公开(公告)号：US20040079283A1

公开(公告)日：2004-04-29

申请号：US10689454

申请日：2003-10-20

Inventor： Keiichi Aoki

IPC: B24B001/00 ,  B05C005/00 ,  B05C015/00 ,  B05B013/02

CPC classification number: G03C1/74 ,  B05C5/007 ,  B05C5/0254 ,  B05C9/06 ,  B24B1/00 ,  B24B19/20 ,  G03C1/498

Abstract: In an apparatus in which when a photothermographic material is produced, a photosensitive layer liquid coating composition including a silver component and a non-photosensitive protective layer liquid coating composition are applied onto a web employing a slot coater, a coating apparatus for producing a photothermographic material wherein the slot coater is constituted so that the center-line surface roughness Ra of the lip plane, which comes into contact with at least the photosensitive layer liquid coating composition, is equal to or less than 0.5 nullm.

Abstract translation: 在制造光热敏成像材料的装置中，将包含银成分和非感光性保护层液体涂料组合物的感光层液体涂料组合物涂布在使用狭缝涂布机的卷筒纸上，制作光热敏成像材料的涂布装置 其特征在于，所述狭缝涂布机构成为与至少所述感光层液体涂料组合物接触的所述唇面的中心线表面粗糙度Ra为0.5μm以下。

公开(公告)号：US20010050044A1

公开(公告)日：2001-12-13

申请号：US09833028

申请日：2001-04-11

Applicant: Durr Systems GmbH

Inventor： Guenther Mueller ,  Guenter Walter

IPC: B05B013/02

CPC classification number: F16P1/00 ,  B05B16/40

Abstract: In order to provide a walk-on platform arrangement, comprising at least one first sub-platform, which is movable from a rest position in a direction of extension into a working position, and a second sub-platform, which in the working position is disposed behind the first sub-platform, wherein a rear boundary edge of the first sub-platform and a front boundary edge of the second sub-platform in the rest position are spaced vertically apart from one another, with which platform arrangement the risk of accident for an operative walking on the platform arrangement in the working position is reduced, it is proposed that the platform arrangement comprises a guide system, by means of which the relative motion between the first sub-platform and the second sub-platform as the first sub-platform moves into the working position is guided in such a way that the vertical distance between the rear boundary edge of the first sub-platform and the front boundary edge of the second sub-platform in the working position is smaller than in the rest position.

Abstract translation: 为了提供一种步行平台装置，包括至少一个第一子平台，该第一子平台可在从延伸方向的静止位置移动到工作位置中;以及第二子平台，其在工作位置是 设置在第一子平台的后面，其中第一子平台的后边界边缘和处于静止位置的第二子平台的前边界边缘彼此垂直间隔开，平台布置有事故风险 对于在工作位置的平台装置上行走的操作人员减少，建议平台装置包括导向系统，通过该导向系统，第一子平台和第二子平台之间的相对运动作为第一子 - 平台移动到工作位置被引导为使得第一子平台的后边界边缘与第二子平台的前边界边缘之间的垂直距离在 工作位置小于休息位置。

公开(公告)号：US20010006041A1

公开(公告)日：2001-07-05

申请号：US09767411

申请日：2001-01-23

Inventor： Richard W. Wensel

IPC: B05C007/00 ,  B32B031/00 ,  B05B013/02

CPC classification number: H01L21/6715 ,  H01L21/67144 ,  H01L23/4951 ,  H01L23/49513 ,  H01L24/27 ,  H01L24/29 ,  H01L2224/83805 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/15747 ,  H01L2924/181 ,  Y10T156/1798 ,  H01L2924/01014 ,  H01L2924/00 ,  H01L2924/01026 ,  H01L2924/01028 ,  H01L2924/3512

Abstract: An apparatus and method for evenly applying an atomized adhesive for bonding a die to a leadframe is disclosed. In one embodiment, the apparatus includes a hood in communication with an air supply and a vacuum plenum. The hood and vacuum plenum encompass a semiconductor device component located in a target area during adhesive application so that the adhesive is selectively applied to specific portions of the leadframe or other semiconductor device component and adhesive is not allowed outside the system. A mask or stencil may be employed to further prevent the application of adhesive to undesired areas. An air purge may be employed to direct the adhesive mist toward the component to be coated. In another embodiment, a fine adhesive spray is directed against the surface of the workpiece to be coated, selected areas being masked to prevent coating. Wafers may be coated as well as leadframes.

