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    Reduction-oxidation sensor device and manufacturing method thereof
    1.
    发明授权
    Reduction-oxidation sensor device and manufacturing method thereof 有权

    公开(公告)号：US10697919B2

    公开(公告)日：2020-06-30

    申请号：US15867724

    申请日：2018-01-11

    Applicant: Winbond Electronics Corp.

    Inventor： Ming-Chih Tsai ,  Yu-Hsuan Ho ,  Yen-Jui Chu ,  Ming-Hung Hsieh

    IPC: G01N27/12 ,  B41J2/04

    Abstract: A reduction-oxidation sensor device and a manufacturing method thereof are provided. The reduction-oxidation sensor device includes a first electrode, at least one sensing structure and a second electrode. The first electrode is located on a substrate. The at least one sensing structure is located on the first electrode and the substrate. The at least one sensing structure includes a metal nanowire layer and a metal oxide layer. The metal nanowire layer is disposed on the first electrode and the substrate. The metal nanowire layer is wrapped by the metal oxide layer. The second electrode is located on the at least one sensing structure.

    Patterned structure for electronic device and manufacturing method thereof
    5.
    发明授权
    Patterned structure for electronic device and manufacturing method thereof 有权

    公开(公告)号：US10818497B2

    公开(公告)日：2020-10-27

    申请号：US15681436

    申请日：2017-08-21

    Applicant: Winbond Electronics Corp.

    Inventor： Yen-Jui Chu ,  Hsin-Hung Chou ,  Ming-Chih Tsai

    IPC: H01L21/28 ,  H01L23/00 ,  H01L25/065 ,  B81C1/00 ,  H01L21/3213 ,  H01L29/49

    Abstract: The present invention provides a patterned structure for an electronic device and a manufacturing method thereof. The patterned structure includes a patterned layer, a blocking structure, a cantilever structure, and a connection structure. The patterned layer is disposed on a substrate. The blocking structure is disposed on the substrate at one side of the patterned layer, wherein a thickness of the blocking structure is smaller than a thickness of the patterned layer. The cantilever structure is disposed on the substrate and located between the patterned layer and the blocking structure. The cantilever structure is connected with the patterned layer and the blocking structure. The connection structure is connected between the patterned layer and the substrate at one side of the patterned layer, and located on the cantilever structure and the blocking structure.

    GAS DETECTING DEVICE
    7.
    发明申请
    GAS DETECTING DEVICE 审中-公开

    公开(公告)号：US20180202956A1

    公开(公告)日：2018-07-19

    申请号：US15594669

    申请日：2017-05-15

    Applicant: Winbond Electronics Corp.

    Inventor： Ming-Hung Hsieh ,  Yu-Hsuan Ho ,  Ming-Chih Tsai ,  Yen-Jui Chu

    IPC: G01N27/04 ,  G01N33/00 ,  G08B21/12

    CPC classification number: G08B21/12 ,  G01N27/125 ,  G01N33/0036 ,  G08B21/14

    Abstract: A gas detecting device configured to be attached to a surface includes a substrate, a semiconductor layer, a light-emitting component, a first electrode and a second electrode. The substrate includes a plurality of stacking layers stacked onto one another, and a material of the substrate includes cellulose nanofibrils (CNF). The substrate is formed by 3-D printing, such that a contact surface of the substrate is tightly attached to the surface. The semiconductor layer is formed on the substrate by 3-D printing. The light-emitting component is disposed on the substrate. The first electrode is coupled to the semiconductor layer and the light-emitting component. The second electrode is coupled to the semiconductor layer and a ground electrode. The first electrode and the second electrode are both disposed on the semiconductor layer and maintain a gap therebetween. A resistance of the semiconductor layer is changed according to a concentration of a designated gas.

    Resistive environmental sensor and resistive environmental sensor array
    10.
    发明授权
    Resistive environmental sensor and resistive environmental sensor array 有权

    公开(公告)号：US10788521B2

    公开(公告)日：2020-09-29

    申请号：US15786610

    申请日：2017-10-18

    Applicant: Winbond Electronics Corp.

    Inventor： Yu-Hsuan Ho ,  Ming-Chih Tsai

    IPC: G01R27/14 ,  H01L29/41 ,  G01J5/04 ,  G01J5/20 ,  G01J1/42 ,  G01J5/10 ,  G01N27/12 ,  G01J5/22 ,  G01N27/04

    Abstract: A resistive environmental sensor including an electrode stack and a sensing layer is provided. The electrode stack includes a first electrode layer, a second electrode layer, and a dielectric layer disposed between the first and second electrode layers, wherein the electrode stack includes a side surface, and the first and second electrode layers are exposed on the side surface of the electrode stack. The sensing layer is disposed on the side surface of the electrode stack, and the sensing layer s in contact with the first and second electrode layers. An environmental variation is inspected by sensing a resistance variation of the sensing layer that is between the first and second electrode layers. The above-mentioned sensor is capable of sensing gases, light, humidity, temperature, and so on. The above-mentioned sensor has advantages of low resistivity and good sensitivity.

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