公开(公告)号：US09344347B2

公开(公告)日：2016-05-17

申请号：US12410138

申请日：2009-03-24

Applicant: Yuichi Matsuda ,  Yuji Nomura

Inventor： Yuichi Matsuda ,  Yuji Nomura

IPC: H04L12/26

CPC classification number: H04L43/0864 ,  H04L43/106

Abstract: In a delay time measuring apparatus a sequence number, data length, and receiving time of a data packet transmitted from a source unit to a destination unit are stored in a storage section. In addition, an ACK number and receiving time of an ACK packet returned from the destination unit to the source unit are stored in the storage section. After that, a calculation section obtains an ACK packet an ACK number of which is equal to a value obtained by adding data length of a second data packet of two successive data packets transmitted without waiting for the ACK packet to a sequence number of the second data packet of the two successive data packets from the storage section. Then the calculation section calculates round trip time from receiving time of the second data packet of the two successive data packets and receiving time of the ACK packet obtained.

Abstract translation: 在延迟时间测量装置中，从源单元发送到目的地单元的数据分组的序列号，数据长度和接收时间被存储在存储部分中。 此外，从目的地单元返回到源单元的ACK分组的ACK号码和接收时间被存储在存储部分中。 之后，计算部分获得ACK分组的ACK数量，该ACK分组的数量等于通过将不等待ACK分组发送的两个连续的数据分组的第二数据分组的数据长度与第二数据的序列号相加而获得的值 来自存储部分的两个连续数据分组的分组。 然后，计算部分计算两个连续数据分组的第二数据分组的接收时间和获得的ACK分组的接收时间的往返时间。

公开(公告)号：US08638542B2

公开(公告)日：2014-01-28

申请号：US12833185

申请日：2010-07-09

Applicant: Michio Horiuchi ,  Yasue Tokutake ,  Yuichi Matsuda ,  Yukio Shimizu ,  Tomoo Yamasaki ,  Yuta Sakaguchi

Inventor： Michio Horiuchi ,  Yasue Tokutake ,  Yuichi Matsuda ,  Yukio Shimizu ,  Tomoo Yamasaki ,  Yuta Sakaguchi

IPC: H01G4/06 ,  H01G4/005 ,  H01G7/00

CPC classification number: H05K1/162 ,  H01G4/012 ,  H01G4/232 ,  H01G4/302 ,  H05K1/0287 ,  H05K1/0306 ,  H05K2201/09263 ,  H05K2201/09563 ,  H05K2201/09609 ,  H05K2201/097 ,  H05K2201/09945

Abstract: A capacitor includes a dielectric substrate and a large number of filamentous conductors formed to penetrate through the dielectric substrate in a thickness direction thereof. An electrode is connected to only respective one ends of a plurality of filamentous conductors constituting one of groups each composed of a plurality of filamentous conductors. The electrode is disposed in at least one position on each of both surfaces of the dielectric substrate, or in at least two positions on one of the surfaces. Further, an insulating layer is formed on each of both surfaces of the dielectric substrate so as to cover regions between the electrodes, and a conductor layer is formed on the corresponding insulating layer integrally with a desired number of electrodes.

Abstract translation: 电容器包括电介质基板和形成为在其厚度方向上穿过电介质基板的大量丝状导体。 电极仅与构成一组各自由多根丝状导体构成的多个丝状导体的相应一端连接。 电极设置在电介质基板的两个表面的每一个上的至少一个位置，或者在其中一个表面上的至少两个位置。 此外，在电介质基板的两个表面的每个表面上形成绝缘层，以覆盖电极之间的区域，并且在相应的绝缘层上形成与期望数量的电极一体的导体层。

公开(公告)号：US20130081796A1

公开(公告)日：2013-04-04

申请号：US13613720

申请日：2012-09-13

Applicant: Michio Horiuchi ,  Yasue Tokutake ,  Yuichi Matsuda

Inventor： Michio Horiuchi ,  Yasue Tokutake ,  Yuichi Matsuda

IPC: F28F7/00 ,  B32B37/02

CPC classification number: H01L23/3677 ,  H01L21/4882 ,  H01L21/50 ,  H01L23/3733 ,  H01L23/3735 ,  H01L23/433 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/15311 ,  H05K7/2039 ,  H05K7/20509 ,  H01L2924/00

Abstract: A thermal interface material includes a metal foil, which has a first surface and an opposite second surface, and a plurality of rod conductors each having a side surface extending in a thickness direction of the metal foil. The rod conductors are arranged on at least one of the first and second surfaces of the metal foil in a planar direction that is perpendicular to the thickness direction. A resin layer covers at least the first surface and the second surface of the metal foil and the side surfaces of the rod conductors.

