公开(公告)号：US12130563B2

公开(公告)日：2024-10-29

申请号：US18355492

申请日：2023-07-20

Applicant: Yuusuke Yamamoto

Inventor： Yuusuke Yamamoto

IPC: G03G15/02

CPC classification number: G03G15/0266

Abstract: An image forming apparatus includes an image bearer, a power source to generate a voltage, a voltage applying device facing the image bearer, the voltage applying device being applied with the voltage, and circuitry to control the voltage of the power source. The circuitry switches the voltage between a first direct current (DC) bias and a second DC bias different from the first DC bias, and changes the first DC bias in accordance with a speed of the image bearer, based on a DC component of a current flowing between the power source and the image bearer during application of the second DC bias.

公开(公告)号：US20240069459A1

公开(公告)日：2024-02-29

申请号：US18355492

申请日：2023-07-20

Applicant: Yuusuke Yamamoto

Inventor： Yuusuke Yamamoto

IPC: G03G15/02

CPC classification number: G03G15/0266

Abstract: An image forming apparatus includes an image bearer, a power source to generate a voltage, a voltage applying device facing the image bearer, the voltage applying device being applied with the voltage, and circuitry to control the voltage of the power source. The circuitry switches the voltage between a first direct current (DC) bias and a second DC bias different from the first DC bias, and changes the first DC bias in accordance with a speed of the image bearer, based on a DC component of a current flowing between the power source and the image bearer during application of the second DC bias.

公开(公告)号：US20090224026A1

公开(公告)日：2009-09-10

申请号：US11993918

申请日：2006-08-16

Applicant: Yuusuke Yamamoto

Inventor： Yuusuke Yamamoto

IPC: B23K31/02

CPC classification number: H01L24/81 ,  H01L21/6835 ,  H01L24/75 ,  H01L2224/11822 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/75 ,  H01L2224/75745 ,  H01L2224/81143 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H05K1/141 ,  H05K3/3436 ,  H05K3/3484 ,  H05K2201/035 ,  H05K2201/10734 ,  H05K2203/0338 ,  Y02P70/613 ,  H01L2224/13099

Abstract: An electronic component mounting method that is to mount on a board 3 an electronic component 11 formed with solder bumps 16 on a lower surface thereof Solder paste 19 is printed onto the electrodes 3a of the board 3 and further provided onto the solder bumps 16 by transfer. Thereafter, the solder bumps 16 are put on the electrodes 3a through the solder paste 19. Due to this, even where there is a gap between the solder bump 16 and the electrode 3a, the fused portion of solder is increased in amount by the solder ingredient of the solder paste 19 wherein the fused portion of solder is ensured to wettably spread. This can prevent a poor junction when to mount a thin semiconductor package by soldering.

Abstract translation: 一种电子部件安装方法，其在基板3上安装在其下表面上形成有焊锡凸块16的电子部件11.焊膏19印刷到电路板3的电极3a上，并通过转印进一步设置在焊料凸块16上 。 此后，焊锡凸块16通过焊膏19放置在电极3a上。由此，即使在焊料凸块16和电极3a之间存在间隙的情况下，焊料的熔融部分也被焊料的量增加 焊膏19的成分，其中焊料的熔融部分被确保可润湿地扩散。 这可以防止通过焊接来安装薄的半导体封装时的不良接合。

公开(公告)号：US11429054B2

公开(公告)日：2022-08-30

申请号：US17003015

申请日：2020-08-26

Applicant: Yuusuke Yamamoto

Inventor： Yuusuke Yamamoto

IPC: G03G15/00 ,  H02H9/02

Abstract: An image forming apparatus includes an image bearer; a first power supply configured to generate a first voltage applied to the image bearer according to a first voltage control signal; a second power supply configured to generate a second voltage, which has a polarity opposite to a polarity of the first voltage, applied to the image bearer according to a second voltage control signal; and circuitry. The circuitry is configured to generate the first voltage control signal and the second voltage control signal, detect an overcurrent in the image forming apparatus as an abnormality; and set a mask period for masking detection of the abnormality in response to an input of the second voltage control signal after an input of the first voltage control signal.

公开(公告)号：US09601891B2

公开(公告)日：2017-03-21

申请号：US13537687

申请日：2012-06-29

Applicant: Yasuto Yamauchi ,  Keisuke Matsuura ,  Tomoyuki Kojima ,  Yuusuke Yamamoto

Inventor： Yasuto Yamauchi ,  Keisuke Matsuura ,  Tomoyuki Kojima ,  Yuusuke Yamamoto

IPC: H01R43/055 ,  H01R43/24 ,  H01R9/05

CPC classification number: H01R43/055 ,  H01R9/05 ,  H01R43/24 ,  Y10T29/53209

Abstract: A cable assembling apparatus for allowing a terminal and a electric wire to be accurately crimped and to resolve increase of facility cost incurred by separation of a press and a crimping machine, includes a press having a downside press mold having a plurality of types of dies arranged in parallel, an electric wire support jig arranged in parallel, having a metal plate guide at an end thereof entering into between the plurality of types of dies, and a feeder adapted to lift the electric wire support jig together with the metal plate above the dies of the downside press mold, and advance and descend the electric wire support jig to an adjacent die of next process. Furthermore, an electric wire chuck disposed in a midstream die of the plurality of types of dies and supplying the electric wire support jig with the electric wire is disposed.

