Invention Grant
- Patent Title: Silver-coated alloy powder, electrically conductive paste, electronic part, and electric device
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Application No.: US16329069Application Date: 2017-08-31
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Publication No.: US11041229B2Publication Date: 2021-06-22
- Inventor: Kyoso Masuda , Kenichi Inoue , Yuki Kaneshiro , Atsushi Ebara , Yoshiyuki Michiaki , Kozo Ogi , Takahiro Yamada , Masahiro Yoshida
- Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: DOWA ELECTRONICS MATERIALS CO., LTD.
- Current Assignee: DOWA ELECTRONICS MATERIALS CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Greenblum & Bernstein P.L.C.
- Priority: JPJP2016-169436 20160831
- International Application: PCT/JP2017/031470 WO 20170831
- International Announcement: WO2018/043681 WO 20180308
- Main IPC: B32B5/16
- IPC: B32B5/16 ; C22C9/06 ; B22F1/00 ; H01G4/232 ; H01B5/00 ; H01B1/00 ; C22C9/00 ; H01G4/30 ; C22C9/04 ; B22F1/02 ; H01B1/22 ; H01G4/228 ; H05K1/09
Abstract:
An object of the present invention is to provide metal powder that can be used to form an external electrode, which is excellent in solder wettability and solder leach resistance while having a layer structure with fewer layers than in the related art and, furthermore, is excellent in electrical conductivity. This silver-coated alloy powder comprises a coating layer on a surface of an alloy core particle containing copper, nickel, zinc, and inevitable impurities, the coating layer containing silver.
Public/Granted literature
- US20190194778A1 SILVER-COATED ALLOY POWDER, ELECTRICALLY CONDUCTIVE PASTE, ELECTRONIC PART, AND ELECTRIC DEVICE Public/Granted day:2019-06-27
Information query