Abstract translation: 热界面材料包括金属箔，其具有第一表面和相对的第二表面，以及多个棒状导体，每个棒状导体的侧表面在金属箔的厚度方向上延伸。 棒状导体沿垂直于厚度方向的平面方向布置在金属箔的第一表面和第二表面中的至少一个上。 树脂层至少覆盖金属箔的第一表面和第二表面以及棒状导体的侧表面。

公开(公告)号：US08324513B2

公开(公告)日：2012-12-04

申请号：US13009987

申请日：2011-01-20

Applicant: Michio Horiuchi ,  Yasue Tokutake ,  Yuichi Matsuda

Inventor： Michio Horiuchi ,  Yasue Tokutake ,  Yuichi Matsuda

IPC: H05K1/11

CPC classification number: H01L23/552 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/49827 ,  H01L24/16 ,  H01L25/0657 ,  H01L25/105 ,  H01L2223/6622 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2225/06517 ,  H01L2225/06572 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/15331 ,  H01L2924/3025 ,  H01L2924/00

Abstract: A wiring substrate includes a core substrate including an inorganic dielectric insulating base material having first and second surfaces, and linear conductors penetrating the insulating base; a first wiring layer on the first surface electrically connected to a portion of linear conductors; a second wiring layer on the second surface electrically connected to the portion of the linear conductors; a first insulating layer on the first surface covering the first wiring layer and including a first through-hole; a third wiring layer on the first insulating layer electrically connected to the first wiring layer via the first through-hole; a second insulating layer on the second surface covering the second wiring layer and including a second through-hole; and a fourth wiring layer on the second insulating layer electrically connected to the second wiring layer via the second through-hole.

Abstract translation: 布线基板包括：芯基板，包括具有第一表面和第二表面的无机介电绝缘基材，以及贯穿绝缘基体的线状导体; 第一表面上的第一布线层，电连接到一部分直线导体; 在所述第二表面上的与所述线状导体的所述部分电连接的第二布线层; 在所述第一表面上覆盖所述第一布线层并包括第一通孔的第一绝缘层; 所述第一绝缘层上的第三布线层经由所述第一通孔与所述第一布线层电连接; 覆盖所述第二布线层并且包括第二通孔的所述第二表面上的第二绝缘层; 以及通过第二通孔与第二布线层电连接的第二绝缘层上的第四布线层。

公开(公告)号：US07847021B2

公开(公告)日：2010-12-07

申请号：US10589431

申请日：2005-02-09

Applicant: Hosei Shinoda ,  Takeshi Kashima ,  Masahiro Enna ,  Shinichi Kojoh ,  Hideyuki Kaneko ,  Shingo Matsuo ,  Nobuo Kawahara ,  Tomoaki Matsugi ,  Yuichi Matsuda ,  Takayuki Onogi ,  Fumio Kageyama

Inventor： Hosei Shinoda ,  Takeshi Kashima ,  Masahiro Enna ,  Shinichi Kojoh ,  Hideyuki Kaneko ,  Shingo Matsuo ,  Nobuo Kawahara ,  Tomoaki Matsugi ,  Yuichi Matsuda ,  Takayuki Onogi ,  Fumio Kageyama

IPC: C08G67/00 ,  C08L67/00 ,  C08L67/04 ,  C08L23/10 ,  C08L23/26

CPC classification number: C08L51/06 ,  C08L23/00 ,  C08L23/02 ,  C08L67/02 ,  C08L69/00 ,  Y10T428/31786 ,  Y10T428/31855 ,  Y10T428/31935 ,  Y10T428/31938 ,  C08L2666/24 ,  C08L2666/18 ,  C08L2666/14 ,  C08L2666/02

Abstract: A modified polyolefin resin comprising a copolymer having a structure that a propylene-based polyolefin segment (a) and a segment (b) containing a lactic acid as a constituent are bonded in a block state and/or a graft state through a vinyl monomer having a hydroxyl group, wherein a number average molecular weight of the propylene-based polyolefin segment (a) is from 1,000 to 100,000, a number average molecular weight of the segment (b) containing lactic acid as a constituent is from 1,000 to 200,000, and a weight composition of the propylene-based polyolefin segment (a) and the segment (b) containing lactic acid as a constituent is from 10/90 to 90/10. The modified polyolefin resin can be used in a resin composition containing an aliphatic polyester resin (A), a polyolefin resin (B) and the modified polyolefin resin (C). The composition can exhibit excellent heat resistance and impact resistance and can be used for molding various parts.

