Invention Grant
- Patent Title: Continuous interconnects between heterogeneous materials
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Application No.: US16885854Application Date: 2020-05-28
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Publication No.: US11682615B2Publication Date: 2023-06-20
- Inventor: Mark William Ronay , Jorge E. Carbo, Jr. , Trevor Antonio Rivera , Charles J. Kinzel , Michael Adventure Hopkins , Sai Srinivas Desabathina
- Applicant: Liquid Wire Inc.
- Applicant Address: US OR Beaverton
- Assignee: Liquid Wire Inc.
- Current Assignee: Liquid Wire Inc.
- Current Assignee Address: US OR Portland
- Agency: Schwegman Lundberg & Woessner, P.A.
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L23/498 ; H01L21/48 ; H01L21/56 ; H01L23/31

Abstract:
A structure may include a first material, a second material joined to the first material at a junction between the first and second materials, and one or more media extending across the junction to form a continuous interconnect between the first and second materials, wherein the first and second materials are heterogeneous. The structure may further include a transition at the junction between the first and second materials. The one or more media may include a functional material which may be electrically conductive. The structure may further include a third material joined to the second material at a second junction between the second and third materials, the media may extend across the second junction to form a continuous interconnect between the first, second, and third materials, and the second and third materials may be heterogeneous.
Public/Granted literature
- US20200381349A1 Continuous Interconnects Between Heterogeneous Materials Public/Granted day:2020-12-03
Information query
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