公开(公告)号：US20070105456A1

公开(公告)日：2007-05-10

申请号：US11511445

申请日：2006-08-29

Applicant: Yukio Hashimoto ,  Seiki Miura ,  Takumi Nishimoto ,  Takashi Tomago

Inventor： Yukio Hashimoto ,  Seiki Miura ,  Takumi Nishimoto ,  Takashi Tomago

IPC: H01R13/42

CPC classification number: H01R12/585 ,  H05K3/308 ,  H05K2201/1059 ,  H05K2201/10765 ,  H05K2201/10856

Abstract: A press-fit fixing terminal is mountable to a wiring board by being inserted into a through-hole of the wiring board, and includes a flat plate section and a resilient contacting section. The flat plate section is made of metal thin plate and double-backed such that an end of the flat plate section is placed on a root side and a bent point works as an insertion tip when the terminal is inserted into the through-hole. The resilient contacting sections sandwich the double-backed portion of the flat plate section such that they are placed symmetrically with respect to the double-backed portion and both of the ridges of the resilient contacting section face outward viewed from the double-backed portion, so that each one of the resilient contacting sections forms a V-shape including an obtuse angle.

Abstract translation: 压入固定端子通过插入到布线板的通孔中而安装到布线板，并且包括平板部分和弹性接触部分。 平板部分由金属薄板制成，并且当端子插入到通孔中时，平板部分的端部被放置在根部侧上，并且弯曲点用作插入尖端。 弹性接触部分夹着平板部分的双重部分，使得它们相对于双背部分对称地放置，并且弹性接触部分的两个脊部从双背部分向外看，因此 每个弹性接触部分形成包括钝角的V形。

公开(公告)号：US5635758A

公开(公告)日：1997-06-03

申请号：US426221

申请日：1995-04-21

Applicant: Karl-Gerd Drekmeier

Inventor： Karl-Gerd Drekmeier

IPC: H01R12/57 ,  H01R12/58 ,  H01R13/05 ,  H01R13/193 ,  H05K3/30 ,  H05K3/36 ,  H01L23/48

CPC classification number: H01R12/585 ,  H05K3/308 ,  H01R12/57 ,  H01R13/05 ,  H01R13/193 ,  H05K2201/1034 ,  H05K2201/10765 ,  H05K2201/10878 ,  H05K3/366

Abstract: A film integrated circuit includes at least one row of connection terminals to be connected in metallized holes of a given diameter formed in a printed circuit board. The connection terminals have a widened portion, one side with a pocket-like clamping contour to be connected to pads of a film IC, and another side to be connected to the printed circuit board and having a strip-like, comparatively narrower connection piece adjoining the widened portion. At least one of the connection pieces has a V-bend in a bending region forming a spring with one free arm and another arm being connected to the widened portion, for plug contacting in the holes formed in the printed circuit board. The V-bend has a bending radius being markedly smaller than the given diameter of a corresponding one of the holes formed in the printed circuit board. The bent connection pieces have a material thickness in the bending region being reduced by approximately 50%.

Abstract translation: 薄膜集成电路包括至少一排连接端子，以连接在形成在印刷电路板中的给定直径的金属化孔中。 连接端子具有加宽部分，一侧具有袋状夹持轮廓，以连接到胶片IC的焊盘，另一侧要连接到印刷电路板，并且具有带状的相对较窄的连接件邻接 加宽部分。 连接件中的至少一个在弯曲区域中具有形成具有一个自由臂的弹簧的弯曲区域，另一个臂连接到加宽部分，用于插塞接触形成在印刷电路板中的孔。 V形弯曲部的弯曲半径明显小于形成在印刷电路板中的相应一个孔的给定直径。 弯曲的连接件的弯曲区域的材料厚度减少了大约50％。

公开(公告)号：US4897624A

公开(公告)日：1990-01-30

申请号：US320257

申请日：1989-02-23

Applicant: Leroy S. Wignot ,  Robert P. Parker

Inventor： Leroy S. Wignot ,  Robert P. Parker

IPC: H01G5/00 ,  H01G5/16 ,  H01G5/38 ,  H01G5/40 ,  H03J1/00 ,  H03J3/20 ,  H05K1/18

CPC classification number: H01G5/16 ,  H03J3/20 ,  H05K1/18 ,  H05K2201/0792 ,  H05K2201/1003 ,  H05K2201/10765 ,  H05K2203/171

Abstract: Apparatus for adjusting capacitance between an electronic component and external circuitry. The electronic component is unitarily provided with a plurality of conductive leads for connection to external circuitry with at least one of the leads being configured to provide integral means for adjustment of capacitance. The configured lead is bent for a turnabout of about 180 degree change of direction such that when the component is mounted on a printed circuit board the portion of the lead distal of the component extends above the board and is positionally adjustable providing adjustable capactive coupling to other circuit components.