Abstract translation: 包含具有丙烯类聚烯烃链段（a）和含有乳酸作为组分的链段（b）的结构的共聚物的改性聚烯烃树脂以嵌段状态和/或接枝状态通过具有 羟基，其中丙烯类聚烯烃链段（a）的数均分子量为1,000〜100,000，以乳酸为成分的链段（b）的数均分子量为1,000〜200,000，以及 丙烯类聚烯烃链段（a）和含有乳酸作为成分的链段（b）的重量组成为10/90〜90/10。 改性聚烯烃树脂可用于含有脂族聚酯树脂（A），聚烯烃树脂（B）和改性聚烯烃树脂（C）的树脂组合物中。 该组合物可以表现出优异的耐热性和抗冲击性，并且可用于各种部件的成型。

公开(公告)号：US06418615B1

公开(公告)日：2002-07-16

申请号：US09523149

申请日：2000-03-10

Applicant: Akio Rokugawa ,  Masayuki Sasaki ,  Yuichi Matsuda

Inventor： Akio Rokugawa ,  Masayuki Sasaki ,  Yuichi Matsuda

IPC: H01K310

CPC classification number: H05K3/4682 ,  H01L21/6835 ,  H01L23/49811 ,  H01L23/49822 ,  H01L2221/68345 ,  H01L2224/16225 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/3025 ,  H05K1/113 ,  H05K3/007 ,  H05K3/045 ,  H05K3/108 ,  H05K3/20 ,  H05K3/205 ,  H05K3/388 ,  H05K2201/09509 ,  H05K2201/09527 ,  H05K2201/09563 ,  H05K2203/0152 ,  H05K2203/0376 ,  H05K2203/0384 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49345

Abstract: A substrate of multilayered structure having a plurality of sets of an insulation layer and a wiring line layer, and having one face for mounting a semiconductor element thereon and the other face on which external connection terminals are to be provided, the face for mounting a semiconductor element being provided with pads to be bonded to an electrode terminal of the semiconductor element, the other face being provided with pads to be bonded to an external connection terminal, such as a terminal formed of a solder ball, and the wiring line layers on both sides of an insulation layer being connected with each other by vias piercing the insulation layer, wherein the surfaces of the pads to be bonded to an electrode terminal of a semiconductor element are flat and are in the same plane. A method of manufacturing such a multilayered substrate is also disclosed.

Abstract translation: 一种多层结构的基板，具有多组绝缘层和布线层，并且具有用于安装半导体元件的一个面和将要设置外部连接端子的另一个面，用于安装半导体的面 元件设置有要接合到半导体元件的电极端子的焊盘，另一个面设置有焊接到外部连接端子，例如由焊球形成的端子，并且两个布线层 绝缘层的侧面通过穿过绝缘层的通孔相互连接，其中要结合到半导体元件的电极端子的焊盘的表面是平坦的并且在同一平面中。 还公开了制造这种多层基板的方法。

公开(公告)号：US09698037B2

公开(公告)日：2017-07-04

申请号：US13156925

申请日：2011-06-09

Applicant: Seiyo Nakashima ,  Yuichi Matsuda ,  Takashi Nogami ,  Shinobu Sugiura ,  Tomoyuki Yamada

Inventor： Seiyo Nakashima ,  Yuichi Matsuda ,  Takashi Nogami ,  Shinobu Sugiura ,  Tomoyuki Yamada

IPC: H01L21/677 ,  H01L21/67

CPC classification number: H01L21/67757 ,  H01L21/67017

Abstract: A substrate processing apparatus includes a holder configured to hold a substrate and carry the substrate into a process chamber, a waiting station located outside the process chamber in which the holder waits prior to carrying the substrate into the process chamber, a circulation path configured to circulate a gas throughout the waiting station, and an exhaust path formed in the circulation path and configured to exhaust the gas from the waiting station.

公开(公告)号：US08832496B2

公开(公告)日：2014-09-09

申请号：US13005157

申请日：2011-01-12

Applicant: Yuichi Matsuda ,  Yuji Nomura

Inventor： Yuichi Matsuda ,  Yuji Nomura

IPC: G06F11/00 ,  H04L12/24 ,  G06F11/07

CPC classification number: H04L41/069 ,  G06F11/079 ,  H04L41/0622

Abstract: A computer-readable non-transitory recording medium storing therein an information managing program causing a computer to execute extracting from among events that have occurred at objects under management and having dependence relations, combinations of a first event that has occurred at a source-of-dependence object and a second event that has occurred at a dependent object dependent on the source-of-dependence object; judging for each extracted combination, whether a dependence relation exists between the first event and the second event, by using the difference between the time of occurrence of the first event and that of the second event; determining from among the events and based on a judgment result obtained at the judging, an event that has occurred at an object that is a source-of-dependence object but not a dependent object, to be an event to be stored; and storing to a database, information related to the event to be stored.