Abstract translation: 公开了一种用于均匀地施加雾化的粘合剂以将模具结合到引线框架的装置和方法。 在一个实施例中，该装置包括与空气供应和真空增压室连通的罩。 罩和真空室包括在粘合剂施加期间位于目标区域中的半导体器件部件，使得粘合剂被选择性地施加到引线框架或其它半导体器件部件的特定部分，并且粘合剂不允许在系统外部。 可以使用掩模或模板来进一步防止粘合剂施加到不期望的区域。 可以使用空气吹扫来将粘合剂雾引向待涂覆的部件。 在另一个实施方案中，精细粘合剂喷雾被引导到待涂覆的工件的表面上，所选择的区域被掩蔽以防止涂覆。 晶片可以被涂覆以及引线框架。

公开(公告)号：US20040089229A1

公开(公告)日：2004-05-13

申请号：US10697317

申请日：2003-10-31

Applicant: Kabushiki Kaisha Toshiba

Inventor： Tatsuhiko Ema ,  Shinichi Ito

IPC: B05D003/00 ,  B05C005/00 ,  B05C015/00 ,  B05B013/02

CPC classification number: B05D3/02 ,  B05D1/02 ,  B05D1/26

Abstract: Using a scan coating method, a liquid film is formed on a substrate having a temperature distribution for correcting a temperature distribution of a liquid film caused by the heat of evaporation due to the volatilization of a solvent contained in the liquid film, and then the solvent is removed from the liquid film to form a coating film.

公开(公告)号：US20040050322A1

公开(公告)日：2004-03-18

申请号：US10608859

申请日：2003-06-27

Inventor： Brian Barber ,  John Young

IPC: B05D005/10 ,  B05B013/02 ,  B05B015/04

CPC classification number: B05C5/0287 ,  B05C5/0241 ,  B05C11/1039 ,  B05D5/10 ,  B05D2254/02 ,  Y10S118/11 ,  Y10S118/13

Abstract: An apparatus and method are provided for applying adhesive to an outer circumference of a section of tubing. The apparatus includes opposed grippers with concave adhesive transfer areas that can be moved into surrounding relationship with the tubing. Adhesive dispensing passages communicate with the adhesive transfer areas for delivering adhesive to the tubing. Counterbores are at opposed ends of the adhesive transfer areas and communicate with a vacuum source for removing excess adhesive.

Abstract translation: 提供了一种用于将粘合剂施加到一段管道的外周的装置和方法。 该设备包括具有凹入的粘合剂转移区域的相对的夹持器，其可以移动到与管道的周围关系中。 粘合剂分配通道与用于将粘合剂输送到管道的粘合剂转移区域连通。 沉积物位于粘合剂转移区域的相对端并与真空源连通以除去多余的粘合剂。

公开(公告)号：US20020179450A1

公开(公告)日：2002-12-05

申请号：US09871557

申请日：2001-05-31

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Ralph A. Barrese ,  Gary Gajdorus ,  Allen H. Hopkins ,  John J. Konrad ,  Robert C. Schaffer ,  Timothy L. Wells

IPC: C25D021/12 ,  C25D005/00 ,  C25D005/08 ,  B05C003/02 ,  B05B013/02 ,  B05B009/00 ,  B05C005/00 ,  C25D017/00

CPC classification number: C25D17/008 ,  C25D5/00 ,  C25D5/003 ,  C25D17/12 ,  C25D21/12 ,  Y10S204/07

