Invention Grant
- Patent Title: Enhanced 3D printed support block
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Application No.: US17808035Application Date: 2022-06-21
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Publication No.: US11785754B2Publication Date: 2023-10-10
- Inventor: Darin Burgess , Randy Crockett , Timothy DeRosett , Charles Santhakumar , Scott Klimczak , Anwar A. Mohammed , Luke Rodgers , Harpuneet Singh , Daniel Torres , Felipe Torres
- Applicant: JABIL INC.
- Applicant Address: US FL St. Petersburg
- Assignee: JABIL INC.
- Current Assignee: JABIL INC.
- Current Assignee Address: US FL St. Petersburg
- Agency: Shumaker, Loop & Kendrick, LLP
- Agent James D. Miller
- Main IPC: B23P19/00
- IPC: B23P19/00 ; H05K13/04 ; H05K13/00 ; B25B11/00 ; B29C64/364 ; B41F15/08 ; B33Y10/00 ; B33Y80/00 ; B41F15/18 ; B41F15/34 ; B41F15/46

Abstract:
Support blocks for printed circuit boards (PCB's) and printed circuit board assemblies (PCBA's), wherein the support blocks are produced from a 3D printing process. The support block including a bottom surface having a vacuum connection; a top surface having at least one vacuum hole; at least one recessed surface that is offset from the top surface; and at least one vacuum channel extending from the vacuum connection to the at least one vacuum hole.
Public/Granted literature
- US20220322587A1 DESIGN ENHANCED 3D PRINTED SUPPORT BLOCK Public/Granted day:2022-10-06
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