Abstract:
An image sensor package (10) includes a housing (34) defining a top opening, an image sensor (14) received in the housing, and a converging lens (36) covering the opening to hermetically seal the housing and form a window for light to pass through into the housing. The image sensor has an active area which faces the converging lens and which is responsive to light. The converging lens not only provides hermetic sealing for the housing, but also converges light before the light strikes the active area of the image sensor. Accordingly, a focal length F is reduced, and a size of the image sensor package and the image sensor system can be reduced.
Abstract:
Embodiments of the present invention utilize two photodiodes on the same substrate, one illuminated monitor photodiode to monitor an optical beam out of a back facet (or back scattered) of a laser, and one non-illuminated reference photodiode to characterize in real time radio frequency (RF) parameters/performance to control extinction ratio and optical modulation amplitude of the laser beam.
Abstract:
An integrated circuit which provides multi-channel detector readout from a detector array. The circuit receives multiple signals from the elements of a detector array and compares the sampled amplitudes of these signals against a noise-floor threshold and against one another. A digital signal is generated which corresponds to the location of the highest of these signal amplitudes which exceeds the noise floor threshold. The digital signal is received by a multiplexing circuit which outputs an analog signal corresponding the highest of the input signal amplitudes. In addition a digital control section provides for programmatic control of the multiplexer circuit, amplifier gain, amplifier reset, masking selection, and test circuit functionality on each input thereof.
Abstract:
An optical transmitter of the invention comprises a thermoelectric module, a light emitting device, and a light receiving device. The thermoelectric module comprises a first plate, a second plate, and a thermoelectric transducer. The first plate is made of insulating material. The second plate includes a first region and a second region, and at least the first region is disposed opposite to the first plate. The thermoelectric transducer is interposed between the first plate and the second plate, and is in contact with the first plate and the first region. The light emitting device is supported by the first plate. The light receiving device is mounted on the second region of the second plate, and receives portion of light emitted from the light emitting device.
Abstract:
In an embodiment of the invention the circuit for monitoring an optical signal detector comprises a current divider current mirror and a current multiplier current mirror. The current divider current mirror has a mirror leg and a primary leg. The primary leg is coupled to the optical signal detector. The current divider current mirror is configured to generate mirror leg current corresponding with a fraction of the primary leg current. The current multiplier current mirror has a mirror leg and a primary leg coupled to the mirror leg of the current divider current mirror. The current multiplier current mirror is configured to generate mirror leg current corresponding with a multiple of the primary leg current. In another embodiment the circuit comprises a first and second current mirror. The first current mirror has a primary current leg and a mirror current leg with the primary current leg exhibiting a resistance corresponding with a fractional part of the resistance exhibited by the mirror current leg, and with the primary current leg of the first current mirror series coupled between the optical signal detector and one of an electrical source and an electrical sink. The second current mirror has a primary current leg and a mirror current leg with the mirror current leg of the second current mirror exhibiting a resistance corresponding with a fractional part of the resistance exhibited by the primary current leg of the second current mirror, and with the primary current leg of the second current mirror series coupled with the mirror current leg of the first current mirror.
Abstract:
A tunable bolometer device for detecting infrared light (IR) from a target at specific frequencies and in a broadband mode. The device may have an array of pixels of which each is controllable to be sensitive to a particular wavelength of light that is selected and detected. The detection of particular frequencies on a pixel level may result in spectral analysis of the target. Further, each pixel of the bolometer via an associated etalon may be tuned to detect a different frequency of IR or be switched to broadband detection of IR. The device may be packaged in an integrated vacuum package where the etalon array becomes the topcap which is bonded to the wafer containing the bolometer array.
Abstract:
A securing device includes a sustaining member, a plurality of threaded holes, and a plurality of screws. The sustaining member includes a clamped portion and a securing portion extending from the clamped portion. The clamped portion is interfaced between the photoelectric conversion device and the carriage module housing. The thickness of the clamped portion is even enough to keep the distance between the photoelectric conversion device and the carriage module housing constant, thereby assuring that the photoelectric conversion device is orthogonal to the central line of a lens in the carriage module housing. The securing portion is flexible so as to facilitate the assembling operation of the circuit board, the photoelectric conversion device and the carriage module housing by way of the threaded holes and screws.
Abstract:
Apparatus for circularizing an optical beam and directing the beam into an optical system has mutually perpendicular X, Y, and Z axes. The Z-axis is the propagation axis of the beam. A detector arrangement receives a sample of the optical beam. The detector arrangement has four detector elements arranged in four quadrants defined by an x-axis and a y-axis of the detector arrangement, perpendicular to each other. The x and y-axes of the quadrant detector are arranged at 45 degrees to the X and Y-axes of the apparatus. Signals from the four detector elements provide information on the extent to which the beam is not circular and on any displacement of the beam in the X and Y-axes.
Abstract:
Ultra-low leakage current backside-illuminated semiconductor photodiode arrays are fabricated using a method of formation of a transparent, conducting bias electrode layer that avoids high-temperature processing of the substrate after the wafer has been gettered. As a consequence, the component of the reverse-bias leakage current associated with strain, crystallographic defects or impurities introduced during elevated temperature processing subsequent to gettering can be kept extremely low. An optically transparent, conductive bias electrode layer, serving as both an optical window and an ohmic backside equipotential contact surface for the photodiodes, is fabricated by etching through the polysilicon gettering layer and a portion of the thickness of heavily-doped crystalline silicon layer formed within, and near the back of, the substrate during the gettering process.
Abstract:
A light detection device which can be stably surface-mounted on, for example, a circuit board or the like, and a mounting method thereof are provided. A light-receiving element includes, a transparent conductive electrode (first electrode), a semiconductor layer, and an electrode (first electrode), which are sequentially laminated on a transparent substrate. An insulative substrate includes a terminal electrode (second electrode) which is provided to be exposed at first and second faces of the insulative substrate. The light-receiving element is disposed at the first face of the insulative substrate, and the transparent conductive electrode and the electrode are electrically connected with the terminal electrode exposed at the first face of the insulative substrate. Hence, the light detection device with this structure is surface-mounted on the circuit board such that the terminal electrode exposed at the second face of the insulative substrate connects with an external terminal of the circuit board.