Abstract: An apparatus and method for plating a workpiece. The apparatus comprises, generally, an anode, a cathode, and a selective anode shield/material flow assembly. In use, both the anode and the cathode are immersed in a solution, and the cathode is used to support the workpiece. During an electroplating process, the anode and the cathode generate an electric field emanating from the anode towards the cathode, to generate a corresponding current to deposit an electroplating material on the workpiece. The selective shield/material flow assembly is located between the anode and the cathode, and forms a multitude of adjustable openings. These opening have sizes that are adjustable during the electroplating process for selectively and controllably adjusting the amount of electric flux passing through the selective shield/material flow assembly and the distribution of the electroplating material on the workpiece. The selective shield/material flow assembly can also be used with an electroless plating system. At least one selective shield material flow mechanism is used in a selective shield material flow assembly.

Abstract translation: 一种用于电镀工件的装置和方法。 该装置通常包括阳极，阴极和选择性阳极屏蔽/材料流组件。 在使用中，将阳极和阴极两者浸入溶液中，阴极用于支撑工件。 在电镀过程中，阳极和阴极产生从阳极向阴极发出的电场，以产生相应的电流，以将电镀材料沉积在工件上。 选择性屏蔽/材料流动组件位于阳极和阴极之间，并形成多个可调开口。 这些开口具有在电镀过程中可调节的尺寸，用于选择性地和可控地调节通过选择性屏蔽/材料流组件的电流量以及电镀材料在工件上的分布。 选择性屏蔽/材料流动组件也可以与无电镀系统一起使用。 在选择性屏蔽材料流动组件中使用至少一种选择性屏蔽材料流动机构。

公开(公告)号：US20040129208A1

公开(公告)日：2004-07-08

申请号：US10360774

申请日：2002-03-27

Inventor： Hans J. Nolte ,  Harry Krumma ,  Frank Herre ,  Michael Baumann ,  Stefano Giuliano ,  Rainer Melcher ,  Juergen Haas

IPC: B05C005/00 ,  B05B013/02

CPC classification number: B25J15/0491 ,  B05B12/1454 ,  B05B13/0431 ,  Y10T483/10 ,  Y10T483/17

Abstract: A change station for atomizer (7) and other tools that contains a carousel-like rotatable and/or linearly movable mount (112) is arranged on the wall of the cabin of a coating installation. The arrangement is such that the storage locations of the change station are accessible both to the coating machine (151) in the cabin and from outside the cabin.

Abstract translation: 用于雾化器（7）的更换台和包含转盘式可旋转和/或可直线移动的支架（112）的其它工具布置在涂装设备的机舱的壁上。 这种布置使得更换台的存储位置可以在机舱内的涂布机（151）和从机舱外面访问。

公开(公告)号：US20040107900A1

公开(公告)日：2004-06-10

申请号：US10691763

申请日：2003-10-23

Inventor： Scott J. Clifford ,  Eric D. Buchanan ,  James M. Kowalski ,  Roy A. Jerue ,  Paul D. Copioli ,  Michael G. Beem

IPC: B05C005/00 ,  B05B013/02

CPC classification number: B05B13/0452 ,  B05B12/14 ,  B05B13/0431

Abstract: An apparatus for processing objects includes an elevated tubular frame rail mounting a four axis robot arm with a tool such as a painting applicator. The robot is attached to a mounting base that moves along the rail permitting painting of the top and/or side of a vehicle body. Electrical power and fluid lines can be routed through the rail to the robot. Two such rails and multiple robots can be combined as a module for installation in a new or an existing painting booth.

