公开(公告)号：US20090116193A1

公开(公告)日：2009-05-07

申请号：US11969485

申请日：2008-01-04

Applicant: Yu-Hsueh Lin

Inventor： Yu-Hsueh Lin

IPC: H05K7/20 ,  B05D5/12

CPC classification number: H05K7/205 ,  H01L23/3732 ,  H01L2924/0002 ,  H05K1/053 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2201/0323 ,  H05K2203/0315 ,  H01L2924/00

Abstract: A method for manufacturing a substrate board with high efficiency of heat conduction and electrical isolation is disclosed. The method comprises the steps of: providing a substrate layer with an arrangement surface and a heat-dissipating surface; executing an anodic treatment on the arrangement surface and the heat-dissipating surface to respectively form a first anodic treatment layer and a second anodic treatment layer; forming a heat conduction and electrical isolation layer on the second anodic treatment layer; and forming a diamond like carbon (DLC) layer on the heat conduction and electrical isolation layer. The heat expansion coefficient of the substrate layer is greater than that of the second anodic treatment layer, the heat conduction and electrical isolation layer, and the DLC layer in turn.

Abstract translation: 公开了一种用于制造具有高效率的热传导和电隔离的基板的方法。 该方法包括以下步骤：为衬底层提供布置表面和散热表面; 对配置面和散热面进行阳极处理，分别形成第一阳极处理层和第二阳极处理层; 在所述第二阳极处理层上形成导热和电隔离层; 并在导热和电隔离层上形成类金刚石碳（DLC）层。 衬底层的热膨胀系数大于第二阳极处理层，热传导和电隔离层以及DLC层的热膨胀系数。

公开(公告)号：US07638714B2

公开(公告)日：2009-12-29

申请号：US11969485

申请日：2008-01-04

Applicant: Yu-Hsueh Lin

Inventor： Yu-Hsueh Lin

IPC: H05K1/00

CPC classification number: H05K7/205 ,  H01L23/3732 ,  H01L2924/0002 ,  H05K1/053 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2201/0323 ,  H05K2203/0315 ,  H01L2924/00

Abstract: A method for manufacturing a substrate board with high efficiency of heat conduction and electrical isolation is disclosed. The method comprises the steps of: providing a substrate layer with an arrangement surface and a heat-dissipating surface; executing an anodic treatment on the arrangement surface and the heat-dissipating surface to respectively form a first anodic treatment layer and a second anodic treatment layer; forming a heat conduction and electrical isolation layer on the second anodic treatment layer; and forming a diamond like carbon (DLC) layer on the heat conduction and electrical isolation layer. The heat expansion coefficient of the substrate layer is greater than that of the second anodic treatment layer, the heat conduction and electrical isolation layer, and the DLC layer in turn.

Abstract translation: 公开了一种用于制造具有高效率的热传导和电隔离的基板的方法。 该方法包括以下步骤：为衬底层提供布置表面和散热表面; 对配置面和散热面进行阳极处理，分别形成第一阳极处理层和第二阳极处理层; 在所述第二阳极处理层上形成导热和电隔离层; 并在导热和电隔离层上形成类金刚石碳（DLC）层。 衬底层的热膨胀系数大于第二阳极处理层，热传导和电隔离层以及DLC层的热膨胀系数。