A chip carrier (100) is disclosed. The chip carrier comprises a thermally conductive and electrically insulating sheet (102), a first electrically conductive structure (104) on a first main surface ofthe sheet (102), and a second electrically conductive structure (106) on a second main surface of the sheet (102), wherein the first electrically conductive structure (104) and the second electrically conductive structure (106) extend beyond a lateral edge of the sheet (102).