Abstract translation: 一种存储信息管理程序的计算机可读的非暂时性记录介质，其使得计算机执行从在管理对象发生的事件中提取并具有依赖关系的信息管理程序， 依赖对象和依赖于依赖关系对象的依赖对象发生的第二个事件; 对于每个提取的组合，通过使用第一事件的发生时间和第二事件的发生时间之间的差异，判断第一事件和第二事件之间是否存在依赖关系; 从所述事件中确定并且基于在所述判断处获得的判断结果，将在作为依赖源的对象而不是依赖对象的对象发生的事件作为要存储的事件; 并向数据库存储与要存储的事件相关的信息。

公开(公告)号：US08242612B2

公开(公告)日：2012-08-14

申请号：US12813692

申请日：2010-06-11

Applicant: Michio Horiuchi ,  Yasue Tokutake ,  Yuichi Matsuda ,  Tomoo Yamasaki ,  Yuta Sakaguchi

Inventor： Michio Horiuchi ,  Yasue Tokutake ,  Yuichi Matsuda ,  Tomoo Yamasaki ,  Yuta Sakaguchi

IPC: H01L23/48 ,  H05K1/00

CPC classification number: H01L23/49827 ,  H01L23/49838 ,  H01L23/50 ,  H01L24/16 ,  H01L2224/16225 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3025 ,  H05K1/0227 ,  H05K1/162 ,  H05K3/4605 ,  H05K2201/09236 ,  H05K2201/093 ,  H05K2201/09309 ,  H05K2201/09345 ,  H05K2201/09609

Abstract: A wiring board includes a core substrate including an insulation base member; linear conductors configured to pierce from a first surface of the insulation base member to a second surface of the insulation base member; a ground wiring group including a first ground wiring formed on the first surface of the core substrate, and a belt-shaped second ground wiring formed on the second surface of the core substrate and electrically connected to the first ground wiring by way of a part of the linear conductors; and an electric power supply wiring group including a first electric power supply wiring formed on the first surface, and a second electric power supply wiring formed on the second surface and electrically connected to the first electric power supply wiring by way of a part of the plural linear conductors.

Abstract translation: 布线基板包括：具有绝缘基体的芯基板; 构造成从所述绝缘基材的第一表面刺穿到所述绝缘基材的第二表面的线状导体; 包括形成在芯基板的第一表面上的第一接地布线的接地布线组和形成在芯基板的第二表面上的带状第二接地布线，并且通过一部分电连接到第一接地布线 线性导体; 以及电源布线组，其包括形成在第一表面上的第一电力供给布线和形成在第二表面上的第二电力供应布线，并且通过多个部分中的一部分电连接到第一电力布线 线性导体。

公开(公告)号：US20110095419A1

公开(公告)日：2011-04-28

申请号：US12909096

申请日：2010-10-21

Applicant: Michio Horiuchi ,  Yasue Tokutake ,  Yuichi Matsuda ,  Tsuyoshi Kobayashi ,  Tatsuaki Denda

Inventor： Michio Horiuchi ,  Yasue Tokutake ,  Yuichi Matsuda ,  Tsuyoshi Kobayashi ,  Tatsuaki Denda

IPC: H01L23/498 ,  H01L21/768 ,  H05K1/11 ,  B05D5/12

CPC classification number: H05K3/3436 ,  H01L21/486 ,  H01L23/49827 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2924/01078 ,  H01L2924/12044 ,  H05K2201/09945 ,  H05K2201/10378 ,  H05K2203/0315 ,  Y02P70/613

Abstract: There is provided a conductive film. The conductive film includes: an anodized layer having a plurality of through holes extending therethrough in its thickness direction; a plurality of linear conductors each formed in a corresponding one of the through holes and each having first and second protrusions protruding from the anodized layer, wherein at least one of the first and second protrusions is covered by a coating material; and an uncured thermosetting resin layer formed on the anodized layer to cover at least one of the first and second protrusions.

Abstract translation: 提供导电膜。 导电膜包括：阳极化层，其具有在其厚度方向上延伸穿过其中的多个通孔; 多个线状导体，各自形成在所述通孔中的对应的一个中，并且每个具有从所述阳极氧化层突出的第一和第二突起，其中所述第一突起和所述第二突起中的至少一个被涂覆材料覆盖; 以及形成在所述阳极氧化层上以覆盖所述第一和第二突起中的至少一个的未固化的热固性树脂层。