Abstract translation: 一种用于处理物体的装置包括一个竖立的管状框架导轨，其安装有一个诸如喷涂器的工具的四轴机器人手臂。 机器人附接到沿着轨道移动的安装基座，允许车身的顶部和/或侧面的涂漆。 电力和流体管线可以通过导轨路由到机器人。 两个这样的轨道和多个机器人可以组合为用于安装在新的或现有的喷漆室中的模块。

公开(公告)号：US20040083950A1

公开(公告)日：2004-05-06

申请号：US10695896

申请日：2003-10-29

Applicant: Valmet Corporation

Inventor： Vilho Nissinen ,  Timo Nyberg ,  Pasi Rajala ,  Lars Gronroos ,  Pentti Virtanen ,  Veli Kasma ,  Hannu Niemela

IPC: B05C011/00 ,  B05C005/00 ,  B05B013/02

CPC classification number: B82Y30/00 ,  C01F11/18 ,  C01P2004/64 ,  D21H17/675 ,  D21H17/70 ,  D21H19/385 ,  D21H23/30 ,  Y10T428/25 ,  Y10T428/258 ,  Y10T428/2938 ,  Y10T428/294 ,  Y10T428/31996

Abstract: Method and assembly for forming a paper or board web and a product made using the method. According to the method, the web (11) is made from fibers and then the web (11) is treated with pigment particles. The web is treated with microscopic pigment particles whose average size is so small as to permit the particles to adhere to each other by van der Waals forces. The particles are transferred to the web and adhered thereto advantageously using an ion-blast technique.

Abstract translation: 用于形成纸或纸板的方法和组装以及使用该方法制造的产品。 根据该方法，纤维网（11）由纤维制成，然后纤维网（11）用颜料颗粒处理。 用平均尺寸如此小的微观颜料颗粒处理网，以允许颗粒通过范德华力彼此粘合。 将颗粒转移到纤维网上并且有利地使用离子吹扫技术粘附在其上。

公开(公告)号：US20020136821A1

公开(公告)日：2002-09-26

申请号：US09980099

申请日：2002-04-18

Inventor： Yutaka Yamagata ,  Kozo Inoue

IPC: B05D003/00 ,  B05B013/02 ,  B01L003/02

CPC classification number: B01J19/0046 ,  B01J2219/00317 ,  B01J2219/00351 ,  B01J2219/00353 ,  B01J2219/0036 ,  B01J2219/00369 ,  B01J2219/00371 ,  B01J2219/0043 ,  B01J2219/00457 ,  B01J2219/00497 ,  B01J2219/00527 ,  B01J2219/00529 ,  B01J2219/00585 ,  B01J2219/0059 ,  B01J2219/00596 ,  B01J2219/00605 ,  B01J2219/00608 ,  B01J2219/0061 ,  B01J2219/00612 ,  B01J2219/00637 ,  B01J2219/00659 ,  B01J2219/00662 ,  B01J2219/00689 ,  B01J2219/00713 ,  B01J2219/00722 ,  B01J2219/00725 ,  C40B40/06 ,  C40B40/10 ,  C40B60/14

Abstract: A device for fabricating a high-density microarray for cDNA or protein having an arbitrary pattern comprises an electrospray part for electrostatically spraying solutions containing a plurality of kinds of biologically active samples one by one, a support part supporting sample chips on which samples in the solutions sprayed from the electrospray part are deposited, a mask part disposed between the electrospray part and the support part and having holes the number of which is the same as that of the sample chips so as to selectively deposit the samples simultaneously in the adequate positions corresponding to the sample chips, a moving part for fabricating microarrays at a time by relatively moving the sample chip support part and the mask part and depositing the samples on the sample chips. Therefore the device can fabricate a large number of inexpensive high-density microarrays.

Abstract translation: 用于制造具有任意图案的cDNA或蛋白质的高密度微阵列的装置包括：电喷射部分，用于静电喷涂含有多种生物活性样品的溶液，支撑部分，其支撑样品芯片，溶液中的样品 沉积从电喷雾部分喷射的掩模部分，设置在电喷雾部分和支撑部分之间并具有与样品芯片相同数量的孔的掩模部分，以便选择性地将样品沉积在对应于 样品芯片，用于通过相对移动样品芯片支撑部分和掩模部分一次制造微阵列的移动部件并将样品沉积在样品芯片上。 因此，该装置可以制造大量便宜的高密度微阵列。