公开(公告)号：US3693052A

公开(公告)日：1972-09-19

申请号：US3693052D

申请日：1971-04-15

Applicant: WARWICK ELECTRONICS INC

Inventor： GALANTI FRANK

IPC: H05K1/14 ,  H05K3/30 ,  H05K3/34 ,  H05K3/36 ,  H05K1/18

CPC classification number: H05K1/141 ,  H05K3/308 ,  H05K3/3405 ,  H05K3/3447 ,  H05K3/366 ,  H05K2201/10446 ,  H05K2201/10651 ,  H05K2201/10765 ,  H05K2201/10878 ,  H05K2201/10939

Abstract: The connection of an electrical component to a printed circuit board wherein a lead to the component includes an offset being in frictional engagement with the walls of an opening within the circuit board, the apex of the offset being soldered to be able to electrically connect the lead to the printed circuit path on the underside of the board, the free end of the lead extending exteriorly of the board on the upper surface thereof.

Abstract translation: 电气部件与印刷电路板的连接，其中导向部件的引线包括与电路板内的开口的壁摩擦接合的偏移，所述偏移的顶点被焊接以能够电连接引线 在板的下侧上的印刷电路路径上，引线的自由端在其上表面上延伸到板的外部。

公开(公告)号：US3634601A

公开(公告)日：1972-01-11

申请号：US3634601D

申请日：1970-03-20

Applicant: AMP INC

Inventor： PAUZA WILLIAM VITO

IPC: H01R4/00 ,  H01R4/24 ,  H01R4/50 ,  H05K3/30 ,  H05K3/32 ,  H05K3/34 ,  H05K1/04

CPC classification number: H01R4/2491 ,  H01R4/50 ,  H01R12/58 ,  H05K3/308 ,  H05K3/34 ,  H05K2201/0281 ,  H05K2201/10287 ,  H05K2201/10295 ,  H05K2201/10356 ,  H05K2201/10765 ,  H05K2201/10878 ,  H05K2201/10962 ,  Y10S411/92

Abstract: A staking electrical contact for staking an electrical conductor onto a printed circuit board and in electrical engagement with a printed circuit path on the printed circuit board which comprises a body portion having spaced legs between which the electrical conductor is disposed and the legs are driven into slot means of the printed circuit board until the contact is bottomed whereupon the free ends of the legs are bent into engagement with the printed circuit path and soldered thereto.

Abstract translation: 用于将电导体放置在印刷电路板上并与印刷电路板上的印刷电路路径电接合的电接触件，其包括主体部分，该主体部分具有间隔开的支腿，电导体设置在该主体部分之间， 印刷电路板的装置，直到接点为底部，由此腿的自由端弯曲成与印刷电路路径接合并焊接到其上。

公开(公告)号：US3327284A

公开(公告)日：1967-06-20

申请号：US40139464

申请日：1964-10-05

Applicant: THOMAS & BETTS COMPANY INC

Inventor： CRIMMINS DAVID J

IPC: H01R4/10 ,  H05K3/30 ,  H05K3/34

CPC classification number: H01R4/10 ,  H01R12/58 ,  H05K3/308 ,  H05K3/3447 ,  H05K2201/0281 ,  H05K2201/10765 ,  H05K2201/1078 ,  H05K2201/10878 ,  Y10T29/49833 ,  Y10T29/49945

公开(公告)号：US2740097A

公开(公告)日：1956-03-27

申请号：US22187451

申请日：1951-04-19

Applicant: HUGHES AIRCRAFT CO

Inventor： EDELMAN AARON P ,  MORRIS WEINBERG

IPC: H01R12/52 ,  H04M1/02 ,  H05K1/14 ,  H05K3/34

CPC classification number: H05K1/148 ,  H01R12/52 ,  H05K3/3447 ,  H05K2201/10757 ,  H05K2201/10765 ,  H05K2201/10924

公开(公告)号：US20150348882A1

公开(公告)日：2015-12-03

申请号：US14727554

申请日：2015-06-01

Applicant: Infineon Technologies AG

Inventor： Alfred Swain Hong YEO

IPC: H01L23/495 ,  H05K1/18 ,  H01L21/56 ,  H01L23/31 ,  H01L25/16

CPC classification number: H01L23/49531 ,  H01L21/56 ,  H01L23/3107 ,  H01L23/495 ,  H01L23/49555 ,  H01L23/49589 ,  H01L25/16 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/181 ,  H05K1/18 ,  H05K3/3426 ,  H05K2201/10515 ,  H05K2201/10522 ,  H05K2201/1053 ,  H05K2201/10689 ,  H05K2201/10765 ,  H05K2201/10772 ,  H05K2201/10962 ,  Y02P70/613 ,  Y10T29/4913 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: An electronic device comprising a package comprising an encapsulated electronic chip, at least one at least partially exposed electrically conductive carrier lead for mounting the package on and electrically connecting the electronic chip to a carrier, and at least one at least partially exposed electrically conductive connection lead, and an electronic member stacked with the package so as to be mounted on and electrically connected to the package by the at least one connection lead.

