- Patent Title: Reduction-oxidation sensor device and manufacturing method thereof
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Application No.: US15867724Application Date: 2018-01-11
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Publication No.: US10697919B2Publication Date: 2020-06-30
- Inventor: Ming-Chih Tsai , Yu-Hsuan Ho , Yen-Jui Chu , Ming-Hung Hsieh
- Applicant: Winbond Electronics Corp.
- Applicant Address: TW Taichung
- Assignee: Winbond Electronics Corp.
- Current Assignee: Winbond Electronics Corp.
- Current Assignee Address: TW Taichung
- Agency: JCIPRNET
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@5b115072
- Main IPC: G01N27/12
- IPC: G01N27/12 ; B41J2/04

Abstract:
A reduction-oxidation sensor device and a manufacturing method thereof are provided. The reduction-oxidation sensor device includes a first electrode, at least one sensing structure and a second electrode. The first electrode is located on a substrate. The at least one sensing structure is located on the first electrode and the substrate. The at least one sensing structure includes a metal nanowire layer and a metal oxide layer. The metal nanowire layer is disposed on the first electrode and the substrate. The metal nanowire layer is wrapped by the metal oxide layer. The second electrode is located on the at least one sensing structure.
Public/Granted literature
- US20180209927A1 REDUCTION-OXIDATION SENSOR DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2018-07-26
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