相反的一侧的第四绝缘层，包括与所述差分布线平行的第四纤维束。 第三和第四纤维束的间隔分别比第一和第二纤维束的间隔窄。 差分布线设置在相邻的第一纤维束之间以及相邻的第二纤维束之间。
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公开(公告)号：US20110232949A1
公开(公告)日：2011-09-29
申请号：US13046076
申请日：2011-03-11
Applicant: Tetsuro YAMADA , Takahiro OOI , Yoshihiro MORITA , Akiko MATSUI , Misuhiko SUGANE , Takahide MUKOYAMA
Inventor： Tetsuro YAMADA , Takahiro OOI , Yoshihiro MORITA , Akiko MATSUI , Misuhiko SUGANE , Takahide MUKOYAMA
CPC classification number: H05K1/0245 , H05K1/0248 , H05K1/0269 , H05K1/0366 , H05K3/4638 , H05K2201/029 , H05K2201/09236 , H05K2201/0969 , H05K2203/167
Abstract: A printed wiring board manufacturing method includes weaving a glass fiber cloth with warp and weft yarns such that the warp and weft yarns are visually distinguishable at least a region. The glass fiber cloth is impregnated with a resin to fabricate a substrate. A copper foil is formed on at least one surface of the substrate to fabricate a core substrate. The copper foil is removed within the region on the core substrate to form an opening. A pitch between the warp yarns or between the weft yarns which are presented in the opening is detected. A pitch between a pair of differential wirings to be patterned is determined based on the detected pitch between the warp yarns or between the weft yarns. The pair of differential wirings is patterned on the core substrate in accordance with the determined pitch between the pair of differential wirings.
Abstract translation: 一种印刷线路板的制造方法，其特征在于，以经纱和纬纱编织玻璃纤维布，使经纱和纬纱在至少一个区域上视觉区分。 玻璃纤维布被树脂浸渍以制造基材。 在基板的至少一个表面上形成铜箔以制造芯基板。 在芯基板上的区域内去除铜箔以形成开口。 检测出在经纱之间或介于纬纱之间的间距。 基于经纱之间或纬纱之间的间距来确定要被图案化的一对差动布线之间的间距。 根据所述一对差动配线之间的所确定的间距，在所述芯基板上图案化所述一对差分布线。
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公开(公告)号：US20080006924A1
公开(公告)日：2008-01-10
申请号：US11832978
申请日：2007-08-02
Applicant: Yoshihiro MORITA
Inventor： Yoshihiro MORITA
IPC: H01L23/02
CPC classification number: H05K1/0271 , H01L2224/16225 , H01L2924/00011 , H01L2924/00014 , H01L2924/15311 , H05K3/0058 , H05K2201/10409 , H05K2201/10734 , H05K2201/2009 , H01L2224/0401
Abstract: A package mounted module wherein a package board on the topside surface of which a semiconductor chip such as an LSI is mounted is further mounted on the topside surface of the motherboard of a large-scale computing machine such as a large-sized computer, and a stiffener is provided on the underside surface of the motherboard. In order to improve the reliability of solder bonding, a stiffener is fixed to the motherboard with screws at plural locations on the periphery of the stiffener and is also fixed to the motherboard with a screw in the central part of the stiffener.
Abstract translation: 一种封装安装模块，其中安装有诸如LSI的半导体芯片的顶表面上的封装板进一步安装在大型计算机例如大型计算机的主板的顶侧表面上，并且 加强件设置在母板的下表面上。 为了提高焊接的可靠性，在加强件的周围的多个位置处用螺钉将加强件固定在母板上，并且还在加强件的中心部分用螺钉固定在母板上。
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