Abstract translation: 一种包括封装的电子器件，包括封装的电子芯片，至少一个至少部分暴露的导电载体引线，用于将封装安装在电子芯片上并将其电连接到载体上;以及至少一个至少部分暴露的导电连接引线 以及与所述封装堆叠的电子部件，以通过所述至少一个连接引线安装在所述封装上并与所述封装电连接。

公开(公告)号：US20150194374A1

公开(公告)日：2015-07-09

申请号：US14590021

申请日：2015-01-06

Applicant: Iinfineon Technologies AG

Inventor： Sergey ANANIEV

IPC: H01L23/495 ,  H01L25/065 ,  H01L23/00 ,  H01L21/56 ,  H01L23/31

CPC classification number: H01L23/49575 ,  H01L23/3121 ,  H01L23/49555 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/50 ,  H01L24/73 ,  H01L2224/32013 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48096 ,  H01L2224/48101 ,  H01L2224/48106 ,  H01L2224/48145 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/13055 ,  H01L2924/181 ,  H05K3/3426 ,  H05K2201/10757 ,  H05K2201/10765 ,  H05K2201/10772 ,  Y02P70/613 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2924/00

Abstract: A package (120), wherein the package (120) has at least one electronic chip (124), an encapsulation body (138) that encapsulates the electronic chip(s) (124), and a plurality of terminal pins (122) to connect the electronic chip(s) (124), wherein each of the said terminal pins (122) has an encapsulated section (126), which is encapsulated at least partially by the encapsulation body (138) and has an exposed section (128) that protrudes from the encapsulation body (138), and wherein at least a portion of the exposed sections (128) laterally extends from the encapsulation body (138) up to a reversal point (130) and laterally extends back from the reversal point (130) to the encapsulation body (138), so that a free end (132) of the exposed sections (128) is laterally aligned with or to a corresponding side wall (134) of the encapsulation body (138) or is spaced from the corresponding side wall (134) of the encapsulation body (138) laterally outwardly.

Abstract translation: 一种封装（120），其中所述封装（120）具有至少一个电子芯片（124），封装所述电子芯片（124）的封装体（138），以及多个端子引脚（122）， 连接所述电子芯片（124），其中所述端子引脚（122）中的每一个具有封装部分（126），所述封装部分至少部分地由所述封装体（138）封装并具有暴露部分（128） 其从所述封装主体（138）突出，并且其中所述暴露部分（128）的至少一部分从所述封装体（138）横向延伸到反转点（130）并且横向从所述反转点（130）向后延伸 ），以使得暴露部分（128）的自由端（132）与封装主体（138）的相应侧壁（134）横向对准或者与相应的封闭主体（138）的相应侧壁（134）间隔开 封闭体（138）的侧壁（134）横向向外。

公开(公告)号：US20140252583A1

公开(公告)日：2014-09-11

申请号：US13786129

申请日：2013-03-05

Applicant: INFINEON TECHNOLOGIES AG

Inventor： Andrea Carletti

IPC: H01L23/34 ,  H01L23/00

CPC classification number: H01L23/34 ,  H01L23/36 ,  H01L23/4006 ,  H01L23/42 ,  H01L24/92 ,  H01L2924/0002 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H05K1/0203 ,  H05K3/3426 ,  H05K3/3447 ,  H05K2201/10757 ,  H05K2201/10765 ,  H05K2201/2036 ,  H01L2924/00

Abstract: A method and apparatus for assembling a power semiconductor is provided. A device includes a printed circuit board, a heat sink, and a semiconductor chip package. The semiconductor chip package is located between the printed circuit board and the heat sink. A heat-generating surface of the semiconductor chip package is oriented such that the heat-generating surface faces the heat sink.

Abstract translation: 提供了一种用于组装功率半导体的方法和装置。 一种器件包括印刷电路板，散热器和半导体芯片封装。 半导体芯片封装位于印刷电路板和散热片之间。 半导体芯片封装的发热表面被定向成使得发热表面面向散热器。