公开(公告)号：US20050161492A1

公开(公告)日：2005-07-28

申请号：US10863398

申请日：2004-06-08

Applicant: Yuusuke Yamamoto

Inventor： Yuusuke Yamamoto

IPC: H05K13/04 ,  B23K31/02 ,  B23K31/12 ,  B23K35/22 ,  H01L25/10 ,  H01L25/11 ,  H01L25/18 ,  H05K3/32 ,  H05K3/34 ,  H05K3/46

CPC classification number: H05K3/341 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2225/06568 ,  H01L2924/00014 ,  H05K3/3484 ,  H05K2201/10515 ,  H05K2201/1053 ,  Y02P70/613 ,  H01L2224/05599

Abstract: The object is the capability of providing a method of manufacturing mounting boards that enables extensive adoption of a stacked structure at a low cost. As a solution, in the method of manufacturing a mounting board in which a mounting board is manufactured by mounting a first electronic part 11 and a second electronic part 12 each having a solder bump in its bottom plane on a substrate 3 in stacked plural levels, after the first electronic part 11 is mounted on the substrate 3 that has been fed with solder, the solder bump 18 of the second electronic part 12 is mounted on the electrode 17 provided on the upper plane of the first electronic part 11, and thereafter the substrate 3 is heated in a reflow step to solder-bond the first electronic part 11 to substrate 3 along with solder-bonding the second electronic part 12 to the first electronic part 11. By such process, a stacked structure can be applied to a wide variety of electronic parts at a low cost.

Abstract translation: 目的是提供一种能够以低成本广泛采用堆叠结构的安装板的制造方法的能力。 作为解决方案，在制造安装基板的方法中，其中通过将底部平面上具有焊料凸块的第一电子部件11和第二电子部件12以多个层叠的方式安装在基板3上来制造， 在将第一电子部件11安装在已经供给焊料的基板3上之后，将第二电子部件12的焊料凸块18安装在设置在第一电子部件11的上平面上的电极17上， 衬底3在回流步骤中被加热，以将第一电子部件11焊接到衬底3上，同时将第二电子部件12焊接到第一电子部件11.通过这种工艺，堆叠结构可以应用于宽 各种电子零件成本低廉。

公开(公告)号：US20140000102A1

公开(公告)日：2014-01-02

申请号：US13537687

申请日：2012-06-29

Applicant: Yasuto Yamauchi ,  Keisuke Matsuura ,  Tomoyuki Kojima ,  Yuusuke Yamamoto

Inventor： Yasuto Yamauchi ,  Keisuke Matsuura ,  Tomoyuki Kojima ,  Yuusuke Yamamoto

IPC: H01R43/20

CPC classification number: H01R43/055 ,  H01R9/05 ,  H01R43/24 ,  Y10T29/53209

Abstract: A cable assembling apparatus for allowing a terminal and a electric wire to be accurately crimped and to resolve increase of facility cost incurred by separation of a press and a crimping machine, includes a press having a downside press mold having a plurality of types of dies arranged in parallel, an electric wire support jig arranged in parallel, having a metal plate guide at an end thereof entering into between the plurality of types of dies, and a feeder adapted to lift the electric wire support jig together with the metal plate above the dies of the downside press mold, and advance and descend the electric wire support jig to an adjacent die of next process. Furthermore, an electric wire chuck disposed in a midstream die of the plurality of types of dies and supplying the electric wire support jig with the electric wire is disposed.

Abstract translation: 一种用于允许端子和电线被精确地卷曲并且解决由于压力机和压接机的分离引起的设备成本增加的电缆组装装置，包括具有下列压模的冲压机，所述下压模具具有多种类型的模具 并联布置有平行布置的电线支撑夹具，其金属板引导件在其末端进入多个类型的模具之间，以及馈线，其适于将电线支撑夹具与金属板一起提升在模具上方 的下压模具，并且将电线支撑夹具前进和下降到下一工序的相邻模具。 此外，设置设置在多种类型的模具的中游管芯中并将电线支撑夹具供给电线的电线卡盘。

公开(公告)号：US07163137B2

公开(公告)日：2007-01-16

申请号：US10863398

申请日：2004-06-08

Applicant: Yuusuke Yamamoto

Inventor： Yuusuke Yamamoto

IPC: B23K31/02

CPC classification number: H05K3/341 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2225/06568 ,  H01L2924/00014 ,  H05K3/3484 ,  H05K2201/10515 ,  H05K2201/1053 ,  Y02P70/613 ,  H01L2224/05599

Abstract: The object is the capability of providing a method of manufacturing mounting boards that enables extensive adoption of a stacked structure at a low cost. As a solution, in the method of manufacturing a mounting board in which a mounting board is manufactured by mounting a first electronic part 11 and a second electronic part 12 each having a solder bump in its bottom plane on a substrate 3 in stacked plural levels, after the first electronic part 11 is mounted on the substrate 3 that has been fed with solder, the solder bump 18 of the second electronic part 12 is mounted on the electrode 17 provided on the upper plane of the first electronic part 11, and thereafter the substrate 3 is heated in a reflow step to solder-bond the first electronic part 11 to substrate 3 along with solder-bonding the second electronic part 12 to the first electronic part 11. By such process, a stacked structure can be applied to a wide variety of electronic parts at a low cost.

Abstract translation: 目的是提供一种能够以低成本广泛采用堆叠结构的安装板的制造方法的能力。 作为解决方案，在制造安装基板的方法中，其中通过将底部平面上具有焊料凸块的第一电子部件11和第二电子部件12以多个层叠的方式安装在基板3上来制造， 在将第一电子部件11安装在已经供给焊料的基板3上之后，将第二电子部件12的焊料凸块18安装在设置在第一电子部件11的上平面上的电极17上， 衬底3在回流步骤中被加热，以将第一电子部件11焊接到衬底3上，同时将第二电子部件12焊接到第一电子部件11.通过这种工艺，堆叠结构可以应用于宽 各种电子零件成本低廉。