Invention Grant
- Patent Title: Methods for etching a structure for MRAM applications
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Application No.: US16681351Application Date: 2019-11-12
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Publication No.: US11145808B2Publication Date: 2021-10-12
- Inventor: Jong Mun Kim , Minrui Yu , Chando Park , Mang-Mang Ling , Jaesoo Ahn , Chentsau Chris Ying , Srinivas D. Nemani , Mahendra Pakala , Ellie Y. Yieh
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson + Sheridan, LLP
- Main IPC: H01L43/12
- IPC: H01L43/12 ; H01L43/10 ; H01L43/02 ; H01L27/22

Abstract:
Embodiments of the disclosure provide methods and apparatus for fabricating magnetic tunnel junction (MTJ) structures on a substrate for MRAM applications. In one embodiment, a method for forming a magnetic tunnel junction (MTJ) device structure includes performing a patterning process by an ion beam etching process in a processing chamber to pattern a film stack disposed on a substrate, wherein the film stack comprises a reference layer, a tunneling barrier layer and a free layer disposed on the tunneling barrier, and determining an end point for the patterning process.
Public/Granted literature
- US20210143323A1 Methods for etching a structure for MRAM Applications Public/Granted day:2021-05-13
Information query
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