公开(公告)号：US10458004B2

公开(公告)日：2019-10-29

申请号：US14918948

申请日：2015-10-21

Applicant: DOWA Electronics Materials Co., Ltd.

Inventor： Kozo Ogi ,  Kenichi Inoue ,  Atsushi Ebara ,  Akihiro Asano ,  Hideyuki Fujimoto ,  Takahiro Yamada

IPC: C22C12/00 ,  H05K1/09 ,  B22F1/00 ,  H01B1/22 ,  C22C5/06 ,  B22F9/08

Abstract: To provide a silver-bismuth powder, which includes: silver; and bismuth, wherein a mass ratio (silver:bismuth) of the silver to the bismuth is 95:5 to 40:60, wherein a cumulative 50% point of particle diameter (D50) of the silver-bismuth powder in a volume-based particle size distribution thereof as measured by a laser diffraction particle size distribution analysis is 0.1 μm to 10 μm, and wherein an oxygen content of the silver-bismuth powder is 5.5% by mass or less.

公开(公告)号：US11041229B2

公开(公告)日：2021-06-22

申请号：US16329069

申请日：2017-08-31

Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.

Inventor： Kyoso Masuda ,  Kenichi Inoue ,  Yuki Kaneshiro ,  Atsushi Ebara ,  Yoshiyuki Michiaki ,  Kozo Ogi ,  Takahiro Yamada ,  Masahiro Yoshida

IPC: B32B5/16 ,  C22C9/06 ,  B22F1/00 ,  H01G4/232 ,  H01B5/00 ,  H01B1/00 ,  C22C9/00 ,  H01G4/30 ,  C22C9/04 ,  B22F1/02 ,  H01B1/22 ,  H01G4/228 ,  H05K1/09

Abstract: An object of the present invention is to provide metal powder that can be used to form an external electrode, which is excellent in solder wettability and solder leach resistance while having a layer structure with fewer layers than in the related art and, furthermore, is excellent in electrical conductivity. This silver-coated alloy powder comprises a coating layer on a surface of an alloy core particle containing copper, nickel, zinc, and inevitable impurities, the coating layer containing silver.

公开(公告)号：US10062473B2

公开(公告)日：2018-08-28

申请号：US14372789

申请日：2013-01-15

Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.

Inventor： Kenichi Inoue ,  Kozo Ogi ,  Atsushi Ebara ,  Yuto Hiyama ,  Takahiro Yamada ,  Toshihiko Ueyama

IPC: H01B1/22 ,  B22F1/02 ,  C22C9/00 ,  C22C9/04 ,  C22C9/06 ,  H01B1/02 ,  B22F1/00 ,  C22C1/04 ,  C22C5/06 ,  B22F9/08

CPC classification number: H01B1/22 ,  B22F1/0011 ,  B22F1/0074 ,  B22F1/025 ,  B22F9/082 ,  C22C1/0425 ,  C22C5/06 ,  C22C9/04 ,  C22C9/06 ,  H01B1/026 ,  Y10T428/2991

Abstract: A silver-coated copper alloy powder, which has a low volume resistivity and excellent storage stability (reliability), is produced by coating a copper alloy powder, which has a chemical composition comprising 1 to 50 wt % of at least one of nickel and zinc and the balance being copper and unavoidable impurities (preferably a copper alloy powder wherein a particle diameter (D50 diameter) corresponding to 50% of accumulation in cumulative distribution of the copper alloy powder, which is measured by a laser diffraction particle size analyzer, is 0.1 to 15 μm), with 7 to 50 wt % of a silver containing layer, preferably a layer of silver or an silver compound.

公开(公告)号：US20140346413A1

公开(公告)日：2014-11-27

申请号：US14372789

申请日：2013-01-15

Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.

Inventor： Kenichi Inoue ,  Kozo Ogi ,  Atsushi Ebara ,  Yuto Hiyama ,  Takahiro Yamada ,  Toshihiko Ueyama

IPC: H01B1/22

CPC classification number: H01B1/22 ,  B22F1/0011 ,  B22F1/0074 ,  B22F1/025 ,  B22F9/082 ,  C22C1/0425 ,  C22C5/06 ,  C22C9/04 ,  C22C9/06 ,  H01B1/026 ,  Y10T428/2991

Abstract: A silver-coated copper alloy powder, which has a low volume resistivity and excellent storage stability (reliability), is produced by coating a copper alloy powder, which has a chemical composition comprising 1 to 50 wt % of at least one of nickel and zinc and the balance being copper and unavoidable impurities (preferably a copper alloy powder wherein a particle diameter (D50 diameter) corresponding to 50% of accumulation in cumulative distribution of the copper alloy powder, which is measured by a laser diffraction particle size analyzer, is 0.1 to 15 μm), with 7 to 50 wt % of a silver containing layer, preferably a layer of silver or an silver compound.

Abstract translation: 通过涂覆铜合金粉末，其具有体积电阻率低和储存稳定性（可靠性）优异的银涂层铜合金粉末，其具有包含镍和锌中的至少一种的1至50重量％的化学组成 余量为铜和不可避免的杂质（优选为通过激光衍射式粒度分析仪测定的铜合金粉末的累积分布中累积分布的50％的粒径（D50直径）为0.1的铜合金粉末为0.1 至15μm），含有7至50wt％的含银层，优选银或银化合物层。