The utility model provides a semiconductor device and for semiconductor device shell. Provide and plant semiconductor device like next: even up to near the circumstances the upper surface of shell under, can not cause that the outward appearance is bad, with the cementability reduction of lid injecting sealing material into yet semiconductor device (1) possesses insulation substrate (2), carries on semiconductor component (3) on insulation substrate (2), comes sealing material (10) with the shell inside seal in the periphery that surrounds insulation substrate (2) is acceptd hollow shell (6) of semiconductor component (3) and is filled shell (6). Shell (6) have from the local outstanding jut (6f) of upper surface (6c) of shell (6).